Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Aries Electronics 08-3518-10T is a DIP18 IC socket with NYLON46 housing and BRASS contacts. Featuring 8 gold-plated contacts, it has TIN over NICKEL termination. Ideal for chip carrier applications, providing reliable connections in electronic devices.
Median Price
$0.930
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1k+
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Nylon46 housing material provides high strength, durability, and heat resistance, making it suitable for long-term use and protection of the internal components.
Designed specifically for DIP18 devices, ensuring a secure and reliable connection with the integrated circuit.
Brass contact material offers excellent conductivity and corrosion resistance, ensuring stable and efficient signal transmission.
With 8 contacts, this chip carrier IC socket provides ample connections for various components, allowing for flexibility and compatibility with different devices.
Gold and nickel finish on the contacts ensures a low contact resistance, high reliability, and resistance to tarnishing, providing a stable and consistent connection.
Tin over nickel termination provides a durable and corrosion-resistant finish for the socket contacts, ensuring longevity and consistent performance.
This IC socket type is specifically designed to securely hold and make contact with integrated circuits, ensuring stability and ease of installation and removal.
Chip Carrier IC & Component Sockets 08-3518-10T attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Aries Electronics
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Product Series:
Special Features:
08-3518-10T Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
LM317LMX/NOPB
Texas Instruments
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
Sensitron Semiconductor
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
ULN2803ADWG4
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
Vishay Semiconductors
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1552200253
Molex
WIRE AND CABLE;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
XR2A-4815
Omron
IC SOCKET; Manufacturer Series: XR2;
08-3518-10H
Aries Electronics
Aries Electronics 08-3518-10H is a DIP18 IC socket with 8 brass contacts, gold finish, and solder termination. It has a 7.62mm PCB contact row spacing and rectangular pattern for applications requiring a current rating of 3A at up to 105°C operating temperature.
PT14
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Contact Finish (Termination): NOT APPLICABLE;
110-13-628-41-001000
Mill-max Mfg
110-13-628-41-001000 by Mill-max Mfg is a PCT POLYESTER Chip Carrier IC Socket for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for electronic applications requiring reliable connections in integrated circuits.
1-1437508-3
TE Connectivity
TRANSISTOR SOCKET; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT APPLICABLE;
214-44-316-01-670800
214-44-316-01-670800 by Mill-max Mfg is a NYLON46 chip carrier IC socket for DIP16 devices with 16 contacts and matte tin finish. It features a rectangular contact configuration, ideal for secure connections in electronic applications like PCBs and integrated circuits.
XR2A-2472
IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A;
XR2T-2473-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
PTF14A
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Material: NOT SPECIFIED;
1-1393824-0
IC SOCKET; Housing Material: POLYCARBONATE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
510-93-169-17-101003
Mill-max Mfg's 510-93-169-17-101003 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier IC applications.
XR2A-4221-N
XR2T-2411-N
IC SOCKET; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Manufacturer Series: XR2T;
XR2A-2025
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
111-47-324-41-001000
IC SOCKET; Device Type Used On: DIP24; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
HLT-1712-G-R
Samtec
The Samtec HLT-1712-G-R is a plastic IC socket with 204 brass contacts. It features gold over nickel contact finish for mating and termination. Designed for use on PGA204 devices, this chip carrier socket is ideal for high-performance electronic applications.
95.63
Finder
Finder's 95.63 is a RELAY SOCKET with 5 contacts, rated at 10A current. It has a dielectric voltage of 6000VDC and operates b/w -40°C to 70°C. The socket uses SCREW termination, measures 2.677" x 0.61" x 1.398", and mounts in STRAIGHT style for Chip Carrier IC applications.
XR2A-6405
SH3B-05C
Idec
SH3B-05C by Idec is a Chip Carrier IC Socket with 3 contacts, rated for 10A current. It is used on relays with screw termination and straight mounting style. This socket has a body size of 2.716" x 1.181" x 1.161", making it suitable for various relay applications.
8134-HC-5P3
TE Connectivity's 8134-HC-5P3 is a Chip Carrier IC Socket with -65 to 125°C temp range, PRESS FIT termination, and 5A current rating. Ideal for straight mounting applications in electronic devices requiring reliable IC connections.
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08-350000-11-RC
IC SOCKET; Device Type Used On: SOIC8-DIP8; Contact Finish (Mating): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED; Additional Features: SOCKET ADAPTER; No. of Contacts: 8;
08-3518-10
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Minimum Operating Temperature: -55 Cel;
08-3518-10E
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Contact Material: BRASS;
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Rating (Current): 3 A;
08-3518-10M
The Aries Electronics 08-3518-10M is a chip carrier IC socket with a rectangular PCB contact pattern and a 7.62mm row spacing. It is used for DIP18 devices, has 8 contacts, and can handle a current rating of 3A. Its housing material is nylon46 and it has a max operating temperature of 105°C.
08-3501-20WR
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Housing Material: NYLON46; Contact Finish (Mating): SN-PB ON NI;
08-3501-30WR
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Housing Material: NYLON46; JESD-609 Code: e3;
08-3503-20
IC SOCKET; Device Type Used On: DIP18; Housing Material: NYLON46; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; No. of Contacts: 8; Contact Finish (Mating): GOLD (30) OVER NICKEL;
08-3503-30
IC SOCKET; Device Type Used On: DIP18; Housing Material: NYLON46; JESD-609 Code: e3; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
08-3518-00
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Contact Finish (Mating): GOLD (10) OVER NICKEL (50);
08-3518-01
IC SOCKET; Device Type Used On: DIP18; Housing Material: NYLON46; Contact Material: BRASS; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
08-3513-10
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Body Depth: .165 inch;
08-3513-11
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Maximum Operating Temperature: 125 Cel;
08-3518-11E
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Mating Contact Pitch (inch): 0.1;
08-3518-11H
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; No. of Contacts: 8;
08-3518-11T
IC SOCKET; Device Type Used On: DIP18; Housing Material: NYLON46; Contact Material: BRASS; Contact Finish (Mating): GOLD (10) OVER NICKEL (50); Contact Finish (Termination): GOLD OVER NICKEL;
08-3518-11
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; PCB Contact Pattern: RECTANGULAR;
Supply Digital Components
$106.00
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