Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Fujitsu IC149-100-025-B5 is a 100-contact QFP100 chip carrier socket with POLYPHENYLENE SULPHIDE housing. It features BERYLLIUM COPPER contacts finished in GOLD (Au) with Nickel (Ni) barrier. Ideal for IC SOCKET applications requiring reliable connections and durability.
Median Price
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Mouser Electronics
1+ parts
$97.400
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$77.480
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$289.208
$167.629
Nova Conductors
$77.460
Vyrian
Elcom Components
AZTECH Wire
$11.034
Continental Prestige Electronics
$75.911
Argo Parts USA
Netroflash
$73.587
$72.038
Perfect Parts
Polyphenylene sulphide is known for its high temperature resistance, making this chip carrier socket suitable for applications where heat dissipation is a concern.
Designed specifically for QFP100 devices, ensuring a precise and secure fit.
Beryllium copper provides excellent conductivity and durability, ensuring reliable electrical connections.
With 100 contacts, this chip carrier socket can accommodate a wide range of ICs and components, making it versatile for various applications.
Gold finish on the mating contacts ensures low contact resistance and long-term reliability for optimal performance.
The gold finish with nickel barrier provides corrosion resistance and prevents oxidation, ensuring stable electrical connections over time.
Designed as an IC socket, this product allows for easy insertion and removal of ICs, facilitating testing and maintenance procedures.
Chip Carrier IC & Component Sockets IC149-100-025-B5 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Fujitsu
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
IC149-100-025-B5 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Fujitsu Ltd delivers total solutions in the field of information and communication technology. The company provides solutions/system integration services focused on information system consulting and construction, and infrastructure services centered on outsourcing services. Fujitsu provides services across a wide range of countries and regions, including Europe, the Americas, Asia, and Oceania. It operates in three segments namely, Technology Solutions; Ubiqitous Solutions and Device Solutions. Ubiquitous Solutions consists of PCs, mobile phones, and mobilewear. In PCs, Fujitsu's lineup includes desktop and laptop PCs known for energy efficiency, security, and other enhanced features, as well as water- and dust-resistant tablets.
1N4148
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Baneasa S A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
Electronic Transistors
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
Asi Semiconductor
304-13-104-41-780000
Mill-max Mfg
Mill-max Mfg's 304-13-104-41-780000 is a POLYETHYLENE IC SOCKET for SIP4 devices with 4 GOLD OVER NICKEL contacts. Ideal for Chip Carrier IC & Component Sockets, featuring RECTANGLE contact configuration.
173-10-304-00-001000
173-10-304-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP4 devices with 4 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE configuration. Ideal for Chip Carrier IC & Component Sockets applications.
116-43-314-41-008000
116-43-314-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP14 devices with 14 contacts. Featuring MATTE TIN OVER NICKEL finish, it is ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
XR2T-2021-N
Omron
IC SOCKET; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD FLASH;
95.15.2
Finder
Finder's 95.15.2 is a RELAY SOCKET with 8 contacts, rated at 10A current. It has a PCB contact row spacing of 7.49mm and operates b/w -40 to 70°C. Ideal for applications requiring reliable relay connections in electronic circuits.
P2CF-11-E
Omron's P2CF-11-E chip carrier IC socket has 11 contacts, 5A current rating, and 1 billion ohm insulation resistance. It is used for relay devices with screw termination, offering a dielectric voltage of 2000VAC. Ideal for applications requiring a reliable and high-performance relay socket solution.
XR2A-2215
IC SOCKET; Manufacturer Series: XR2;
D01-9923246
Harwin Plc
IC SOCKET; Device Type Used On: SIP32; Housing Material: POLYAMIDE46; No. of Contacts: 32; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
1-2199298-6
TE Connectivity 1-2199298-6 is a Chip Carrier IC Socket with 20 contacts, 7.62mm PCB row spacing, and GLASS FILLED PBT housing material. It has a solder termination type and operates b/w -40°C to 105°C. Ideal for applications requiring a current rating of 1A in straight mounting style.
214-3339-00-0602
3m Electronic Products Division
IC SOCKET; Device Type Used On: ZIP14-DIP14; Housing Material: POLYSULFONE AND TORLON; No. of Contacts: 14;
XR2T-1601-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
HLS-1204-TT-31
Samtec
The Samtec HLS-1204-TT-31 is a POLYETHYLENE chip carrier socket for PGA48 devices with 48 contacts. It features Tin contact finish for mating and Tin (Sn) with Nickel (Ni) barrier for termination. Ideal for IC applications requiring reliable connections in electronic assemblies.
1571541-1
TE Connectivity's 1571541-1 is a PLCC44 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 44 copper alloy contacts, it has a dielectric voltage of 600VAC and insulation resistance of 10^10 ohm. With a current rating of 1A, it operates b/w -55°C to 125°C, making it ideal for chip carrier applications.
1-2199298-1
TE Connectivity's 1-2199298-1 is a DIP6 IC socket with 6 contacts, bellowed type contact style, and solder termination. It has a PCB contact row spacing of 7.62mm and is used in applications requiring a mating contact pitch of 0.1 inch and dielectric voltage withstand of 1000VAC.
54020-32030LF
Amphenol Communications Solutions
The Amphenol Communications Solutions 54020-32030LF is a PLCC32 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 32 contacts, it has a dielectric voltage of 910VAC and insulation resistance of 1G ohm. Ideal for chip carrier applications, it operates b/w -40°C to 105°C with a current rating of 1A.
RXZE2S111M
Schneider Electric Sa
RELAY SOCKET;
XR2A-2401-N
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
XR3G-3211
IC SOCKET; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
1047028
Phoenix Contact
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
1-822473-7
Tyco Electronics Amp
IC SOCKET; Device Type Used On: PLCC84; Housing Material: POLYETHYLENE; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 84;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
IC149-100-025-B5
Yamaichi Electronics
IC SOCKET; Device Type Used On: QFP100; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 100VAC; Housing Material: PLASTIC;
IC149-100-005-S5
Fujitsu
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; No. of Contacts: 100; JESD-609 Code: e0;
IC149-100-014-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 100; Contact Finish (Mating): GOLD;
IC149-100-014-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; JESD-609 Code: e0; No. of Contacts: 100; Contact Material: BERYLLIUM COPPER;
IC149-100-025-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Mating): TIN LEAD; No. of Contacts: 100; JESD-609 Code: e0;
IC149-100-028-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
IC149-100-054-B50
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Material: BERYLLIUM COPPER; No. of Contacts: 100; Contact Finish (Mating): GOLD;
IC149-100-054-B51
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BERYLLIUM COPPER;
IC149-100-054-S50
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD;
IC149-100-054-S51
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): TIN LEAD;
IC149-100-105-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD; Contact Material: BERYLLIUM COPPER;
IC149-100-114-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
IC149-100-114-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; JESD-609 Code: e0;
IC149-100-125-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD;
IC149-100-125-S5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Mating): TIN LEAD; JESD-609 Code: e0; Contact Material: BERYLLIUM COPPER;
IC149-100-128-B5
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 100; Contact Material: BERYLLIUM COPPER;
IC149-100-154-B50
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Finish (Mating): GOLD; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
IC149-100-154-B51
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Finish (Mating): GOLD; No. of Contacts: 100; JESD-609 Code: e4;
IC149-100-154-S50
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; No. of Contacts: 100; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e0;
IC149-100-154-S51
IC SOCKET; Device Type Used On: QFP100; Housing Material: POLYPHENYLENE SULPHIDE; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): TIN LEAD; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
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