Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Fujitsu IC149-100-025-B5 is a 100-contact QFP100 chip carrier socket with POLYPHENYLENE SULPHIDE housing. It features BERYLLIUM COPPER contacts finished in GOLD (Au) with Nickel (Ni) barrier. Ideal for IC SOCKET applications requiring reliable connections and durability.
Median Price
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Mouser Electronics
1+ parts
$97.400
100+ parts
$77.470
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10k+ parts
RS (Exports)
$289.208
$167.629
Nova Conductors
$77.460
Vyrian
Elcom Components
AZTECH Wire
$11.034
Continental Prestige Electronics
$75.911
Argo Parts USA
Netroflash
$73.587
$72.038
Perfect Parts
Polyphenylene sulphide is known for its high temperature resistance, making this chip carrier socket suitable for applications where heat dissipation is a concern.
Designed specifically for QFP100 devices, ensuring a precise and secure fit.
Beryllium copper provides excellent conductivity and durability, ensuring reliable electrical connections.
With 100 contacts, this chip carrier socket can accommodate a wide range of ICs and components, making it versatile for various applications.
Gold finish on the mating contacts ensures low contact resistance and long-term reliability for optimal performance.
The gold finish with nickel barrier provides corrosion resistance and prevents oxidation, ensuring stable electrical connections over time.
Designed as an IC socket, this product allows for easy insertion and removal of ICs, facilitating testing and maintenance procedures.
Chip Carrier IC & Component Sockets IC149-100-025-B5 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Fujitsu
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
IC149-100-025-B5 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Fujitsu Ltd delivers total solutions in the field of information and communication technology. The company provides solutions/system integration services focused on information system consulting and construction, and infrastructure services centered on outsourcing services. Fujitsu provides services across a wide range of countries and regions, including Europe, the Americas, Asia, and Oceania. It operates in three segments namely, Technology Solutions; Ubiqitous Solutions and Device Solutions. Ubiquitous Solutions consists of PCs, mobile phones, and mobilewear. In PCs, Fujitsu's lineup includes desktop and laptop PCs known for energy efficiency, security, and other enhanced features, as well as water- and dust-resistant tablets.
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Changzhou Starsea Electronics
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Eic Semiconductor
BAV99
STMicroelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
ULN-2803A
Vishay Sprague
Vishay Sprague's ULN-2803A is an 8-bit peripheral driver with a max supply voltage of 3V. Featuring open-collector output characteristics, it offers built-in transient protections and operates b/w -20°C to 85°C. Ideal for applications requiring sink current flow direction, this rectangular-shaped driver has a terminal pitch of 2.54mm and turn-on/off time of 1us.
ROHM
Formosa Microsemi
Weitronic Enterprise
2-1571586-2
TE Connectivity
TE Connectivity's 2-1571586-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, rectangular pattern, and thermoplastic housing. It has 8 contacts, solder termination, and operates b/w -55°C to 105°C. Ideal for applications requiring a mating pitch of 0.1 inch and current rating of 3A in straight mounting style.
12-823-90C
Aries Electronics
Aries Electronics 12-823-90C is a chip carrier IC socket with 12 contacts, rectangular PCB pattern, and nylon46 housing. It features a mating contact pitch of 0.1 inch and solder termination type. Ideal for DIP12 devices, this socket has a right-angle mounting style for easy installation in electronic circuits.
PLS-032-H105-99
E-tec Interconnect
PLS-032-H105-99 by E-tec Interconnect is a PLCC32 IC socket with 32 contacts, rated for 1A current. It has surface mount termination, bellowed contact style, and operates b/w -40°C to 105°C. Ideal for chip carrier IC applications requiring high insulation resistance and reliable contact finish.
