Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Aries Electronics 08-3518-10 is a DIP8 IC socket with 0.1" contact pitch, suitable for surface mount termination. It features brass contacts with gold finish, rated at 3A current. Ideal for applications requiring chip carrier sockets on PCBs with rectangular contact pattern and 7.62mm row spacing.
Median Price
$1.255
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27
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1k+
Element14
1+ parts
$1.150
100+ parts
$0.826
1k+ parts
$0.754
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DigiKey
$1.360
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Farnell
$1.690
$1.040
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Newark
$1.930
$1.190
$0.898
$0.812
Mouser Electronics
$1.140
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$0.770
Master Electronics
$0.689
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Verical
$1.430
Powell Electronics
$0.880
Vyrian
Electro Sonic
$0.609
$0.525
$0.428
Semtec, LLC
IBS Electronics
$0.611
$0.585
$0.526
Nova Conductors
Bristol Electronics
Atlantic Semiconductor
Prism Electronics
Electronics Depot
Electronic Expediters
Beckwith Electronics
First Choice Components Inc.
Sensible Micro Corp
QIE Inc.
Defense Contract Solutions
Microfarads
A2Z Electronics, Inc.
Resion
Elcom Components
Perfect Parts
Continental Prestige Electronics
Aztec Data Supply Inc.
Argo Parts USA
Aranea Global
Optimal spacing of PCB contacts allows for secure and reliable connections within the device.
Nylon46 housing material provides durability and heat resistance, ensuring the longevity of the product.
Wide range of operating temperature allows for use in various environments, including extreme cold conditions.
Brass contact material offers high conductivity and corrosion resistance, leading to reliable signal transmission.
Sufficient number of contacts for connecting the device effectively.
A high current rating of 3A allows for the device to handle heavy loads without overheating or damaging the contacts.
The tin finish with nickel barrier provides protection against corrosion and ensures a secure termination point for the contacts.
The high maximum operating temperature means that the product can withstand elevated temperatures without affecting its performance.
Chip Carrier IC & Component Sockets 08-3518-10 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Aries Electronics
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08-3518-10 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
LM555CMX
Texas Instruments
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
MMSZ5245BT1G
Onsemi
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
Continental Device India
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NXP Semiconductors
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
Lite-on Semiconductor
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MICRODIODE ELECTRONICS SHENZHEN CO LTD
Itt Semiconductor
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803ADWRG4
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
ICA-203-S-TG30
3m Electronic Products Division
ICA-203-S-TG30 by 3M EPD is a DIP20 IC socket with 20 contacts, rated at 1A current. Featuring gold over nickel contact finish, it has a body length of 0.995" and operates b/w -65°C to 125°C. Ideal for chip carrier ICs, its rectangular PCB pattern with 7.62mm row spacing suits various applications requiring reliable connections.
9-1437514-4
TE Connectivity 9-1437514-4 is a Chip Carrier IC Socket with 7.62mm PCB contact spacing, -55 to 105°C temp range, and 3A current rating. Ideal for PRESS FIT termination in electronic applications requiring high insulation resistance and precise mating contact pitch of 0.1 inch.
27E152
TE Connectivity's 27E152 is a RECTANGULAR Chip Carrier IC Socket with POLYESTER housing. It has 16 BLADE PIN-SKT contacts, rated for 10A current on RELAY devices. With 1400VAC dielectric voltage and high insulation resistance, it is ideal for straight mounting on PCBs.
28-C182-10
Aries Electronics
28-C182-10 by Aries Electronics is a DIP28 IC socket with 28 contacts, made of brass with gold finish. It has a PCB contact row spacing of 15.24mm and operates b/w -55°C to 105°C. Ideal for applications requiring a chip carrier socket with high insulation resistance and dielectric voltage withstand capability.
PGA-280
Robinson Nugent
IC SOCKET; Device Type Used On: PGA280; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 280; Manufacturer Series: PGA;
614-91-964-31-012000
Mill-max Mfg
IC SOCKET;
XR2A-3225
Omron
IC SOCKET; Manufacturer Series: XR2;
HLT-0919-G-R
Samtec
Samtec's HLT-0919-G-R is a plastic chip carrier socket with 171 brass contacts. It features gold over nickel contact finish for mating and termination, suitable for PGA171 devices. This IC socket type is ideal for high-performance applications requiring reliable connections.
4-1571551-9
IC SOCKET; Device Type Used On: DIP28; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-THERMOPLASTIC POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 28;
4828-6000-CP
The 3m Electronic Products Division's 4828-6000-CP is a Chip Carrier IC Socket with 28 contacts, made of Glass Filled Polyester. It has a PCB contact row spacing of 15.24mm and operates b/w -25°C to 85°C. Ideal for DIP28 devices, it features solder termination and a mating contact pitch of 0.1 inch.
SIM-AMS2-R
Phoenix Contact
RELAY SOCKET;
P2CF-08
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
M12883/52-001
Esterline Technologies
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; No. of Contacts: 8; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
ICF-640-S-O
Samtec's ICF-640-S-O is a Chip Carrier IC Socket with 40 contacts, featuring Beryllium Copper pins and Liquid Crystal Polymer housing. It has a contact pitch of 0.1", suitable for DIP40 devices, with operating temperatures ranging from -55 to 125°C. Ideal for surface mount applications in electronics requiring high insulation resistance and dielectric voltage withstand capabilities.
150-80-324-00-018101
Preci-dip Sa
150-80-324-00-018101 by Preci-dip Sa is a DIP24 IC socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing material and BRASS contact material. It has 24 contacts with TIN mating finish and Tin (Sn) termination finish. This IC socket is commonly used for chip carrier applications.
390261-6
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
P2RF-08-S
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6;
CQF100-158A
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 100;
PYFZ-14-E
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
M12883/40-01
Amphenol
RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; No. of Contacts: 14; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
08-350000-11-RC
IC SOCKET; Device Type Used On: SOIC8-DIP8; Contact Finish (Mating): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED; Additional Features: SOCKET ADAPTER; No. of Contacts: 8;
08-3518-10E
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Contact Material: BRASS;
08-3518-10H
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Rating (Current): 3 A;
08-3518-10M
The Aries Electronics 08-3518-10M is a chip carrier IC socket with a rectangular PCB contact pattern and a 7.62mm row spacing. It is used for DIP18 devices, has 8 contacts, and can handle a current rating of 3A. Its housing material is nylon46 and it has a max operating temperature of 105°C.
08-3518-10T
IC SOCKET; Device Type Used On: DIP18; Housing Material: NYLON46; Contact Finish (Termination): TIN OVER NICKEL; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): GOLD (10) OVER NICKEL (50);
08-3513-10V0
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON; PCB Contact Row Spacing (mm): 7.62;
08-3518-00
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Contact Finish (Mating): GOLD (10) OVER NICKEL (50);
08-3513-10H
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYAMIDE46; Maximum Operating Temperature: 125 Cel;
08-3513-10T
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYAMIDE46; Contact Material: BRASS;
08-3513-10
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Body Depth: .165 inch;
08-3513-11H
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYAMIDE46; Contact Finish (Mating): GOLD (10) OVER NICKEL (50);
08-3513-11
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Maximum Operating Temperature: 125 Cel;
08-3518-11E
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Mating Contact Pitch (inch): 0.1;
08-3518-11H
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; No. of Contacts: 8;
08-3518-11
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; PCB Contact Pattern: RECTANGULAR;
08-3513-10HV0
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYAMIDE; Mating Contact Pitch (inch): 0.1;
08-3513-10TL
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; PCB Contact Row Spacing (mm): 7.62;
Supply Digital Components
$106.00
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