Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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150-80-316-00-018101 by Preci-dip Sa is a DIP16 IC socket with housing made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It features 16 brass contacts with Tin finish for mating and termination. Ideal for chip carrier IC applications requiring reliable connections in electronic devices.
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$2.240
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Nova Conductors
$0.985
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$0.965
$0.926
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Argo Parts USA
AZTECH Wire
$10.409
This material provides excellent heat resistance and durability, making the product suitable for high temperature applications.
Designed to be used specifically with DIP16 devices, ensuring a perfect fit and secure connection.
Brass contacts offer superior conductivity and corrosion resistance, ensuring a reliable electrical connection.
With 16 contacts, this socket can accommodate a wide range of integrated circuit chips, providing versatility.
Tin contact finish improves solderability and conductivity, enhancing the performance of the product.
Tin termination provides a stable and durable connection, reducing the risk of signal loss or interruptions.
This socket type is specifically designed for integrated circuit components, ensuring a secure and reliable connection for the chip.
Chip Carrier IC & Component Sockets 150-80-316-00-018101 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Preci-dip Sa
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
150-80-316-00-018101 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
The northwest of Switzerland has a rich tradition in precision technology. At PRECI-DIP we take that to the future. Everything under one roof: expertise and dedication connected to the know-how of developing outstanding Swiss quality. At PRECI-DIP we build on a unique approach to vertical integration: Mastering all key process steps in-house enables us to provide effective and creative interconnect solutions. Swiss World Connects high-precision interconnect solutions and integrated understanding of customer needs.
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
LM2931Z-5.0G
Onsemi
LM2931Z-5.0G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V output voltage, 0.6V dropout voltage, and 0.1A output current. It is ideal for applications requiring stable power supply in temperature-sensitive environments due to its operating range of -40°C to 125°C.
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
MC33269T-3.3G
MC33269T-3.3G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.35 V. It is commonly used in applications that require stable voltage regulation, such as power supplies for electronic devices.
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
Taiwan Semiconductor
818-22-016-10-000101
Mill-max Mfg
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
SH2B-05
Idec
SH2B-05 by Idec is a chip carrier IC socket with 8 blade pin-skt contacts, rated for 10A current. It is designed for use on relays with screw termination, measuring 2.736" L x 1.181" W x 0.984" D. Ideal for applications requiring reliable connection and secure mounting in industrial settings.
P2RF-08
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
9-1437539-2
TE Connectivity
TE Connectivity 9-1437539-2 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for applications requiring a housing material of polyester. The socket has a min operating temperature of -55°C and max of 125°C, with solder termination type.
1SVR405651R3100
Abb
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
304-13-104-41-770000
The Mill-max Mfg 304-13-104-41-770000 is a POLYETHYLENE chip carrier IC socket for SIP4 devices with 4 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for various electronic applications.
XR2T-1611-N
IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER;
110-83-314-41-001101
Preci-dip Sa
110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.
2-1904045-4
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 5; Termination Type: SOLDER; Contact Material: NOT SPECIFIED;
XR2T-2021-N
IC SOCKET; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD FLASH;
4828-6000-CP
3m Electronic Products Division
The 3m Electronic Products Division's 4828-6000-CP is a Chip Carrier IC Socket with 28 contacts, made of Glass Filled Polyester. It has a PCB contact row spacing of 15.24mm and operates b/w -25°C to 85°C. Ideal for DIP28 devices, it features solder termination and a mating contact pitch of 0.1 inch.
94.04SMA
Finder
RELAY SOCKET; No. of Contacts: 14;
RXZE2S111M
Schneider Electric Sa
RELAY SOCKET;
6-1437514-6
TE Connectivity 6-1437514-6 is a Chip Carrier IC Socket with PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. It operates b/w -65°C to 125°C, making it ideal for various electronic applications requiring reliable connections in extreme temperature conditions.
ICF-324-F-O
Samtec
Samtec's ICF-324-F-O is a Chip Carrier IC Socket with 24 contacts, 0.1" pitch, and gold flash over nickel finish. It has a body size of 1.2"x0.375"x0.18" and operates b/w -55°C to 125°C. Ideal for DIP24 devices in applications requiring high insulation resistance and dielectric voltage withstand capabilities.
RSE116685
Amphenol
Amphenol's RSE116685 is a RELAY SOCKET with 8 GOLD contacts. Made of POLYETHERIMIDE, it operates b/w -65°C to 125°C. Ideal for Chip Carrier ICs, this socket ensures reliable connections in various electronic applications.
XR2A-1625
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
27E894
TE Connectivity 27E894 is a GLASS FILLED POLYESTER IC SOCKET with SCREW termination, suitable for RELAY devices. Featuring 14 RND PIN-SKT contacts with Tin finish (Sn), it offers reliable connectivity in chip carrier applications.
1-1571994-0
TE Connectivity's 1-1571994-0 is a RECTANGULAR Chip Carrier IC Socket made of THERMOPLASTIC POLYESTER. With 10 RND PIN-SKT contacts on a 0.1" pitch, it's used for SIP10 devices with SOLDER termination, ideal for PCB applications.
XR2D-1804
IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
150-80-316-00-006101
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; JESD-609 Code: e3; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): TIN;
150-80-324-00-018101
150-80-324-00-018101 by Preci-dip Sa is a DIP24 IC socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing material and BRASS contact material. It has 24 contacts with TIN mating finish and Tin (Sn) termination finish. This IC socket is commonly used for chip carrier applications.
150-80-316-00-001101
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; Contact Finish (Termination): TIN; Contact Material: BRASS; No. of Contacts: 16;
150-80-316-00-106161
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER;
150-80-316-00-106191
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Material: BRASS; JESD-609 Code: e3;
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