Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's 3-1571552-2 is a Chip Carrier IC Socket with 40 contacts, rated at 3A current. It has a PCB contact row spacing of 15.24mm and uses POLYETHYLENE/POLYESTER housing material. Ideal for DIP40 devices, it operates b/w -55 to 105°C and features solder termination for reliable connections.
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Authorized Procurement Solutions
EMSNET (Excess)
Cyclops Electronics Ltd (Excess)
Glotronic Ltd.
GreenTree Electronics
The close spacing allows for efficient use of PCB real estate and enables compact designs.
Polyethylene/polyester housing provides excellent durability and protection for the IC socket.
Solder termination ensures a secure and reliable connection between the IC socket and the PCB.
Having 40 contacts allows for versatile connectivity options and compatibility with a wide range of ICs.
High insulation resistance ensures minimal signal loss and interference, leading to reliable performance.
With a current rating of 3A, this IC socket can handle moderate power requirements effectively.
This specific IC socket type is designed for DIP40 devices, ensuring a secure fit and reliable connection.
The high maximum operating temperature range makes this IC socket suitable for a variety of operating environments.
Chip Carrier IC & Component Sockets 3-1571552-2 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
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3-1571552-2 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LIS3DHTR
STMicroelectronics
LIS3DHTR by STMicroelectronics is a 16-terminal accelerometer with output range of 0.18-1.62V, ideal for motion sensing applications. Operating temperature ranges from -40 to 85°C, making it suitable for various environments. With a compact square package body of 3x3mm and digital voltage output type, it is commonly used in surface mount designs.
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRM140T1G
Onsemi
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
First Components International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Comchip Technology
1N4148W-T
Micro Commercial Components
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
LM358N
Samsung
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
Won-top Electronics
150-10-324-00-018101
Preci-dip Sa
150-10-324-00-018101 by Preci-dip Sa is a DIP24 IC socket with 24 brass contacts and gold finish. Its housing material is POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications, this socket offers reliable connectivity and durability in electronic devices.
PT14QN
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2T-2801-N
IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER;
D01-9922046
Harwin Plc
IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYAMIDE46; No. of Contacts: 20; Contact Material: NOT APPLICABLE; Additional Features: 94V-0;
3334485008
Robert Bosch
RELAY SOCKET; Device Type Used On: RELAY; Mounting Style: STRAIGHT; Body Width: 1.417 inch; No. of Contacts: 5; Body Depth: 1.433 inch;
XR2B-2811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2;
342-10-139-00-594000
Mill-max Mfg
Mill-max Mfg's 342-10-139-00-594000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
110-83-316-41-801101
110-83-316-41-801101 by Preci-dip Sa is a DIP16 IC socket with 16 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and mating contact pitch of 0.1 inch, suitable for chip carrier applications. With solder termination and body dimensions of 0.799" length, 0.398" width, and 0.165" depth, it operates b/w -25°C to 85°C temperature range.
110-43-628-41-001000
110-43-628-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material, 28 contacts, and Matte Tin over Nickel termination. It is designed for use on DIP28 devices, featuring a rectangular contact configuration suitable for various electronic applications.
508-AG11D-ES
Abb Installation Products
IC SOCKET; Device Type Used On: DIP8; Housing Material: THERMOPLASTIC POLYESTER; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 8; Manufacturer Series: 500;
XR2A-2825
IC SOCKET; Manufacturer Series: XR2;
116-43-314-41-008000
116-43-314-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP14 devices with 14 contacts. Featuring MATTE TIN OVER NICKEL finish, it is ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
390261-2
TE Connectivity
TE Connectivity's 390261-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing and rectangular contact pattern. It features glass-filled PBT housing, solder termination, and leaf contact style. Ideal for applications requiring a 1A current rating, it operates b/w -40°C to 105°C with a dielectric voltage of 1000VAC.
XR2D-2001-N
IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
XR2D-1404
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30);
1-2199298-4
TE Connectivity's 1-2199298-4 is a Chip Carrier IC Socket with 16 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It is used on DIP16 devices for solder termination applications in electronics, offering a current rating of 1A and operating temperatures from -40 to 105°C.
PLCC-044-T-N
Samtec
Samtec's PLCC-044-T-N is a Chip Carrier IC Socket with LIQUID CRYSTAL POLYMER housing. Featuring 44 contacts, it has a -55 to 105 °C operating range and Matte Tin (Sn) finish. Ideal for PLCC44 devices, this surface mount socket is bellowed type with 11x11 contact configuration.
XR2A-2472
IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A;
8428-11B1-RK-TP
3m Electronic Products Division
8428-11B1-RK-TP by 3M is a PLCC28 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring bellowed contacts, it has 28 contacts and operates b/w -40°C to 105°C. Ideal for applications requiring high insulation resistance and solder termination in straight mounting style.
416-91-216-41-003000
IC SOCKET; Contact Finish (Termination): TIN LEAD; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
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3-1571552-0
TE Connectivity's 3-1571552-0 is a chip carrier IC socket with 32 contacts and a rectangular PCB contact pattern. It has a body length of 1.6 inches, a body width of 0.7 inches, and a body depth of 0.105 inches. This socket is commonly used on DIP32 devices and can withstand temperatures ranging from -55 to 105°C.
3-1571550-0
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
3-1571550-2
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
3-1571552-6
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYETHYLENE/POLYESTER;
3-1571586-0
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: THERMOPLASTIC;
3-1571586-2
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-THERMOPLASTIC POLYESTER;
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