Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC-306-WGT by Samtec is a Chip Carrier IC Socket with 6 contacts. It features Beryllium Copper contact material, Gold finish for mating, and Tin over Nickel/Copper termination. This rectangular socket is made of Polyester and designed for DIP6 devices.
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Polyester is a durable and lightweight material, providing reliability and strength to the chip carrier IC & component sockets.
Designed specifically for DIP6 devices, ensuring a perfect fit and optimal performance.
Beryllium copper offers excellent conductivity and is highly durable, providing reliable contacts for the IC socket.
Having 6 contacts allows for a secure connection and efficient data transfer between the socket and the device.
Gold plating over nickel ensures a low contact resistance and excellent signal transmission, reducing the risk of corrosion.
The termination process using tin over nickel/copper provides a reliable and durable connection for the IC socket.
Being an IC socket type, this product is versatile and can accommodate a wide range of devices, making it a practical choice for various applications.
The rectangular contact configuration ensures a secure and stable connection between the socket and the device, reducing the risk of signal loss or disconnection.
Chip Carrier IC & Component Sockets IC-306-WGT attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
Compatible Device Type:
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IC-306-WGT Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA/2K5
Texas Instruments
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
General Semiconductor
2N2222A
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
1N4148
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
304-13-128-41-780000
Mill-max Mfg
Mill-max Mfg's 304-13-128-41-780000 is a POLYETHYLENE Chip Carrier IC Socket for SIP28 devices with 28 GOLD OVER NICKEL contacts. Ideal for applications requiring RECTANGLE contact configuration.
MT78745
TE Connectivity
IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
8444-21B1-RK-TP
3m Electronic Products Division
8444-21B1-RK-TP by 3M is a PLCC44 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring 44 contacts in a bellowed contact style, it has an insulation resistance of 1G ohm. With a temperature range of -40 to 105 °C, it is ideal for surface mount applications.
ICF-628-T-O-TR
Samtec
Samtec's ICF-628-T-O-TR is a Chip Carrier IC Socket with 28 contacts, featuring a rectangular contact pattern and liquid crystal polymer housing. It has a mating contact pitch of 0.1", suitable for DIP28 devices. With surface mount termination, it operates b/w -55°C to 125°C, ideal for various electronic applications.
XR2C-3225
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD FLASH; Manufacturer Series: XR2; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
HLT-1910-T-R
The Samtec HLT-1910-T-R is a plastic IC socket with 190 brass contacts, featuring Tin over Nickel mating finish. Designed for PGA190 devices, it offers reliable connectivity and durability in chip carrier applications. Ideal for high-performance electronic systems requiring secure component sockets.
XR2D-2801-N
IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
IC160Z-0204-240
Yamaichi Electronics
Yamaichi Electronics' IC160Z-0204-240 is a POLYAMIDE chip carrier socket for PLCC20 devices with 20 contacts. Featuring COPPER ALLOY contacts, it has an insulation resistance of 500MΩ and dielectric voltage of 350VAC. Ideal for surface mount applications, this socket has a current rating of 1A and bellowed contact style.
218-7223-55-1902
218-7223-55-1902 by 3M Electronic Products Division is a SOIC18 IC socket with POLYETHERSULFONE housing and BERYLLIUM COPPER contacts. It features 18 gold-over-nickel contacts for mating and termination, making it ideal for chip carrier IC applications.
342-90-139-00-592000
Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
8PFA
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
PR1-BSP3/2X21
Phoenix Contact
RELAY SOCKET;
7-1393161-3
IC SOCKET; Housing Material: POLYAMIDE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
7-1437539-6
TE Connectivity 7-1437539-6 is a DIP24 IC SOCKET with 24 contacts, rated at 3A current. It has a PCB contact row spacing of 7.49mm and uses SOLDER termination. Ideal for applications requiring a RECTANGULAR PCB contact pattern and POLYESTER housing material.
326-93-108-41-003000
Mill-max Mfg's 326-93-108-41-003000 is a PLASTIC IC SOCKET for SIP8 devices with 8 contacts. Features GOLD (30) OVER NICKEL (100) finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
3-1393310-7
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 1; Termination Type: SOLDER;
XR2A-0825
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
27E043
IC SOCKET; Housing Material: NYLON; No. of Contacts: 11; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
169-PRS13001-12
Aries Electronics
Aries Electronics 169-PRS13001-12 is a PGA169 IC socket with 169 contacts, featuring a rectangular PCB contact pattern spaced at 2.54mm. It uses gold over nickel finish for mating contacts and has a temperature range of -65 to 125°C. Ideal for applications requiring reliable chip carrier connections in electronic devices.
XR2B-2401-N
IC SOCKET; Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
IC-306-AGG
IC SOCKET; Device Type Used On: DIP6; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYESTER;
IC-306-AGT
IC-306-EGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): TIN OVER NICKEL/TIN OVER COPPER; Contact Config: RECTANGLE;
IC-306-JGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e3; Additional Features: STANDARD: UL 94V-0;
IC-306-KGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; JESD-609 Code: e3; Contact Material: BERYLLIUM COPPER; Contact Config: RECTANGLE;
IC-306-SGG-L
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 6;
IC-306-SGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0;
IC-306-WGG-2
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL; JESD-609 Code: e4;
IC-306-WGG-3
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30) OVER NICKEL; Contact Config: RECTANGLE;
IC-306-WGG
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Config: RECTANGLE;
IC-306-WGT-2
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
IC-306-WGT-3
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BERYLLIUM COPPER; Additional Features: STANDARD: UL 94V-0;
IC-306-WTT-2
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL; TIN OVER COPPER; Contact Material: BERYLLIUM COPPER;
IC-306-WTT-3
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Mating): TIN OVER NICKEL/TIN OVER COPPER; Contact Config: RECTANGLE; Additional Features: STANDARD: UL 94V-0;
IC-306-WTT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Config: RECTANGLE; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): TIN OVER NICKEL/TIN OVER COPPER;
IC-306-ZSGT-L
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (30) OVER NICKEL;
IC-306-ZSGT
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Additional Features: UL 94V-0, LOW INSERTION FORCE; Contact Finish (Mating): GOLD (30) OVER NICKEL; No. of Contacts: 6;
IC-306-ZSTT-L
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6;
IC-306-ZWGT-2
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL; No. of Contacts: 6;
IC-306-K
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYESTER; No. of Contacts: 6; Additional Features: STANDARD: UL 94V-0; Contact Config: RECTANGLE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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