Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
Median Price
$29.003
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
VNN
AZTECH Wire
$6.393
Ampacity Inc.
$57.000
Bastille Electronics
Chip Carrier IC & Component Sockets 818-22-062-10-004101 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
818-22-062-10-004101 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
M39029/58-360
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
SMBJ18CA
Micro Commercial Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
KYOCERA AVX
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
EU2B-YS2J03F
Idec
ROTARY SWITCH;
MBR1560CT
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
334-90-142-00-020000
Mill-max Mfg
Mill-max Mfg 334-90-142-00-020000 is a PLASTIC IC SOCKET for SIP42 devices with 42 contacts. Features TIN LEAD (200) OVER NICKEL (150) finish, ideal for Chip Carrier IC & Component Sockets applications.
304-13-128-41-770000
The Mill-max Mfg 304-13-128-41-770000 is a POLYETHYLENE chip carrier IC socket with 28 contacts, GOLD OVER NICKEL finish. It is designed for SIP28 devices, featuring RECTANGLE contact configuration. Ideal for high-performance electronic applications requiring reliable and durable component sockets.
P2R-087P
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
415-43-236-41-001000
Mill-max Mfg's 415-43-236-41-001000 is a POLYETHYLENE chip carrier socket for SIP36 devices with 36 TIN contacts. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration and reliable termination finish.
08-3518-10
Aries Electronics
Aries Electronics 08-3518-10 is a DIP8 IC socket with 0.1" contact pitch, suitable for surface mount termination. It features brass contacts with gold finish, rated at 3A current. Ideal for applications requiring chip carrier sockets on PCBs with rectangular contact pattern and 7.62mm row spacing.
PT11QN
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE;
4-1571551-9
TE Connectivity
IC SOCKET; Device Type Used On: DIP28; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-THERMOPLASTIC POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 28;
2-1437506-0
IC SOCKET; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; No. of Contacts: 1; Termination Type: PRESS FIT;
PY08QN
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
134-10-328-00-000000
134-10-328-00-000000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
P6B-26P
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6; Additional Features: STANDARDS: CSA; UL;
CQF100M-155A
Texas Instruments
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 100; Manufacturer Series: CQF;
1-2199298-2
TE Connectivity 1-2199298-2 is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features glass-filled PBT housing material, solder termination, and operates b/w -40°C to 105°C. Ideal for applications requiring a mating pitch of 0.1 inch in straight mounting style.
816-22-057-10-000101
IC SOCKET; Device Type Used On: SIP57; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 57; Contact Finish (Termination): GOLD OVER NICKEL;
PL08-Q
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
390261-4
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
4-1437508-0
TRANSISTOR SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
818-22-024-10-002101
IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
110-43-628-41-001000
110-43-628-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material, 28 contacts, and Matte Tin over Nickel termination. It is designed for use on DIP28 devices, featuring a rectangular contact configuration suitable for various electronic applications.
110-93-308-41-001000
110-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
818-22-058-10-001101
IC SOCKET; Device Type Used On: DIP58; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0;
818-22-012-10-001101
IC SOCKET; Device Type Used On: DIP12; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 12; Contact Finish (Termination): GOLD OVER NICKEL;
818-22-016-10-000101
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
818-22-062-10-000101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 62; Contact Finish (Mating): NOT SPECIFIED;
818-22-062-10-002101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Contact Finish (Termination): GOLD OVER NICKEL; No. of Contacts: 62; JESD-609 Code: e4;
818-22-062-10-003101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Contact Finish (Termination): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
818-22-062-10-005101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; JESD-609 Code: e4; No. of Contacts: 62; Additional Features: STANDARD: UL 94V-0;
818-22-062-10-007101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; Additional Features: STANDARD: UL 94V-0; Contact Finish (Termination): GOLD OVER NICKEL;
818-22-062-10-008101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; JESD-609 Code: e4; No. of Contacts: 62; Contact Finish (Mating): NOT SPECIFIED;
818-22-062-10-009101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; No. of Contacts: 62; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): NOT SPECIFIED;
818-22-062-10-001101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED;
818-22-062-10-006101
IC SOCKET; Device Type Used On: DIP62; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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