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OMAPL138EZWTA3R

Texas Instruments

OMAPL138EZWTA3R by Texas Instruments

OMAPL138EZWTA3R by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 105 °C, making it suitable for various applications requiring high-speed processing and reliable performance. Compatible with I2C, SPI, UART, and USB buses, this device is ideal for industrial automation systems and embedded computing solutions.

Median Price

$37.430

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,309 parts In-Stock

1+ parts

$24.115

100+ parts

$21.064

1k+ parts

$14.527

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10,309

$24.115

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$14.527

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Mouser Electronics

USA . 1,318 parts In-Stock

1+ parts

$37.430

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$26.820

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$24.410

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1,318

$37.430

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$24.410

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DigiKey

USA . 1,153 parts In-Stock

1+ parts

$37.430

100+ parts

$26.813

1k+ parts

$24.900

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1,153

$37.430

$26.813

$24.900

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$22.501

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100

$22.501

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Digiode

USA . 4,304 parts In-Stock

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$22.909

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Vyrian

USA . 4,091 parts In-Stock

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Chip Stock

USA . 3,330 parts In-Stock

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3,330

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ComSIT Distribution GmbH

Germany . 3,185 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 4,060 parts In-Stock

1+ parts

$20.500

100+ parts

$19.988

1k+ parts

$19.885

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4,060

$20.500

$19.988

$19.885

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Ampacity Inc.

Singapore . 3,908 parts In-Stock

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$20.500

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$20.500

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Corphita

USA . 2,767 parts In-Stock

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$21.704

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Continental Prestige Electronics

USA . 3,015 parts In-Stock

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$22.501

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$22.051

3,015

$22.501

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$22.051

Netroflash

USA . 100 parts In-Stock

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$22.501

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$22.501

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Corohmni

South Africa . 415 parts In-Stock

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$22.792

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$22.792

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Parana Technologies

USA . 2,291 parts In-Stock

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$71.099

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IDEA Electronic Components Group

UK . 2,127 parts In-Stock

1+ parts

$79.886

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$75.892

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$71.897

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2,127

$79.886

$75.892

$71.897

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ChromeModa Solutions

Germany . 119 parts In-Stock

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$79.886

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$65.507

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119

$79.886

$65.507

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Lixinc

USA . 5,856 parts In-Stock

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Argo Parts USA

USA . 2,532 parts In-Stock

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Perfect Parts

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DigiPath Technology Company

USA . 872 parts In-Stock

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$72.025

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Overview

Unlock the power of cutting-edge technology with the OMAPL138EZWTA3R by Texas Instruments. This innovative microprocessor circuit offers unparalleled performance and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this product boasts a multitude of benefits including high-speed processing, low power consumption, and versatile connectivity options. Experience seamless operation and enhanced efficiency with the OMAPL138EZWTA3R, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the overall longevity of the product.

Surface Mount: YES

Being surface mountable, this product is easy to integrate onto PCBs, saving space and allowing for efficient assembly.

Maximum Supply Voltage: 1.35 V

The high maximum supply voltage allows for flexibility in power input options, making the product compatible with a variety of systems.

Package Shape: SQUARE

The square shape of the package provides a symmetrical and compact design, ideal for space-constrained applications.

No. of Terminals: 361

With a high number of terminals, this product offers extensive connectivity options, making it versatile for various interfacing requirements.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high-density mounting, improving signal integrity and overall performance.

Minimum Supply Voltage: 1.25 V

The low minimum supply voltage ensures efficient power consumption, contributing to energy savings and longer battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions, ensuring reliability in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes the product suitable for use in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish ensures good electrical conductivity and resistance to corrosion, enhancing the product's reliability.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to a slim profile, making the product suitable for compact devices and applications.

Width: 16 mm

The compact width of the product enables space-efficient PCB layout designs, optimizing system integration and overall board real estate usage.

External Data Bus Width: 32

With a wide external data bus width of 32, this product supports high-speed data transfer, enhancing system performance and responsiveness.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for fast data processing speed, making the product suitable for applications that demand real-time performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper solder reflow process, preventing component damage and ensuring reliable connections.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the reflow soldering process, guaranteeing robust solder joints for stable operation.

Length: 16 mm

The compact length of the product complements its square shape, contributing to a space-efficient design suitable for miniaturized applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product meets stringent environmental and reliability standards, ensuring robust performance in demanding conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Equipped with a microprocessor circuit, this product offers advanced processing capabilities and versatile peripheral functionalities, making it suitable for complex applications.

Technology: CMOS

Utilizing CMOS technology, this product ensures low power consumption and high noise immunity, enhancing energy efficiency and system reliability.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and reliable connections, making the product suitable for automated assembly processes.

Nominal Supply Voltage: 1.3 V

The specified nominal supply voltage provides a stable operating voltage, ensuring consistent performance and compatibility with various power sources.

Bus Compatibility: I2C; SPI; UART; USB

With support for I2C, SPI, UART, and USB bus protocols, this product offers versatile connectivity options, enabling seamless integration into diverse systems.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting, enabling compact PCB designs and efficient use of available space.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product exhibits moderate sensitivity to moisture, necessitating proper handling and storage to maintain component integrity.

Speed: 456 rpm

With a speed of 456 rpm, this product offers rapid data processing and transfer capabilities, enhancing overall system performance and responsiveness.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZWTA3R attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZWTA3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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