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OMAPL132EZWTA2R

Texas Instruments

OMAPL132EZWTA2R by Texas Instruments

OMAPL132EZWTA2R by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at 200 rpm speed and has a max supply voltage of 1.32 V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in a compact form factor.

Median Price

$12.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,149 parts In-Stock

1+ parts

$12.990

100+ parts

$11.346

1k+ parts

$7.825

10k+ parts

-

14,149

$12.990

$11.346

$7.825

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$10.985

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$10.985

-

-

-

Digiode

USA . 4,189 parts In-Stock

1+ parts

$12.340

100+ parts

-

1k+ parts

-

10k+ parts

-

4,189

$12.340

-

-

-

Vyrian

USA . 4,422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,422

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,769 parts In-Stock

1+ parts

$10.739

100+ parts

-

1k+ parts

-

10k+ parts

$10.525

2,769

$10.739

-

-

$10.525

Ampacity Inc.

Singapore . 14,083 parts In-Stock

1+ parts

$11.040

100+ parts

-

1k+ parts

-

10k+ parts

-

14,083

$11.040

-

-

-

Corphita

USA . 2,324 parts In-Stock

1+ parts

$11.691

100+ parts

-

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-

10k+ parts

-

2,324

$11.691

-

-

-

Corohmni

South Africa . 1,116 parts In-Stock

1+ parts

$12.274

100+ parts

-

1k+ parts

-

10k+ parts

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1,116

$12.274

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-

-

AZTECH Wire

Italy . 625 parts In-Stock

1+ parts

$12.460

100+ parts

-

1k+ parts

-

10k+ parts

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625

$12.460

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Microchip USA

USA . 3,094 parts In-Stock

1+ parts

$30.070

100+ parts

$29.640

1k+ parts

$29.430

10k+ parts

$29.210

3,094

$30.070

$29.640

$29.430

$29.210

Parana Technologies

USA . 1,211 parts In-Stock

1+ parts

$53.555

100+ parts

$4,973.381

1k+ parts

$48.199

10k+ parts

-

1,211

$53.555

$4,973.381

$48.199

-

DigiPath Technology Company

USA . 2,143 parts In-Stock

1+ parts

$58.971

100+ parts

-

1k+ parts

-

10k+ parts

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2,143

$58.971

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-

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ChromeModa Solutions

Germany . 3,387 parts In-Stock

1+ parts

$60.174

100+ parts

$49.343

1k+ parts

-

10k+ parts

-

3,387

$60.174

$49.343

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IDEA Electronic Components Group

UK . 1,672 parts In-Stock

1+ parts

$60.174

100+ parts

$57.165

1k+ parts

$54.157

10k+ parts

-

1,672

$60.174

$57.165

$54.157

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Component Stockers USA

USA . 170 parts In-Stock

1+ parts

$173.520

100+ parts

-

1k+ parts

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10k+ parts

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170

$173.520

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Argo Parts USA

USA . 3,236 parts In-Stock

1+ parts

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100+ parts

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3,236

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments OMAPL132EZWTA2R. Manufactured by a trusted name in the industry, this microprocessor circuit offers unparalleled performance and reliability. Ideal for a wide range of applications, this product guarantees seamless operation and efficiency. Experience the value and benefits of this top-of-the-line peripheral IC, designed to exceed your expectations. Say goodbye to limitations and hello to endless possibilities with the OMAPL132EZWTA2R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for various applications.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Maximum Supply Voltage: 1.32 V

Provides a high supply voltage limit for robust performance in demanding environments.

Package Shape: SQUARE

The square shape allows for efficient use of space and easy alignment during assembly.

No. of Terminals: 361

With a high number of terminals, this product offers a wide range of connectivity options.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This style ensures a compact design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Provides a low supply voltage limit for energy efficiency and power savings.

Maximum Operating Temperature: 105 °C

With a high operating temperature limit, the product can withstand heat-intensive environments.

Minimum Operating Temperature: -40 °C

The low operating temperature limit allows for reliable performance in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides a good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy connection and secure placement on the PCB.

Maximum Seated Height: 1.4 mm

The low seated height makes it suitable for slim and compact applications.

Width: 16 mm

The width of 16mm allows for easy integration into various electronic devices or systems.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures proper reflow soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand soldering processes effectively.

Length: 16 mm

The length of 16mm provides a compact footprint, suitable for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Features a sophisticated microprocessor circuit for advanced functionality and control capabilities.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ideal for energy-efficient applications.

Terminal Form: BALL

The ball terminal form ensures secure connections and efficient heat dissipation.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V provides stable power for consistent performance.

Terminal Pitch: 0.8 mm

The tight terminal pitch allows for high-density mounting on PCBs, suitable for compact layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the product can withstand moderate exposure to moisture during storage and handling.

Speed: 200 rpm

With a speed of 200 rpm, the product is capable of fast and efficient data processing.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL132EZWTA2R attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL132EZWTA2R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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