Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Amphenol's 69802-432LF is a PLCC32 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 32 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. With surface mount termination and high insulation resistance, it is ideal for chip carrier applications.
Median Price
$1.200
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1k+
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Resion (Excess)
GreenTree Electronics
ChipTracer
Univa Technologies Pte. Ltd (Excess)
Netroflash
This material provides excellent thermal and chemical resistance, making the chip carrier socket durable and suitable for a wide range of operating conditions.
Designed specifically for PLCC32 devices, ensuring a secure and precise fit for the integrated circuit, enhancing overall performance.
With a low minimum operating temperature, this chip carrier socket can function reliably in environments with extreme cold conditions.
Surface mount termination makes installation and removal of the component sockets easier and more efficient, contributing to overall ease of use.
Copper alloy contacts offer high conductivity and durability, ensuring stable and efficient electrical connections for the IC sockets.
With 32 contacts, this chip carrier socket provides sufficient connectivity for the integrated circuit, reducing the risk of signal interference or loss.
High insulation resistance helps prevent electrical leakage and interference, maintaining signal integrity and reliability within the socket.
The pure tin and nickel finish on the contacts ensures good mating connections, reducing signal loss and improving overall electrical performance.
The straight mounting style offers a secure and stable installation of the IC sockets, minimizing the risk of misalignment or disconnection.
With a current rating of 1A, this chip carrier socket can reliably handle the power requirements of the integrated circuit without risk of overheating or malfunction.
Compact body width allows for efficient use of space on circuit boards, making it suitable for applications where size constraints are a concern.
High dielectric strength ensures reliable insulation and protection against voltage spikes, enhancing the overall safety and performance of the chip carrier socket.
Matte tin and nickel termination finish provides corrosion resistance and reliable electrical connections, extending the lifespan and performance of the sockets.
Compact body depth allows for efficient placement within electronic devices, reducing overall space requirements and enabling versatile installation options.
Specifically designed as an IC socket, ensuring compatibility and optimal performance for integrated circuit applications.
The 7X9 contact configuration offers a reliable and secure connection between the socket and the integrated circuit, minimizing the risk of signal loss or interference.
With a high maximum operating temperature, this chip carrier socket can withstand elevated temperatures without compromising performance or reliability.
Chip Carrier IC & Component Sockets 69802-432LF attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Amphenol Communications Solutions
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69802-432LF Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive.
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
National Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
L78L05ABZ-AP
STMicroelectronics
L78L05ABZ-AP by STMicroelectronics is a BIPOLAR fixed positive single output standard regulator with an operating temperature range of -40 to 125°C. It has a nominal output voltage of 5V, max load regulation of 0.06%, and can handle a max output current of 0.07A. Ideal for applications requiring stable voltage regulation in various electronic devices.
LM358MX
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
MBR130T1G
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
MBRS3200T3G
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
MBRS1100T3G
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
LP2950CDT-3.3G
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
General Diode
508-AG11D-ES
TE Connectivity
TE Connectivity's 508-AG11D-ES is a DIP8 IC socket with 7.62mm PCB contact row spacing and rectangular pattern. It features solder termination, 0.1" mating contact pitch, and can withstand temperatures from -55 to 125°C. Ideal for applications requiring a reliable chip carrier socket with 8 contacts.
299-43-314-10-001000
Mill-max Mfg
The Mill-max Mfg 299-43-314-10-001000 is a plastic chip carrier IC socket with a DIP14 device type. It has a mating contact pitch of 0.1 inch and can handle a current rating of 3A. This IC socket is commonly used for right angle mounting in various electronic applications.
214-3339-00-0602
3m Electronic Products Division
IC SOCKET; Device Type Used On: ZIP14-DIP14; Housing Material: POLYSULFONE AND TORLON; No. of Contacts: 14;
342-10-142-00-591000
Mill-max Mfg 342-10-142-00-591000 is a POLYETHYLENE IC SOCKET for SIP42 devices with 42 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
510-93-169-17-101001
The Mill-max Mfg 510-93-169-17-101001 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. The housing material is POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, making it ideal for chip carrier IC applications.
