Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC-306-WGT by Samtec is a Chip Carrier IC Socket with 6 contacts. It features Beryllium Copper contact material, Gold finish for mating, and Tin over Nickel/Copper termination. This rectangular socket is made of Polyester and designed for DIP6 devices.
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Polyester is a durable and lightweight material, providing reliability and strength to the chip carrier IC & component sockets.
Designed specifically for DIP6 devices, ensuring a perfect fit and optimal performance.
Beryllium copper offers excellent conductivity and is highly durable, providing reliable contacts for the IC socket.
Having 6 contacts allows for a secure connection and efficient data transfer between the socket and the device.
Gold plating over nickel ensures a low contact resistance and excellent signal transmission, reducing the risk of corrosion.
The termination process using tin over nickel/copper provides a reliable and durable connection for the IC socket.
Being an IC socket type, this product is versatile and can accommodate a wide range of devices, making it a practical choice for various applications.
The rectangular contact configuration ensures a secure and stable connection between the socket and the device, reducing the risk of signal loss or disconnection.
Chip Carrier IC & Component Sockets IC-306-WGT attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
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IC-306-WGT Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
1N4148
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
1N4148WS
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
MC7805CTG
Onsemi
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Synsemi
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
1N4148WT
Tak Cheong Electronics Holdings
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
Rochester Electronics
326-93-107-41-002000
Mill-max Mfg
326-93-107-41-002000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for SIP7 devices with 7 contacts. Features GOLD (30) over NICKEL (100) mating finish and Tin/Lead termination. Ideal for rectangular contact configuration in electronic applications.
XR2D-1801-N
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30);
XR2A-4002
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
210-93-308-41-001000
210-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.
2-1571552-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT PLASTIC POLYESTER; JESD-609 Code: e3; Contact Finish (Termination): TIN OVER NICKEL; Contact Material: BERYLLIUM COPPER;
XR2A-4805
IC SOCKET; Manufacturer Series: XR2;
SS5-20-3.50-L-D-K-TR
Samtec
IC SOCKET;
5663
Pomona Electronics
IC SOCKET; Device Type Used On: PLCC52; Manufacturer Series: 5663; No. of Contacts: 52; Additional Features: PLCC SOCKET, 94V-0;
PR2-BSP3/4X21
Phoenix Contact
RELAY SOCKET;
8448-001
Amphenol Communications Solutions
Amphenol's 8448-001 IC Socket features staggered contact configuration with 335 contacts on a LGA335 device. With a PCB row spacing of 1.27mm and surface mount termination, it is ideal for straight mounting on PCBs. The socket uses glass-filled polyetherimide housing material for durability in electronic applications.
441-PRS21001-12
Aries Electronics
441-PRS21001-12 by Aries Electronics is a PGA441 IC socket with 441 contacts, 2.54mm terminal pitch, and gold over nickel contact finish. It features a rectangular PCB contact pattern and polyphenylene sulfide housing material. Ideal for applications requiring high-density chip carrier components on printed circuit boards.
VCF4-1000
TE Connectivity
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; No. of Contacts: 1;
TE Connectivity's 2-1571552-3 is a Chip Carrier IC Socket with PCB contact row spacing of 7.62mm and rectangular pattern. Made of thermoplastic polyester, it has 14 contacts, operates b/w -55°C to 105°C, and supports devices like DIP14. With solder termination, it offers a current rating of 3A and dielectric voltage withstand of 1400VAC.
2-1571586-2
TE Connectivity's 2-1571586-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, rectangular pattern, and thermoplastic housing. It has 8 contacts, solder termination, and operates b/w -55°C to 105°C. Ideal for applications requiring a mating pitch of 0.1 inch and current rating of 3A in straight mounting style.
CQF208-168B
Texas Instruments
IC SOCKET; Device Type Used On: QFP208; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 208;
240-3639-00-0602J
3m Electronic Products Division
3M Electronic Products Division's 240-3639-00-0602J is a DIP40 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. Featuring 40 gold-over-nickel contacts, it is ideal for chip carrier applications requiring reliable connections.
3-1393310-7
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 1; Termination Type: SOLDER;
203-2737-55-1102
203-2737-55-1102 by 3M Electronic Products Division is a chip carrier IC socket with POLYPHENYLENE SULFIDE housing and BERYLLIUM COPPER contacts. It features 3 gold-over-nickel contacts for mating and termination. Ideal for electronic applications requiring reliable connections in IC sockets.
XR2A-2221-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
XR2T-4011-N
IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (10); Contact Finish (Termination): GOLD;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
IC-306-AGG
IC SOCKET; Device Type Used On: DIP6; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYESTER;
IC-306-AGT
IC-306-EGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): TIN OVER NICKEL/TIN OVER COPPER; Contact Config: RECTANGLE;
IC-306-JGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e3; Additional Features: STANDARD: UL 94V-0;
IC-306-KGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; JESD-609 Code: e3; Contact Material: BERYLLIUM COPPER; Contact Config: RECTANGLE;
IC-306-SGG-L
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 6;
IC-306-SGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0;
IC-306-WGG-2
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL; JESD-609 Code: e4;
IC-306-WGG-3
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30) OVER NICKEL; Contact Config: RECTANGLE;
IC-306-WGG
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Config: RECTANGLE;
IC-306-WGT-2
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
IC-306-WGT-3
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BERYLLIUM COPPER; Additional Features: STANDARD: UL 94V-0;
IC-306-WTT-2
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL; TIN OVER COPPER; Contact Material: BERYLLIUM COPPER;
IC-306-WTT-3
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Mating): TIN OVER NICKEL/TIN OVER COPPER; Contact Config: RECTANGLE; Additional Features: STANDARD: UL 94V-0;
IC-306-WTT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Config: RECTANGLE; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): TIN OVER NICKEL/TIN OVER COPPER;
IC-306-ZSGT-L
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (30) OVER NICKEL;
IC-306-ZSGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Additional Features: UL 94V-0, LOW INSERTION FORCE; Contact Finish (Mating): GOLD (30) OVER NICKEL; No. of Contacts: 6;
IC-306-ZSTT-L
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6;
IC-306-ZWGT-2
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL; No. of Contacts: 6;
IC-306-K
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; No. of Contacts: 6; Additional Features: STANDARD: UL 94V-0; Contact Config: RECTANGLE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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