1-1393824-0
IC SOCKET; Housing Material: POLYCARBONATE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
PTF11A
Omron
RELAY SOCKET; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
214-44-314-01-670800
Mill-max Mfg
214-44-314-01-670800 by Mill-max Mfg is a Chip Carrier IC Socket with NYLON46 housing. It features 14 contacts with MATTE TIN OVER NICKEL finish, designed for DIP14 devices. Ideal for applications requiring rectangular contact configuration in electronic assemblies.
SH3B-05
Idec
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
4593
Keystone Electronics
TRANSISTOR SOCKET; Manufacturer Series: 4593;
110-93-308-41-001000
110-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.
PYFZ-14
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
XR2A-4011-N
IC SOCKET; Device Type Used On: DIP40; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 40;
8444-11B1-RK-TP
3m Electronic Products Division
8444-11B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. It is used on PLCC44 devices and has a min operating temperature of -40°C and max operating temperature of 105°C. The socket has 44 contacts, PHOSPHOR BRONZE contact material, and a bellowed type contact style.
2-1571552-3
TE Connectivity's 2-1571552-3 is a Chip Carrier IC Socket with PCB contact row spacing of 7.62mm and rectangular pattern. Made of thermoplastic polyester, it has 14 contacts, operates b/w -55°C to 105°C, and supports devices like DIP14. With solder termination, it offers a current rating of 3A and dielectric voltage withstand of 1400VAC.
XR2A-1611-N
IC SOCKET; Device Type Used On: DIP16; No. of Contacts: 16; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
M12883/54-04
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; JESD-609 Code: e4; No. of Contacts: 13; Contact Finish (Mating): GOLD;
1-2324271-2
TE Connectivity 1-2324271-2 is a POLYETHYLENE chip carrier socket for LGA4189 devices. With 2097 contacts, it supports 0.5A current rating and operates b/w -25°C to 100°C. Ideal for surface mount applications in various electronic systems.
2271390
Phoenix Contact
RELAY SOCKET; Device Type Used On: SIP8; Housing Material: POLYAMIDE; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED;
40-6508-311
Aries Electronics 40-6508-311 is a DIP40 IC socket with 40 contacts, featuring rectangular PCB contact pattern spaced at 15.24mm. Made of glass-filled nylon46, it has wire wrap termination and uses round pin sockets. Ideal for applications requiring precise connections on a 2x0.7x0.19" board with 0.1" pitch mating contacts.
ZA8-20-2-1.00-Z-10
Samtec
IC SOCKET;
XR2T-2471-N
IC SOCKET; Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
IC149-100-025-B5
Yamaichi Electronics
IC SOCKET; Device Type Used On: QFP100; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 100VAC; Housing Material: PLASTIC;
IC149-100-005-S5
Fujitsu
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; No. of Contacts: 100; JESD-609 Code: e0;
IC149-100-014-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 100; Contact Finish (Mating): GOLD;
IC149-100-014-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; JESD-609 Code: e0; No. of Contacts: 100; Contact Material: BERYLLIUM COPPER;
IC149-100-025-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Mating): TIN LEAD; No. of Contacts: 100; JESD-609 Code: e0;
IC149-100-028-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
IC149-100-054-B50
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Material: BERYLLIUM COPPER; No. of Contacts: 100; Contact Finish (Mating): GOLD;
IC149-100-054-B51
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BERYLLIUM COPPER;
IC149-100-054-S50
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD;
IC149-100-054-S51
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): TIN LEAD;
IC149-100-105-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD; Contact Material: BERYLLIUM COPPER;
IC149-100-114-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
IC149-100-114-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; JESD-609 Code: e0;
IC149-100-125-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD;
IC149-100-125-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Mating): TIN LEAD; JESD-609 Code: e0; Contact Material: BERYLLIUM COPPER;
IC149-100-128-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 100; Contact Material: BERYLLIUM COPPER;
IC149-100-154-B50
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Finish (Mating): GOLD; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
IC149-100-154-B51
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Mating): GOLD; No. of Contacts: 100; JESD-609 Code: e4;
IC149-100-154-S50
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e0;
IC149-100-154-S51
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): TIN LEAD; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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