Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
214-44-316-01-670799 by Mill-max Mfg is a NYLON46 chip carrier IC socket for DIP16 devices with 16 contacts. It features TIN contact finish, RECTANGLE contact configuration, and is ideal for various electronic applications.
Median Price
$4.112
Lifecycle Status
Suppliers In-Stock
5
In-Stock Inventory
1k+
Heilind Electronics
1+ parts
-
100+ parts
1k+ parts
$4.169
10k+ parts
$2.892
Interstate Connecting
$4.056
$2.862
Nova Conductors
$3.708
Vyrian
VNN
Ampacity Inc.
$3.540
Semicontronic
$3.452
$3.434
Bastille Electronics
$3.523
$3.346
$3.300
Argo Parts USA
Continental Prestige Electronics
$3.634
AZTECH Wire
$21.300
Aztec Data Supply Inc.
Nylon46 is a sturdy and durable material, making this product long-lasting and capable of withstanding various environmental conditions.
Designed specifically for DIP16 devices, ensuring a perfect fit and secure connection, reducing the chance of signal interference or loss.
With 16 contacts, this product can accommodate a wide range of integrated circuits, offering versatility and compatibility with different devices.
Tin contact finish provides excellent conductivity and corrosion resistance, ensuring reliable and consistent electrical connections.
Designed as an IC socket, this product allows for easy insertion and removal of integrated circuits, making it convenient for testing and replacement.
Rectangular contact configuration ensures a secure and stable connection between the IC and the socket, reducing the risk of signal loss or interruption.
Chip Carrier IC & Component Sockets 214-44-316-01-670799 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
214-44-316-01-670799 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
2N7002
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Central Semiconductor
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
Diodes Incorporated
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
Crimson Semiconductor
LAN8720A-CP-TR
Microchip Technology
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
CQF024-165B
Texas Instruments
IC SOCKET; Device Type Used On: QFP24; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 24; Manufacturer Series: CQF;
PY14-02
Omron
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Termination): NOT APPLICABLE;
1-1437539-7
TE Connectivity
TE Connectivity 1-1437539-7 is a DIP14 IC SOCKET with 14 contacts, rated at 3A current. It has a PCB contact row spacing of 7.49mm and uses solder termination. This chip carrier socket is commonly used in applications requiring a mating contact pitch of 0.1 inch and operates within -55 to 105°C temperature range.
XR3G-4201
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
XR2A-3201-N
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; No. of Contacts: 32; Contact Finish (Mating): NOT SPECIFIED;
XR2A-2476
IC SOCKET; Manufacturer Series: XR2;
D2818-42
Harwin Plc
D2818-42 by Harwin PLC is a Chip Carrier IC Socket with 18 contacts, rated for 1A current. Made of plastic, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for DIP18 devices, this socket features solder termination and round pin contact style.
8-1415546-2
RELAY SOCKET;
08-3518-10H
Aries Electronics
Aries Electronics 08-3518-10H is a DIP18 IC socket with 8 brass contacts, gold finish, and solder termination. It has a 7.62mm PCB contact row spacing and rectangular pattern for applications requiring a current rating of 3A at up to 105°C operating temperature.
PT11QN
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE;
XR3G-6411
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4;
P2R-05P
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 5; Contact Finish (Termination): NOT APPLICABLE;
169-PRS13001-16
Aries Electronics 169-PRS13001-16 is a PGA169 IC socket with 169 contacts, made of POLYPHENYLENE SULPHIDE. It has a contact pitch of 0.1" and operates b/w -65°C to 200°C. Ideal for chip carrier ICs, it features solder termination and a rectangular PCB contact pattern.
XR2A-2025
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
22-1508-30
Aries Electronics 22-1508-30 is a DIP32 IC socket with 22 contacts, rated at 3A current. It features wire wrap termination, gold finish over nickel mating contact, and nylon46 housing material. Used for chip carrier components on PCBs with rectangular contact pattern and 2.54mm pitch row spacing.
XR2E-3204
IC SOCKET; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
XR2A-4215
2227MC-16-03-09-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYBUTYLENE TEREPHTHALATE; Additional Features: STANDARD: UL94-0; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
ICA-203-S-TG30
3m Electronic Products Division
ICA-203-S-TG30 by 3M EPD is a DIP20 IC socket with 20 contacts, rated at 1A current. Featuring gold over nickel contact finish, it has a body length of 0.995" and operates b/w -65°C to 125°C. Ideal for chip carrier ICs, its rectangular PCB pattern with 7.62mm row spacing suits various applications requiring reliable connections.
20-351000-11-RC
20-351000-11-RC by Aries Electronics is a 20-contact IC socket with brass contacts. It features gold over nickel contact finish for mating and termination. This chip carrier socket is designed for SSOP20-DIP20 devices, ensuring reliable connections in electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
214-44-314-01-670800
Mill-max Mfg
214-44-314-01-670800 by Mill-max Mfg is a Chip Carrier IC Socket with NYLON46 housing. It features 14 contacts with MATTE TIN OVER NICKEL finish, designed for DIP14 devices. Ideal for applications requiring rectangular contact configuration in electronic assemblies.
214-44-316-01-670800
214-44-316-01-670800 by Mill-max Mfg is a NYLON46 chip carrier IC socket for DIP16 devices with 16 contacts and matte tin finish. It features a rectangular contact configuration, ideal for secure connections in electronic applications like PCBs and integrated circuits.
214-44-308-01-670800
214-44-308-01-670800 by Mill-max Mfg is a Chip Carrier IC Socket with NYLON46 housing material and MATTE TIN finish. It is designed for DIP8 devices, featuring 8 contacts in RECTANGLE configuration. Ideal for secure connection of integrated circuits in various electronic applications.
214-44-318-01-670800
IC SOCKET; Device Type Used On: DIP18; Housing Material: NYLON46; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE; Contact Finish (Termination): MATTE TIN;
214-44-314-01-670799
214-44-314-01-670799 by Mill-max Mfg is a NYLON46 chip carrier IC socket with 14 contacts, TIN finish. It is designed for DIP14 devices, featuring a rectangular contact configuration. Ideal for electronic applications requiring reliable and durable connections in integrated circuits.
214-44-308-01-670799
214-44-308-01-670799 by Mill-max Mfg is a NYLON46 IC SOCKET for DIP8 devices with 8 contacts. It features MATTE TIN OVER NICKEL finish, ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
214-44-320-01-670800
IC SOCKET; Device Type Used On: DIP20; Housing Material: NYLON46; No. of Contacts: 20; JESD-609 Code: e3; Contact Finish (Termination): TIN;
214-44-306-01-670799
IC SOCKET; Device Type Used On: DIP6; Housing Material: NYLON46; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Additional Features: DIP SOCKET;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved