Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Samtec APH-1016-T-T is a Chip Carrier IC Socket with 16 contacts made of brass and tin over nickel finish. It features a polyethylene housing material, suitable for DIP16 devices. Ideal for applications requiring reliable rectangular contact configuration in IC sockets.
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Nova Conductors
Argo Parts USA
Netroflash
Continental Prestige Electronics
Polyethylene is a durable and light-weight material, providing protection and ease of handling for the chip carrier IC.
Designed specifically for DIP16 devices, ensuring a precise and secure fit for the integrated circuit.
Brass is a reliable and conductive material, ensuring good electrical connectivity for the socket.
With 16 contacts, this socket can accommodate a wide range of integrated circuit chips, making it versatile for different applications.
The tin over nickel finish provides both corrosion resistance and good conductivity for reliable connections.
The tin with nickel barrier termination ensures long-term stability and durability for the socket contacts.
Being an IC socket, this product allows for easy insertion and removal of the integrated circuit chip, facilitating maintenance and upgrades.
The rectangular contact configuration ensures proper alignment and secure connection between the socket and the integrated circuit chip.
Chip Carrier IC & Component Sockets APH-1016-T-T attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
APH-1016-T-T Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
LM317T
Texas Instruments
LM317T by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. Operating temperature ranges from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. With a max output current of 1.5A, this through-hole package regulator is ideal for power supply designs where adjustable voltage levels are needed.
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT-7
Diodes Incorporated
1N4148WT-7 by Diodes Inc. is a fast recovery rectifier diode with a max reverse recovery time of 0.004 us and a max forward voltage of 1.25 V. It has a package style of small outline, making it suitable for surface mount applications where high-speed switching is required at temperatures ranging from -65 to 150 °C.
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
BAV99
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
MICRODIODE ELECTRONICS SHENZHEN CO LTD
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Semiconductors
1N4148
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Souriau
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Body or Shell Style: RECEPTACLE; MIL Conformity: YES;
1N4148WS
Vishay Semiconductors
Baneasa S A
LD1117S33TR
STMicroelectronics
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
PTF08A
Omron
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
8428-11B1-RK-TP
3m Electronic Products Division
8428-11B1-RK-TP by 3M is a PLCC28 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring bellowed contacts, it has 28 contacts and operates b/w -40°C to 105°C. Ideal for applications requiring high insulation resistance and solder termination in straight mounting style.
115-87-624-41-003101
Preci-dip Sa
115-87-624-41-003101 by Preci-dip Sa is a DIP24 IC socket with 24 contacts. It features Beryllium Copper contact material, Gold Flash mating finish, and Tin termination finish. Ideal for chip carrier IC applications due to its PCT Polyester housing material.
69802-432LF
Amphenol Communications Solutions
Amphenol's 69802-432LF is a PLCC32 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 32 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. With surface mount termination and high insulation resistance, it is ideal for chip carrier applications.
2-1571552-2
TE Connectivity's 2-1571552-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, RECTANGULAR pattern, and THERMOPLASTIC POLYESTER housing. It has 8 contacts, -55 to 105°C operating temp range, and 3A current rating. Ideal for applications requiring reliable solder termination in electronic circuits.
115-47-636-41-001000
Mill-max Mfg
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
510-93-169-17-101003
Mill-max Mfg's 510-93-169-17-101003 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier IC applications.
110-93-628-41-801000
110-93-628-41-801000 by Mill-max Mfg is a Chip Carrier IC Socket with 28 contacts. It features Gold over Nickel contact finish for mating and Tin/Lead with Nickel barrier for termination. Ideal for DIP28 devices, this plastic housing socket is designed for rectangular contact configuration.
28-3508-311
Aries Electronics
Aries Electronics 28-3508-311 is a DIP28 IC socket with 28 contacts, featuring rectangular PCB contact pattern spaced at 7.62mm. It uses wire wrap termination and has a body size of 1.4" x 0.7" x 0.19". Ideal for applications requiring reliable connections in electronic circuits.
3-822472-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: PLCC32; Housing Material: PLASTIC; Manufacturer Series: 822472; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): TIN LEAD;
510-93-169-17-101001
The Mill-max Mfg 510-93-169-17-101001 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. The housing material is POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, making it ideal for chip carrier IC applications.
PLCC-084-TM-N-TR
Samtec
Samtec's PLCC-084-TM-N-TR is a Chip Carrier IC Socket with 84 contacts. It features LIQUID CRYSTAL POLYMER housing and BERYLLIUM COPPER ALLOY contacts finished with TIN OVER NICKEL. Ideal for devices using PLCC84, this IC socket ensures reliable connections in electronic applications.
818-22-024-10-002101
IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
XR2A-4205
IC SOCKET; Manufacturer Series: XR2;
2-1393143-2
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
2-1571550-9
TE Connectivity's 2-1571550-9 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and uses solder termination. With a housing made of polyethylene, it operates b/w -55°C to 105°C, suitable for various electronic applications requiring reliable connections.
XR2A-1625
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
4-1419106-0
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
2625-6325-9UA-1902
2625-6325-9UA-1902 by 3M Electronic Products Division is a POLYETHERSULFONE chip carrier IC socket for PGA625 with 625 gold contacts. It features gold (30) over nickel (50) finish for mating and termination, suitable for high-performance integrated circuit applications.
P7S-14F-END
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 14;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
APH-1016-G-T
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; No. of Contacts: 16; Contact Config: RECTANGLE; Contact Material: BRASS;
APH-1016-T-R
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BRASS; No. of Contacts: 16;
APH-1508-G-T
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Additional Features: UL 94V-0; JESD-609 Code: e4; No. of Contacts: 8;
APH-1004-T-H
IC SOCKET; Device Type Used On: DIP4; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1010-T-H
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 10; JESD-609 Code: e3;
APH-1010-T-R
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Additional Features: LOW PROFILE; Contact Config: RECTANGLE; Contact Material: BRASS;
APH-1010-T-T
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); Additional Features: UL 94V-0; No. of Contacts: 10;
APH-1012-T-H
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Material: BRASS; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1012-T-R
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; JESD-609 Code: e3; Contact Material: BRASS;
APH-1012-T-T
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Material: BRASS; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1014-T-H
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Additional Features: LOW PROFILE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1014-T-R
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Material: BRASS; Additional Features: LOW PROFILE; JESD-609 Code: e3;
APH-1014-T-T
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1016-G-H
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 16; JESD-609 Code: e4;
APH-1016-G-R
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
APH-1016-T-H
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); JESD-609 Code: e3; Contact Material: BRASS;
APH-1018-T-H
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; Additional Features: LOW PROFILE; JESD-609 Code: e3; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1018-T-R
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; No. of Contacts: 18; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50);
APH-1018-T-T
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1020-T-T
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Additional Features: UL 94V-0; JESD-609 Code: e3;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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