Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity 2-1571586-9 is a DIP28 IC socket with 28 contacts. It features a PCB contact row spacing of 15.24mm, rectangular contact pattern, and thermoplastic housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and current rating of 3A in temperatures ranging from -55 to 105°C.
Median Price
$4.170
Lifecycle Status
Suppliers In-Stock
15
In-Stock Inventory
1k+
Verical
1+ parts
$3.780
100+ parts
$3.710
1k+ parts
$3.640
10k+ parts
-
Master Electronics
$4.048
$3.610
$3.060
Mouser Electronics
$7.130
$4.690
PEI Genesis
Chip1Stop
$3.160
$2.860
Farnell
$4.600
Component Electronics Inc.
$4.620
$3.460
$3.000
Nova Conductors
$4.681
Bristol Electronics
$8.736
$3.785
$3.582
VNN
Lakeland Logistics Inc
Vyrian
IBS Electronics
$3.712
$4.856
TME
$4.187
$4.121
ACDS - Activité Composants Distribution Service
Ampacity Inc.
$3.210
Semicontronic
$3.130
$3.114
Continental Prestige Electronics
$4.587
Authorized Procurement Solutions
Perfect Parts
Argo Parts USA
Assy Fe
Advanced Electronics
Aztec Data Supply Inc.
Cyclops Electronics Ltd (Excess)
The close spacing between PCB contacts allows for a compact design and efficient use of space on the circuit board.
Thermoplastic housing provides durability and reliability in various operating conditions.
Wide operating temperature range ensures the product can function in extreme environments.
Beryllium copper contacts offer high conductivity, corrosion resistance, and durability, ensuring reliable electrical connections.
With a current rating of 3A, this product can handle moderate power levels, making it suitable for a variety of applications.
High dielectric strength ensures safe operation and prevents electrical breakdown in high voltage applications.
Specifically designed for DIP28 devices, providing a secure and reliable connection for the integrated circuit.
Chip Carrier IC & Component Sockets 2-1571586-9 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
Number of Positions or Pins:
Contact Finish - Termination:
Contact Material:
Contact Style:
Installation Type:
Mating Contact Pitch:
PCB Contact Row Spacing:
Terminal Pitch:
Mounting Style:
PCB Contact Layout:
IC Socket Type:
Housing Material:
Length:
Width:
Depth:
JESD-609 Code:
Current Rating:
Dielectric Withstanding Voltage:
Insulation Resistance:
Minimum Operating Temperature:
Maximum Operating Temperature:
Compatible Device Type:
Special Features:
2-1571586-9 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMMBT2222ALT1G
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
Digitron Semiconductors
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
Gulf Semiconductor
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
Crimson Semiconductor
2N7002-T1-E3
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Diodes Incorporated
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
1415044-1
TE Connectivity
TE Connectivity's 1415044-1 is a Chip Carrier IC Socket with 11 contacts, rated for 10A current. It has a dielectric voltage of 2121VAC and operates b/w -40°C to 70°C. Ideal for use on relays due to its blade pin-skt contact style and solder termination.
P2CF-11
Omron
Omron's P2CF-11 is a 11-contact chip carrier IC socket for relays, featuring screw termination and 5A current rating. With dimensions of 2.76" x 1.97" x 1.23", it offers high insulation resistance (1G ohm) and dielectric voltage withstand (2000VAC), ideal for relay applications requiring secure connections.
12-1508-30
Aries Electronics
Aries Electronics 12-1508-30 is a DIP12 IC socket with 2.54mm terminal pitch, gold over nickel contact finish, and nylon46 housing material. It has 12 contacts rated at 3A for wire wrap termination, suitable for chip carrier applications on PCBs with rectangular contact pattern spacing of 0.1 inch.
416-43-226-41-001000
Mill-max Mfg
The Mill-max Mfg 416-43-226-41-001000 is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It is used in Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
XR2A-2478
IC SOCKET; Manufacturer Series: XR2;
97.01SPA
Finder
RELAY SOCKET; No. of Contacts: 5; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
540-88-044-17-400-2
Preci-dip Sa
IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 44; Contact Finish (Mating): NOT SPECIFIED;
110-44-328-41-001000
Mill-max Mfg's 110-44-328-41-001000 is a POLYETHYLENE IC SOCKET for DIP28 devices with 28 contacts. Features MATTE TIN OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
1-822473-7
IC SOCKET; Device Type Used On: PLCC84; Housing Material: POLYETHYLENE; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 84;
PY11-Y1
RELAY SOCKET;
94.54
Finder's 94.54 is a RELAY SOCKET with 14 SQ PIN-SKT contacts, rated at 10A current. With SNAP ON termination, it operates b/w -25°C to 70°C and withstands up to 2000VAC dielectric voltage. Ideal for Chip Carrier IC & Component Sockets applications.
