Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
IC SOCKET; JESD-609 Code: e4; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
Median Price
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Chip Carrier IC & Component Sockets XR2A-1802 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Omron
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
JESD-609 Code:
Product Series:
XR2A-1802 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
As a global leader in the field of automation, OMRON’s business fields cover a broad spectrum, ranging from industrial automation and electronic components to social systems including automated ticket gates and solar power conditioners, healthcare. At present, OMRON provides products and services in around 120 countries and regions.
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
1N4148
Grande Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
LM7805CT/NOPB
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
General Semiconductor
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
XR2A-1802
Omron
XR2C-2015
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
1825575-2
TE Connectivity
TE Connectivity's 1825575-2 is a Chip Carrier IC Socket with 8 contacts, BE-CU material, and SN finish. It has a PCB contact row spacing of 17.78mm and mating pitch of 0.1 inch, suitable for DIP8 devices. Ideal for surface mount applications in electronics, it operates b/w -55°C to 125°C with a current rating of 1A.
390261-4
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
940-44-032-24-001000
Mill-max Mfg
Mill-max Mfg 940-44-032-24-001000 is a PLCC32 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It features 32 contacts with Matte Tin (Sn) - Nickel (Ni) finish for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
326-93-105-41-001000
Mill-max Mfg's 326-93-105-41-001000 is a PLASTIC IC SOCKET for SIP5 devices with 5 BERYLLIUM COPPER contacts. It features Tin/Lead finish and RECTANGLE contact configuration, ideal for Chip Carrier IC applications.
PL08
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
828-AG12D-ES-LF
TE Connectivity's 828-AG12D-ES-LF is a chip carrier IC socket with 28 contacts and a rectangular PCB contact pattern. It has a body length of 1.4 inch, body width of 0.7 inch, and body depth of 0.18 inch. This socket is commonly used on DIP28 devices and can withstand temperatures ranging from -55 to 105 °C.
5-1571552-2
TE Connectivity 5-1571552-2 is a DIP40 IC socket with 40 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and uses thermoplastic housing material. Suitable for applications requiring a mating contact pitch of 0.1 inch, it operates b/w -55°C to 105°C temperature range.
XR2D-3204
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
HLS-0403-G-2
Samtec
Samtec's HLS-0403-G-2 is a 12-contact IC socket with gold finish, ideal for PGA12 devices. Made of plastic, it offers reliable connectivity and durability. Suitable for chip carrier applications requiring secure component sockets.
6-1437514-7
TE Connectivity 6-1437514-7 is a Chip Carrier IC Socket with PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. It operates b/w -65°C to 125°C, suitable for various electronic applications requiring reliable connections.
XR2T-4001-N
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
9-1437514-4
TE Connectivity 9-1437514-4 is a Chip Carrier IC Socket with 7.62mm PCB contact spacing, -55 to 105°C temp range, and 3A current rating. Ideal for PRESS FIT termination in electronic applications requiring high insulation resistance and precise mating contact pitch of 0.1 inch.
1047031
Phoenix Contact
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
2227MC-08-03-18-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; JESD-609 Code: e4; Additional Features: STANDARD: UL94-0;
110-43-308-41-001000
110-43-308-41-001000 by Mill-max Mfg is a DIP8 IC socket with 0.1" contact pitch, suitable for chip carrier ICs. Featuring polyethylene housing, matte tin over nickel termination, and 3A current rating, it operates b/w -55°C to 125°C. Ideal for applications requiring reliable connections in electronic devices.
8448-001
Amphenol Communications Solutions
Amphenol's 8448-001 IC Socket features staggered contact configuration with 335 contacts on a LGA335 device. With a PCB row spacing of 1.27mm and surface mount termination, it is ideal for straight mounting on PCBs. The socket uses glass-filled polyetherimide housing material for durability in electronic applications.
410-47-220-41-001000
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED; JESD-609 Code: e4;
XR2C-1011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10);
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XR2A-1615
IC SOCKET; Manufacturer Series: XR2;
XR2A-1411-N
IC SOCKET; Device Type Used On: DIP14; Contact Material: NOT SPECIFIED; No. of Contacts: 14; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
XR2A-0815
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
XR2A-1605
XR2A-1421-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER;
XR2A-1402
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
XR2A-1621-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
XR2A-0802
IC SOCKET; Contact Material: NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD;
XR2A-1415
XR2A-0821-N
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYBUTYLENE TEREPHTHALATE;
XR2A-1602
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD;
XR2A-1425
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-1401-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
XR2A-1611-N
IC SOCKET; Device Type Used On: DIP16; No. of Contacts: 16; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
XR2A-0811-N
XR2A-1405
XR2A-0801-N
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
XR2A-0805
XR2A-0825
XR2A-1601-N
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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