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1825575-2

TE Connectivity

1825575-2 by TE Connectivity

TE Connectivity's 1825575-2 is a Chip Carrier IC Socket with 8 contacts, BE-CU material, and SN finish. It has a PCB contact row spacing of 17.78mm and mating pitch of 0.1 inch, suitable for DIP8 devices. Ideal for surface mount applications in electronics, it operates b/w -55°C to 125°C with a current rating of 1A.

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AZTECH Wire

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Semicontronic

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Bastille Electronics

Australia . 3,562 parts In-Stock

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Continental Prestige Electronics

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Assy Fe

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Aztec Data Supply Inc.

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Overview

Enhance the performance of your electrical components with the TE Connectivity 1825575-2 chip carrier IC & component socket. Crafted by a trusted manufacturer, this socket offers top-notch quality and reliability. Ideal for DIP8 devices, it boasts a surface mount termination type and a mating contact pitch of 0.1 inches. With a current rating of 1A and a dielectric-withstanding voltage of 1400VAC, this socket ensures secure and efficient connections. Upgrade your PCB layouts with ease and precision using this high-quality IC socket from TE Connectivity.

Feature Benefit Bullets

PCB Contact Row Spacing (mm): 17.78

The tight spacing allows for efficient use of space on the PCB, making it a suitable choice for compact electronic devices.

Device Type Used On: DIP8

Compatible with DIP8 devices, ensuring proper fit and functionality.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions, making it suitable for a wide range of environments.

Termination Type: SURFACE MOUNT

Surface mount termination offers secure and reliable connections to the PCB.

No. of Contacts: 8

With 8 contacts, this chip carrier socket is suitable for various applications requiring multiple connections.

Insulation Resistance: 10000000000 ohm

High insulation resistance ensures reliable performance and prevents short circuits.

Contact Finish (Mating): SN

SN finish provides a durable and reliable mating surface for optimum connectivity.

Mounting Style: STRAIGHT

Straight mounting style facilitates easy installation on the PCB.

Rating (Current): 1 A

With a current rating of 1A, this socket can handle moderate current levels.

Dielectric Withstanding Voltage (V): 1400VAC

High dielectric voltage rating ensures safe operation and protection against electrical breakdown.

Maximum Operating Temperature: 125 °C

Operates efficiently in high-temperature environments, offering reliable performance under various conditions.

Technical Specifications

Chip Carrier IC & Component Sockets 1825575-2 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity

Connectivity

Number of Positions or Pins:

8

Contact Finish - Mating:

Tin

Contact Material:

Beryllium Copper

Contact Style:

Installation Type:

Surface Mount

Mating Contact Pitch:

0.1 in (2.54 mm)

PCB Contact Row Spacing:

0.7 in (17.78 mm)

Terminal Pitch:

0.1 in (2.54 mm)

Mounting Style:

PCB Contact Layout:

Rectangular

Physical Characteristics

IC Socket Type:

Length:

0.398 in (10.109 mm)

Depth:

0.22 in (5.588 mm)

Electrical Characteristics

Current Rating:

1 A

Dielectric Withstanding Voltage:

Insulation Resistance:

10 GΩ

Thermal Characteristics

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Compatibility

Compatible Device Type:

Product Series:

1825575

Trade Compliance

1825575-2 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

PCN

Manufacturer Highlights

TE Connectivity

TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Terrence R. Curtin

Executive VP, CFO

Heath A. Mitts

Senior VP, Principal Accounting Officer

Robert J. Ott

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