Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Samtec APH-1016-T-T is a Chip Carrier IC Socket with 16 contacts made of brass and tin over nickel finish. It features a polyethylene housing material, suitable for DIP16 devices. Ideal for applications requiring reliable rectangular contact configuration in IC sockets.
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Nova Conductors
Argo Parts USA
Netroflash
Continental Prestige Electronics
Polyethylene is a durable and light-weight material, providing protection and ease of handling for the chip carrier IC.
Designed specifically for DIP16 devices, ensuring a precise and secure fit for the integrated circuit.
Brass is a reliable and conductive material, ensuring good electrical connectivity for the socket.
With 16 contacts, this socket can accommodate a wide range of integrated circuit chips, making it versatile for different applications.
The tin over nickel finish provides both corrosion resistance and good conductivity for reliable connections.
The tin with nickel barrier termination ensures long-term stability and durability for the socket contacts.
Being an IC socket, this product allows for easy insertion and removal of the integrated circuit chip, facilitating maintenance and upgrades.
The rectangular contact configuration ensures proper alignment and secure connection between the socket and the integrated circuit chip.
Chip Carrier IC & Component Sockets APH-1016-T-T attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
APH-1016-T-T Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
1N4148WS
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Kec
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
Philips Components
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
Surge Components
Onsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
EU2B-YS2J03F
Idec
ROTARY SWITCH;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
NXP Semiconductors
LM358AN
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
95.15.2
Finder
Finder's 95.15.2 is a RELAY SOCKET with 8 contacts, rated at 10A current. It has a PCB contact row spacing of 7.49mm and operates b/w -40 to 70°C. Ideal for applications requiring reliable relay connections in electronic circuits.
551-10-081-09-000004
Mill-max Mfg
Mill-max Mfg's 551-10-081-09-000004 is a chip carrier IC & component socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It has 81 contacts with GOLD (10) over NICKEL (150) mating finish and Gold (Au) termination finish. This IC socket is used on PGA81 devices.
510-13-076-11-041001
510-13-076-11-041001 by Mill-max Mfg is a Chip Carrier IC Socket with 76 contacts, gold finish, and 2.54mm terminal pitch. It is used on PGA76 devices for PCBs with rectangular contact pattern and 2.54mm row spacing, ideal for applications requiring a current rating of 1A in temperatures ranging from -55 to 125°C.
2271484
Phoenix Contact
RELAY SOCKET;
816-22-058-10-001101
IC SOCKET; Device Type Used On: SIP58; Housing Material: PLASTIC; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): GOLD OVER NICKEL;
PY11QN
Omron
PF083A
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
MT78745-
IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Mating): NOT SPECIFIED; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT SPECIFIED;
200-6311-9UN-1900
3m Electronic Products Division
The 3M Electronic Products Division's 200-6311-9UN-1900 is a Chip Carrier IC Socket with POLYETHERSULFONE housing. It features 121 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) finish for PGA121 devices. Ideal for high-performance electronic applications requiring reliable connections.
XR2A-1605
IC SOCKET; Manufacturer Series: XR2;
236-6225-00-0602
The 3M Electronic Products Division's 236-6225-00-0602 is a ZIP36 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 36 gold (Au) over nickel (Ni) mating contacts and gold (Au) termination finish. Ideal for chip carrier ICs, this socket ensures reliable connections in electronic applications.
XR2A-2425
PY08-Y1
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8;
IC160Z-0204-240
Yamaichi Electronics
Yamaichi Electronics' IC160Z-0204-240 is a POLYAMIDE chip carrier socket for PLCC20 devices with 20 contacts. Featuring COPPER ALLOY contacts, it has an insulation resistance of 500MΩ and dielectric voltage of 350VAC. Ideal for surface mount applications, this socket has a current rating of 1A and bellowed contact style.
XR2A-4805
27E419
IC SOCKET; Housing Material: NYLON; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
110-43-328-41-001000
110-43-328-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material, suitable for DIP28 devices. Featuring 28 contacts with Matte Tin over Nickel finish, it has a rectangular contact configuration ideal for integrated circuit applications.
APA-316-T-D
Samtec
Samtec APA-316-T-D is a 16-contact IC socket with brass contacts and polyester housing. It features Tin over Nickel mating finish and Tin with Nickel termination finish. Ideal for DIP16 devices, this rectangular contact configuration chip carrier socket is suitable for various electronic applications.
SF1V-6-07L
HLT-1910-T-H
Samtec's HLT-1910-T-H is a 190-contact IC socket with brass contacts and plastic housing. It is designed for use on PGA190 devices, featuring Tin over Nickel mating finish and Tin with Nickel termination. Ideal for chip carrier applications requiring reliable connectivity in electronic systems.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
APH-1016-G-T
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; No. of Contacts: 16; Contact Config: RECTANGLE; Contact Material: BRASS;
APH-1016-T-R
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BRASS; No. of Contacts: 16;
APH-1508-G-T
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYETHYLENE; Additional Features: UL 94V-0; JESD-609 Code: e4; No. of Contacts: 8;
APH-1004-T-H
IC SOCKET; Device Type Used On: DIP4; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1010-T-H
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 10; JESD-609 Code: e3;
APH-1010-T-R
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Additional Features: LOW PROFILE; Contact Config: RECTANGLE; Contact Material: BRASS;
APH-1010-T-T
IC SOCKET; Device Type Used On: DIP10; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); Additional Features: UL 94V-0; No. of Contacts: 10;
APH-1012-T-H
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Material: BRASS; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1012-T-R
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; JESD-609 Code: e3; Contact Material: BRASS;
APH-1012-T-T
IC SOCKET; Device Type Used On: DIP12; Housing Material: POLYETHYLENE; Contact Material: BRASS; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1014-T-H
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Additional Features: LOW PROFILE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1014-T-R
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Material: BRASS; Additional Features: LOW PROFILE; JESD-609 Code: e3;
APH-1014-T-T
IC SOCKET; Device Type Used On: DIP14; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1016-G-H
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 16; JESD-609 Code: e4;
APH-1016-G-R
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
APH-1016-T-H
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYETHYLENE; Contact Finish (Mating): TIN OVER NICKEL (50); JESD-609 Code: e3; Contact Material: BRASS;
APH-1018-T-H
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; Additional Features: LOW PROFILE; JESD-609 Code: e3; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APH-1018-T-R
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; No. of Contacts: 18; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50);
APH-1018-T-T
IC SOCKET; Device Type Used On: DIP18; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; JESD-609 Code: e3; Additional Features: UL 94V-0;
APH-1020-T-T
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYETHYLENE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Additional Features: UL 94V-0; JESD-609 Code: e3;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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