Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
OMAPL138EZWTA3R by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 105 °C, making it suitable for various applications requiring high-speed processing and reliable performance. Compatible with I2C, SPI, UART, and USB buses, this device is ideal for industrial automation systems and embedded computing solutions.
Median Price
$40.870
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Texas Instruments
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Mouser Electronics
$29.390
$27.340
DigiKey
$29.410
$28.427
Nova Conductors
$22.501
Digiode
$22.909
Vyrian
Chip Stock
ComSIT Distribution GmbH
Semicontronic
$20.500
$19.988
$19.885
Ampacity Inc.
Corphita
$21.704
Continental Prestige Electronics
$22.051
Netroflash
Corohmni
$22.792
Parana Technologies
$71.099
IDEA Electronic Components Group
$79.886
$75.892
$71.897
ChromeModa Solutions
$65.507
Lixinc
Argo Parts USA
Perfect Parts
DigiPath Technology Company
$72.025
The use of plastic/epoxy material makes the package lightweight and durable, ensuring the overall longevity of the product.
Being surface mountable, this product is easy to integrate onto PCBs, saving space and allowing for efficient assembly.
The high maximum supply voltage allows for flexibility in power input options, making the product compatible with a variety of systems.
The square shape of the package provides a symmetrical and compact design, ideal for space-constrained applications.
With a high number of terminals, this product offers extensive connectivity options, making it versatile for various interfacing requirements.
The grid array, low profile, and fine pitch package style enables high-density mounting, improving signal integrity and overall performance.
The low minimum supply voltage ensures efficient power consumption, contributing to energy savings and longer battery life.
The high maximum operating temperature allows the product to withstand harsh environmental conditions, ensuring reliability in various applications.
The low minimum operating temperature makes the product suitable for use in cold environments without compromising performance.
The use of tin, silver, and copper terminal finish ensures good electrical conductivity and resistance to corrosion, enhancing the product's reliability.
The bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.
The low maximum seated height contributes to a slim profile, making the product suitable for compact devices and applications.
The compact width of the product enables space-efficient PCB layout designs, optimizing system integration and overall board real estate usage.
With a wide external data bus width of 32, this product supports high-speed data transfer, enhancing system performance and responsiveness.
The high maximum clock frequency allows for fast data processing speed, making the product suitable for applications that demand real-time performance.
The specified time at peak reflow temperature ensures proper solder reflow process, preventing component damage and ensuring reliable connections.
With a high peak reflow temperature, the product can withstand the reflow soldering process, guaranteeing robust solder joints for stable operation.
The compact length of the product complements its square shape, contributing to a space-efficient design suitable for miniaturized applications.
Designed for industrial use, this product meets stringent environmental and reliability standards, ensuring robust performance in demanding conditions.
Equipped with a microprocessor circuit, this product offers advanced processing capabilities and versatile peripheral functionalities, making it suitable for complex applications.
Utilizing CMOS technology, this product ensures low power consumption and high noise immunity, enhancing energy efficiency and system reliability.
The ball terminal form facilitates easy soldering and reliable connections, making the product suitable for automated assembly processes.
The specified nominal supply voltage provides a stable operating voltage, ensuring consistent performance and compatibility with various power sources.
With support for I2C, SPI, UART, and USB bus protocols, this product offers versatile connectivity options, enabling seamless integration into diverse systems.
The small terminal pitch of 0.8 mm allows for high-density mounting, enabling compact PCB designs and efficient use of available space.
With an MSL of 3, the product exhibits moderate sensitivity to moisture, necessitating proper handling and storage to maintain component integrity.
With a speed of 456 rpm, this product offers rapid data processing and transfer capabilities, enhancing overall system performance and responsiveness.
Other Function uPs,uCs & Peripheral ICs OMAPL138EZWTA3R attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
Additional Features:
Bus Compatibility:
Maximum Clock Frequency:
External Data Bus Width:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
OMAPL138EZWTA3R Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - nfBGA 01/Jul/2016
PCN Assembly/Origin - Multiple Parts 28/Jul/2022
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
1N4148
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
Eic Semiconductor
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
Leshan Radio
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NXP Semiconductors
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
1N4148WT
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
STM32F405RGT6
STMicroelectronics
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AM6252ATCGGAALW
AM6252ATCGGAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. This IC is used in applications requiring high-speed processing and low power consumption.
EFR32MG21A010F512IM32-B
Silicon Labs
EFR32MG21A010F512IM32-B by Silicon Labs is a System on Chip with 32 terminals, operating temperature range of -40 to 125°C, and supply voltage from 1.71V to 3.8V. Ideal for automotive applications requiring a compact chip carrier package with very thin profile and matte tin finish for surface mount assembly.
LS1046AXE8Q1A
LS1046AXE8Q1A by NXP Semiconductors is a 780-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high performance in a compact form factor.