110-87-628-41-001101
110-87-628-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, rated for 1A current. It features Beryllium Copper contacts with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing material. With a temperature range of -55 to 125 °C, it's ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capability up to 1400VAC.
1047031
Phoenix Contact
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
XR2T-2011-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
RSE116685
Amphenol
Amphenol's RSE116685 is a RELAY SOCKET with 8 GOLD contacts. Made of POLYETHERIMIDE, it operates b/w -65°C to 125°C. Ideal for Chip Carrier ICs, this socket ensures reliable connections in various electronic applications.
304-13-128-41-770000
The Mill-max Mfg 304-13-128-41-770000 is a POLYETHYLENE chip carrier IC socket with 28 contacts, GOLD OVER NICKEL finish. It is designed for SIP28 devices, featuring RECTANGLE contact configuration. Ideal for high-performance electronic applications requiring reliable and durable component sockets.
SD-110-G-22-N
Samtec
SD-110-G-22-N by Samtec is a Chip Carrier IC Socket with 20 contacts, rated for 1A current. Featuring rectangular contact configuration and body dimensions of 1" length, 0.2" width, and 0.175" depth. It is used in DIP20 devices with a mating pitch of 0.1".
540-44-032-17-400000
The Mill-max Mfg 540-44-032-17-400000 is a PLCC32 IC socket with 32 contacts, rated for 1A current. It features a polyphenylene sulfide housing material, surface mount termination, and bellowed contact style. With a temperature range of -55 to 125°C, it is ideal for chip carrier IC applications requiring high insulation resistance and dielectric voltage withstand capabilities.
5-210781-0
5-210781-0 by Tyco Electronics Amp is a 50-contact IC socket with gold finish, suitable for SIP50 devices. It features GLASS FILLED POLYETHYLENE POLYESTER housing and BERYLLIUM COPPER contacts. Ideal for chip carrier IC applications requiring reliable connections.
4-1419106-0
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
2-1571552-9
TE Connectivity's 2-1571552-9 is a DIP28 IC socket with 28 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and rectangular pattern, it uses solder termination for applications requiring a dielectric voltage withstand of 1400VAC.
2-1571552-2
TE Connectivity's 2-1571552-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, RECTANGULAR pattern, and THERMOPLASTIC POLYESTER housing. It has 8 contacts, -55 to 105°C operating temp range, and 3A current rating. Ideal for applications requiring reliable solder termination in electronic circuits.
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT PLASTIC POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): GOLD FLASH OVER NICKEL (100); JESD-609 Code: e3;
2-1571552-6
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYETHYLENE/POLYESTER;
2-1571552-3
IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT PLASTIC POLYESTER; JESD-609 Code: e3; Contact Finish (Termination): TIN OVER NICKEL; Contact Material: BERYLLIUM COPPER;
TE Connectivity's 2-1571552-3 is a Chip Carrier IC Socket with PCB contact row spacing of 7.62mm and rectangular pattern. Made of thermoplastic polyester, it has 14 contacts, operates b/w -55°C to 105°C, and supports devices like DIP14. With solder termination, it offers a current rating of 3A and dielectric voltage withstand of 1400VAC.
2-1571552-4
TE Connectivity's 2-1571552-4 is a Chip Carrier IC Socket with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and uses solder termination. Ideal for DIP16 devices, it has a temperature range from -55°C to 105°C and dielectric voltage withstand of 1400VAC.
2-1571586-9
3m Electronic Products Division
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
2-1571550-4
TE Connectivity's 2-1571550-4 is a Chip Carrier IC Socket with 16 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 7.62mm row spacing and thermoplastic housing material. Ideal for DIP16 devices, it operates b/w -55°C to 105°C, suitable for various electronic applications.
2-1571552-5
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: THERMOPLASTIC POLYESTER;
2-1571586-3
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-THERMOPLASTIC POLYESTER;
2-1571586-2
TE Connectivity's 2-1571586-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, rectangular pattern, and thermoplastic housing. It has 8 contacts, solder termination, and operates b/w -55°C to 105°C. Ideal for applications requiring a mating pitch of 0.1 inch and current rating of 3A in straight mounting style.
2-1571552-7
IC SOCKET; Device Type Used On: DIP22; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC POLYESTER;
2-1571552-8
TE Connectivity's 2-1571552-8 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and uses thermoplastic polyester housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and operating temperatures ranging from -55 to 105°C.
2-1571550-9
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYETHYLENE;
2-1571550-8
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: PCT-PLASTIC POLYESTER;
2-1571550-2
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: PCT PLASTIC POLYESTER;
2-1571551-2
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
2-1571550-6
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
2-1571586-4
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-THERMOPLASTIC POLYESTER;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved