Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Samtec APH-1016-T-T is a Chip Carrier IC Socket with 16 contacts made of brass and tin over nickel finish. It features a polyethylene housing material, suitable for DIP16 devices. Ideal for applications requiring reliable rectangular contact configuration in IC sockets.
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Nova Conductors
Argo Parts USA
Netroflash
Continental Prestige Electronics
Polyethylene is a durable and light-weight material, providing protection and ease of handling for the chip carrier IC.
Designed specifically for DIP16 devices, ensuring a precise and secure fit for the integrated circuit.
Brass is a reliable and conductive material, ensuring good electrical connectivity for the socket.
With 16 contacts, this socket can accommodate a wide range of integrated circuit chips, making it versatile for different applications.
The tin over nickel finish provides both corrosion resistance and good conductivity for reliable connections.
The tin with nickel barrier termination ensures long-term stability and durability for the socket contacts.
Being an IC socket, this product allows for easy insertion and removal of the integrated circuit chip, facilitating maintenance and upgrades.
The rectangular contact configuration ensures proper alignment and secure connection between the socket and the integrated circuit chip.
Chip Carrier IC & Component Sockets APH-1016-T-T attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
APH-1016-T-T Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
L7805CV
STMicroelectronics
L7805CV by STMicroelectronics is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation in electronic circuits.
1N4148
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F103C8T6
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
Hitachi
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Hitano Enterprise
Toshiba
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
LM358DR2G
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
XR2C-3215
Omron
IC SOCKET; Contact Finish (Termination): GOLD; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
326-93-107-41-002000
Mill-max Mfg
326-93-107-41-002000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for SIP7 devices with 7 contacts. Features GOLD (30) over NICKEL (100) mating finish and Tin/Lead termination. Ideal for rectangular contact configuration in electronic applications.
ICM-624-1-GT
Adam Tech
ICM-624-1-GT by Adam Tech is a DIP24 IC socket with 24 contacts, 15.24mm PCB row spacing, and rectangular contact pattern. It has a solder termination type, operates b/w -40°C to 105°C, and supports a current rating of 3A. Ideal for applications requiring reliable chip carrier connections in electronic devices.
3-822472-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: PLCC32; Housing Material: PLASTIC; Manufacturer Series: 822472; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): TIN LEAD;
228-1371-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 228-1371-00-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold-plated contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.
XR2B-4001-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
510-93-168-17-101003
IC SOCKET;
2271028
Phoenix Contact
RELAY SOCKET;
1860000-1
TE Connectivity
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; Additional Features: STANDARDS: CUL; VDE; No. of Contacts: 14; Contact Material: NOT APPLICABLE;
XR2T-2221-N
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD FLASH; JESD-609 Code: e4; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
390261-2
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
DSP2A-PS
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6;
M12883/40-01
Amphenol
RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; No. of Contacts: 14; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
940-44-084-24-000000
940-44-084-24-000000 by Mill-max Mfg is a PLCC84 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 84 contacts, it has a current rating of 1A and operates b/w -55°C to 105°C. Ideal for chip carrier applications, it offers high insulation resistance and dielectric voltage withstand capabilities.
95.15.2SMA
Finder
RELAY SOCKET; Contact Finish (Termination): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED;
350-10-117-00-001000
350-10-117-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP17 devices with 17 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
SH3B-05
Idec
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
M12883/52-001
Esterline Technologies
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; No. of Contacts: 8; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
PY08
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
1-390261-6
TE Connectivity 1-390261-6 is a DIP20 IC SOCKET with 20 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and rectangular contact pattern for solder termination. Suitable for applications requiring a mating contact pitch of 0.1 inch, it operates b/w -40°C to 105°C temperature range.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
APH-1016-G-T
Samtec
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; No. of Contacts: 16; Contact Config: RECTANGLE; Contact Material: BRASS;
APH-1016-T-R
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BRASS; No. of Contacts: 16;
APH-1508-G-T
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Additional Features: UL 94V-0; JESD-609 Code: e4; No. of Contacts: 8;
APH-1004-T-H
IC SOCKET; Device Type Used On: DIP4; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1010-T-H
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 10; JESD-609 Code: e3;
APH-1010-T-R
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Additional Features: LOW PROFILE; Contact Config: RECTANGLE; Contact Material: BRASS;
APH-1010-T-T
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); Additional Features: UL 94V-0; No. of Contacts: 10;
APH-1012-T-H
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Material: BRASS; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1012-T-R
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; JESD-609 Code: e3; Contact Material: BRASS;
APH-1012-T-T
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Material: BRASS; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1014-T-H
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Additional Features: LOW PROFILE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1014-T-R
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Material: BRASS; Additional Features: LOW PROFILE; JESD-609 Code: e3;
APH-1014-T-T
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1016-G-H
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 16; JESD-609 Code: e4;
APH-1016-G-R
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
APH-1016-T-H
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); JESD-609 Code: e3; Contact Material: BRASS;
APH-1018-T-H
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; Additional Features: LOW PROFILE; JESD-609 Code: e3; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1018-T-R
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; No. of Contacts: 18; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50);
APH-1018-T-T
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1020-T-T
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Additional Features: UL 94V-0; JESD-609 Code: e3;
Supply Digital Components
$106.00
$54.25
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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