EFR32MG21A010F768IM32-B
EFR32MG21A010F768IM32-B by Silicon Labs is a surface mount system on chip (SoC) with 32 terminals. It operates at a voltage range of 1.71V to 3.8V and can withstand temperatures from -40°C to 125°C. This automotive-grade IC is suitable for various applications requiring low power consumption and compact size.
UCD3138A64PFC
UCD3138A64PFC by Texas Instruments is a 80-terminal IC with 3-3.6V supply voltage range, operating at -40 to 125°C. It features 2MHz clock frequency, 65536 ROM words, and 43 I/O lines. Ideal for automotive applications due to its thin profile and fine pitch package style.
XC7Z035-2FBG676I
Xilinx
The Xilinx XC7Z035-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.
ESP32-C3-MINI-1U-N4
Espressif Systems (Shanghai)
ESP32-C3-MINI-1U-N4 by Espressif Systems is a 53-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage ranging from 3V to 3.6V. Ideal for applications requiring compact microelectronic assemblies and surface mount compatibility.
CC3200MODR1M2AMOBT
CC3200MODR1M2AMOBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 4-Ch 12-Bit ADC Channels. It operates at -20 to 70 °C and supports I2C, SPI, UART Bus Compatibility. Ideal for IoT applications due to its compact CHIP CARRIER package and low power consumption at 3.6V max supply voltage.
ATWINC1500-MR210UB1961
Microchip Technology
ATWINC1500-MR210UB1961 by Microchip operates at 2.7-3.6V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit in a rectangular package style for industrial applications, featuring 28 terminals and surface mount capability.
453-00052C
Laird Technologies
SoC;
SCANSTA112SMX/NOPB
National Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;
ESP32-WROOM-32UE
ESP32-WROOM-32UE by Espressif Systems is a MICROPROCESSOR CIRCUIT with 38 terminals, operating at 3.3V, and industrial temperature grade. It is a CMOS technology chip suitable for IoT applications due to its low power consumption and compact size of 19.2mm x 18mm x 3.35mm.
MIMXRT1051CVL5A
The NXP Semiconductors MIMXRT1051CVL5A is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. With a grid array package style and 196 terminals, it's ideal for industrial applications requiring low profile and fine pitch components.
XC7Z030-2SBG485E
The Xilinx XC7Z030-2SBG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring 485 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
SCANSTA112VS/NOPB
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
STSPIN32F0TR
STSPIN32F0TR by STMicroelectronics is a 48-terminal, CMOS technology microprocessor circuit with a supply voltage range of 8V to 45V. It operates in automotive-grade temperatures from -40°C to 125°C and features a square package style suitable for surface mount applications.
FT245BL-REEL
FTDI
FT245BL-REEL by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V, operating temperature of 0-70°C, and peak reflow temp of 260°C. Ideal for microprocessor circuits, it features CMOS technology and Gull Wing terminal form in a low-profile flatpack package style.
XCZU4EV-3FBVB900E
Xilinx XCZU4EV-3FBVB900E is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.873-0.927 V. Ideal for applications requiring high-performance computing in compact form factors.
5CSXFC6D6F31C6N
Intel
AM5716AABCXEQ1
AM5716AABCXEQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. With 760 terminals in a GRID ARRAY package style, it has a supply voltage range of 1.11V to 1.2V for versatile usage.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
OMAPL138EZWTD4E
OMAPL138EZWTD4E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 90 °C, suitable for applications requiring high-speed processing and connectivity via I2C, SPI, UART, and USB interfaces.
OMAPL138EZWTD4
OMAPL138EZWTD4 by Texas Instruments is a low profile, fine pitch microprocessor circuit with 361 terminals. It operates at a max clock frequency of 50 MHz and has a data bus width of 32. This industrial-grade IC is suitable for applications requiring I2C, SPI, UART, and USB bus compatibility.
OMAPL138EZWTA3E
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;
OMAPL138EZWT3
OMAPL138EZWT3 by Texas Instruments is a low-profile, fine-pitch microprocessor circuit with 361 terminals. It operates at a max clock frequency of 50 MHz and has a data bus width of 32. This versatile IC is compatible with I2C, SPI, UART, and USB buses, making it suitable for various applications requiring high-speed processing.
OMAPL138EZWTA3
OMAPL138EZWT4
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;
OMAPL132EZWTA2R
OMAPL132EZWTA2R by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at 200 rpm speed and has a max supply voltage of 1.32 V. This low-profile, fine-pitch GRID ARRAY package is ideal for industrial applications requiring high performance in a compact form factor.
OMAPL138BZWTRB
OMAPL138CZWTA3RW
OMAPL138EZCE3
OMAP3515DCBB
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE;
OMAPL132BZWT2E
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE; Length: 16 mm;
OMAPL132BZWTA2
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
OMAPL132BZWTA2E
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
OMAP3503DCBCA
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE;
OMAP3515DCBBA
OMAPL132EZWT2
OMAPL132EZWTA2
OMAP3503DCBBA
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