Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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A40-LC-TT by Assmann Wsw Components is a DIP40 IC socket with 40 phosphor bronze contacts and polybutylene terephthalate housing. Contacts have tin finish (80) for mating and termination. Ideal for chip carrier ICs, this rectangular contact configuration ensures secure connections in electronic applications.
Median Price
$0.439
Lifecycle Status
Suppliers In-Stock
22
In-Stock Inventory
1k+
Future Electronics
1+ parts
$0.385
100+ parts
$0.375
1k+ parts
$0.360
10k+ parts
$0.345
DigiKey
$1.360
$1.019
$0.877
$0.783
Master Electronics
-
$0.356
$0.311
Verical
$0.459
$0.405
RS (Exports)
$0.369
$0.343
Distrelec
Nova Conductors
$0.363
Component Electronics Inc.
$0.770
$0.580
$0.500
Schukat
$0.367
$0.275
$0.210
Electro Sonic
$0.539
$0.374
$0.301
VNN
IBS Electronics
$0.680
$0.466
Vyrian
SOS electronic
$0.323
$0.307
$0.295
NAC Semi
$0.620
$0.564
First Choice Components Inc.
Holdelec - ElecDif-Pro
LIBRA Elektronik GmbH
Specialty Parts & Electronic Components, Inc. (S.P.E.C.)
Bristol Electronics
Flex Direct, LLC
Prism Electronics
Aranea Global
$0.342
Continental Prestige Electronics
Argo Parts USA
$0.352
Aztec Data Supply Inc.
This material offers good mechanical strength and thermal resistance, ensuring durability and reliability of the chip carrier socket.
Designed specifically for DIP40 devices, providing a secure and stable connection for the integrated circuit.
Phosphor bronze is known for its excellent electrical conductivity and corrosion resistance, ensuring a reliable electrical connection.
Having 40 contacts allows for a wide range of compatibility with different integrated circuits, making it versatile and practical.
The tin mating finish provides a high level of conductivity and ensures a secure connection between the socket and the IC, reducing the risk of signal loss or interference.
Tin termination finish provides a reliable and durable connection between the socket and the circuit board, ensuring long-term performance.
Being specifically designed as an IC socket, it is optimized for integrated circuit applications, providing a reliable and secure platform for the IC.
The rectangular contact configuration offers a secure fit for the integrated circuit, ensuring proper alignment and connectivity for optimal performance.
Chip Carrier IC & Component Sockets A40-LC-TT attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Assmann Wsw Components
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
A40-LC-TT Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
The ASSMANN WSW Group is well known as a global system provider for standard and customer-tailored connectors, cable assemblies, heat sinks and assembly services. The ASSMANN WSW Group has more than 50 years of experience in the electromechanical and the thermal management market. The products are available internationally through a global distribution network. The products of the ASSMANN WSW Group are used in both the industrial and automotive sectors. The BCS Group GmbH, as 100% owner of the ASSMANN WSW Group, has mainly produced cable assemblies and lighting technology for the automotive industry since 1993.
2N7002
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
2N2222A
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
Rectron
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
Daco Semiconductor
EU2B-YS3203F
Idec
ROTARY SWITCH;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
1-1437539-6
TE Connectivity's 1-1437539-6 is a DIP14 IC socket with 14 contacts, rated at 3A current. It features a PCB contact row spacing of 7.75mm and rectangular contact pattern, suitable for applications requiring a mating pitch of 0.1 inch. The socket has a temperature range from -55°C to 105°C, making it ideal for various electronic devices.
1-1904045-1
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; No. of Contacts: 5;
1393162-5
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; No. of Contacts: 15; Contact Material: NOT APPLICABLE;
8452-21B1-RK-TP
3m Electronic Products Division
8452-21B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with a housing made of glass-filled polyphenylene sulfide. It is used on PLCC52 devices and has a surface mount termination type. With 52 contacts and insulation resistance of 1G ohm, it operates in temperatures ranging from -40 to 105 °C.
316-43-144-41-008000
Mill-max Mfg
The Mill-max Mfg 316-43-144-41-008000 is a PLASTIC IC SOCKET for SIP44 devices with 44 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
390261-6
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
203-2737-55-1102
203-2737-55-1102 by 3M Electronic Products Division is a chip carrier IC socket with POLYPHENYLENE SULFIDE housing and BERYLLIUM COPPER contacts. It features 3 gold-over-nickel contacts for mating and termination. Ideal for electronic applications requiring reliable connections in IC sockets.
2-1571552-3
TE Connectivity's 2-1571552-3 is a Chip Carrier IC Socket with PCB contact row spacing of 7.62mm and rectangular pattern. Made of thermoplastic polyester, it has 14 contacts, operates b/w -55°C to 105°C, and supports devices like DIP14. With solder termination, it offers a current rating of 3A and dielectric voltage withstand of 1400VAC.
1-2199298-2
TE Connectivity 1-2199298-2 is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features glass-filled PBT housing material, solder termination, and operates b/w -40°C to 105°C. Ideal for applications requiring a mating pitch of 0.1 inch in straight mounting style.
1-1437504-9
TE Connectivity 1-1437504-9 is a FLUOROPOLYMER Chip Carrier IC Socket for TO-5 devices. With 3 solder contacts, it supports up to 3A current rating. Operating b/w -55°C to 125°C, it's ideal for high-temp applications in various industries.
110-87-314-41-001101
Preci-dip Sa
110-87-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts and 7.62mm PCB row spacing. It features Beryllium Copper contact material, Gold Flash finish, and POLYESTER housing material. Ideal for applications requiring a current rating of 1A, dielectric voltage of 1400VAC, and operating temperatures from -55 to 125°C.
326-93-101-41-003000
Mill-max Mfg's 326-93-101-41-003000 is a PLASTIC IC SOCKET for SIP1 devices. Features GOLD (30) OVER NICKEL (100) contact finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets with RECTANGLE contact config.
P7S-14F
Omron
RELAY SOCKET; No. of Contacts: 14;
8134-HC-5P3
Augat
IC SOCKET; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Rating (Current): 5 A; Termination Type: PRESS FIT; No. of Contacts: 1;
326-93-103-41-003000
Mill-max Mfg's 326-93-103-41-003000 is a PLASTIC IC SOCKET for SIP3 devices with 3 contacts. Features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
1825575-2
TE Connectivity's 1825575-2 is a Chip Carrier IC Socket with 8 contacts, BE-CU material, and SN finish. It has a PCB contact row spacing of 17.78mm and mating pitch of 0.1 inch, suitable for DIP8 devices. Ideal for surface mount applications in electronics, it operates b/w -55°C to 125°C with a current rating of 1A.
27E046
IC SOCKET; Housing Material: NYLON; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Termination Type: SOLDER;
110-41-640-41-001000
Mill-max Mfg's 110-41-640-41-001000 is a POLYETHYLENE IC SOCKET for DIP40 devices with 40 contacts. Features MATTE TIN OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
2-1571586-9
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
214-44-314-01-670799
214-44-314-01-670799 by Mill-max Mfg is a NYLON46 chip carrier IC socket with 14 contacts, TIN finish. It is designed for DIP14 devices, featuring a rectangular contact configuration. Ideal for electronic applications requiring reliable and durable connections in integrated circuits.
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A40-LC-TR
Assmann Wsw Components
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 500VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
Supply Digital Components
$106.00
$54.25
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12,000 In-Stock
Total price ≈ $80,197.29
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