1-2324271-2
TE Connectivity 1-2324271-2 is a POLYETHYLENE chip carrier socket for LGA4189 devices. With 2097 contacts, it supports 0.5A current rating and operates b/w -25°C to 100°C. Ideal for surface mount applications in various electronic systems.
304-13-104-41-780000
Mill-max Mfg's 304-13-104-41-780000 is a POLYETHYLENE IC SOCKET for SIP4 devices with 4 GOLD OVER NICKEL contacts. Ideal for Chip Carrier IC & Component Sockets, featuring RECTANGLE contact configuration.
816-22-058-10-001101
IC SOCKET; Device Type Used On: SIP58; Housing Material: PLASTIC; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): GOLD OVER NICKEL;
510-13-076-11-041001
510-13-076-11-041001 by Mill-max Mfg is a Chip Carrier IC Socket with 76 contacts, gold finish, and 2.54mm terminal pitch. It is used on PGA76 devices for PCBs with rectangular contact pattern and 2.54mm row spacing, ideal for applications requiring a current rating of 1A in temperatures ranging from -55 to 125°C.
XR2A-2465
Omron
IC SOCKET; Manufacturer Series: XR2;
TF183
Fischer Elektronik & Kg
TF183 by Fischer Elektronik & Kg is a TRANSISTOR SOCKET for TO-18 devices with 3 GOLD contacts. It features POLYTETRAFLUORO ETHYLENE housing material, ideal for chip carrier IC applications.
110-87-640-41-001101
Preci-dip Sa
110-87-640-41-001101 by Preci-dip Sa is a DIP40 IC socket with 40 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Tin termination. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for chip carrier applications.
XR2T-1611-N
IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER;
251-5949-01-0602
The 3m Electronic Products Division's 251-5949-01-0602 is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing. It has 51 BERYLLIUM COPPER contacts finished in GOLD over NICKEL for ZIP51 devices. Ideal for applications requiring reliable connections and durability.
XR2T-1601-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
2833615
Phoenix Contact
RELAY SOCKET; Device Type Used On: RELAY; Maximum Operating Temperature: 85 Cel; Termination Type: SCREW; Minimum Operating Temperature: -40 Cel; Rating (Current): 10 A;
134-10-328-00-050000
The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
111-91-964-41-001000
Mill-max Mfg's 111-91-964-41-001000 is a Chip Carrier IC Socket with 64 contacts. It features Beryllium Copper contact material, Gold over Nickel mating finish, and Tin/Lead termination. Ideal for DIP64 devices, this socket has a Polyethylene housing and rectangular contact configuration.
XR2A-4211-N
IC SOCKET; Device Type Used On: DIP42; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); No. of Contacts: 42;
HLS-0116-T-10
Samtec
Samtec's HLS-0116-T-10 is a 16-contact IC socket with gold finish for SIP16 devices. It features a plastic housing and rectangular contact configuration. Ideal for chip carrier applications, this component offers reliable connectivity in electronic systems.
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69802-044LF
Amphenol Communications Solutions
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Dielectric Withstanding Voltage (V): 840VAC; Housing Material: POLYPHENYLENE SULFIDE; Termination Type: SURFACE MOUNT;
69802-144LF
Amphenol's 69802-144LF is a PLCC44 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 44 contacts made of PHOSPHOR BRONZE, it has a current rating of 1A and operates b/w -55°C to 125°C. Ideal for surface mount applications, it offers high insulation resistance and dielectric voltage withstand capabilities.
69802-444LF
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Dielectric Withstanding Voltage (V): 840VAC; Housing Material: POLYPHENYLENE SULFIDE; Maximum Operating Temperature: 125 Cel;
69802-032
Fci
IC SOCKET; Device Type Used On: PLCC32; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: POLYPHENYLENE SULFIDE;
69802-132
69802-032LF
IC SOCKET; Device Type Used On: PLCC32; Mounting Style: STRAIGHT; Dielectric Withstanding Voltage (V): 840VAC; Housing Material: POLYPHENYLENE SULFIDE; Termination Type: SURFACE MOUNT;
69802-132LF
IC SOCKET; Device Type Used On: PLCC32; Mounting Style: STRAIGHT; Dielectric Withstanding Voltage (V): 840VAC; Housing Material: POLYPHENYLENE SULFIDE; Contact Config: 7X9;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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