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390262-2-2

TE Connectivity

390262-2-2 by TE Connectivity

IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Chip Carrier IC & Component Sockets 390262-2-2 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity

Connectivity

Number of Positions or Pins:

28

Contact Finish - Mating:

TIN LEAD (60)

Contact Finish - Termination:

Tin Lead (60)

Contact Configuration:

Rectangle

Contact Style:

Installation Type:

Solder

Mating Contact Pitch:

0.1 in (2.54 mm)

PCB Contact Row Spacing:

0.6 in (15.24 mm)

Terminal Pitch:

0.1 in (2.54 mm)

Mounting Style:

PCB Contact Layout:

Rectangular

Physical Characteristics

IC Socket Type:

Length:

1.4 inch

Width:

0.697 in (17.704 mm)

Depth:

0.201 in (5.105 mm)

JESD-609 Code:

e0

Electrical Characteristics

Current Rating:

1 A

Dielectric Withstanding Voltage:

Insulation Resistance:

1 GΩ

Thermal Characteristics

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Compatibility

Compatible Device Type:

Trade Compliance

390262-2-2 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

Manufacturer Highlights

TE Connectivity

TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Terrence R. Curtin

Executive VP, CFO

Heath A. Mitts

Senior VP, Principal Accounting Officer

Robert J. Ott

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