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MIMX8MN5DVTJZAA

NXP Semiconductors

MIMX8MN5DVTJZAA by NXP Semiconductors

The NXP Semiconductors MIMX8MN5DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

Median Price

$24.705

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 78 parts In-Stock

1+ parts

$23.170

100+ parts

$17.500

1k+ parts

-

10k+ parts

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78

$23.170

$17.500

-

-

Newark

USA . 78 parts In-Stock

1+ parts

$24.510

100+ parts

$17.540

1k+ parts

$17.030

10k+ parts

-

78

$24.510

$17.540

$17.030

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Chip1Stop

Japan . 102 parts In-Stock

1+ parts

$24.900

100+ parts

$16.500

1k+ parts

$16.400

10k+ parts

-

102

$24.900

$16.500

$16.400

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Mouser Electronics

USA . 229 parts In-Stock

1+ parts

$25.310

100+ parts

$17.390

1k+ parts

$16.920

10k+ parts

-

229

$25.310

$17.390

$16.920

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DigiKey

USA . 152 parts In-Stock

1+ parts

$25.310

100+ parts

$19.070

1k+ parts

$16.929

10k+ parts

-

152

$25.310

$19.070

$16.929

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Element14

Singapore . 78 parts In-Stock

1+ parts

$31.461

100+ parts

$22.621

1k+ parts

-

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78

$31.461

$22.621

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Rochester

USA . 68,443 parts In-Stock

1+ parts

-

100+ parts

$14.470

1k+ parts

$12.950

10k+ parts

$12.180

68,443

-

$14.470

$12.950

$12.180

Verical

USA . 47,011 parts In-Stock

1+ parts

-

100+ parts

$18.087

1k+ parts

$16.188

10k+ parts

$15.225

47,011

-

$18.087

$16.188

$15.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,788 parts In-Stock

1+ parts

$15.266

100+ parts

-

1k+ parts

-

10k+ parts

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3,788

$15.266

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$24.324

100+ parts

-

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-

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300

$24.324

-

-

-

Maritex

Poland . 1,063 parts In-Stock

1+ parts

$29.262

100+ parts

$20.900

1k+ parts

$18.693

10k+ parts

-

1,063

$29.262

$20.900

$18.693

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Vyrian

USA . 4,457 parts In-Stock

1+ parts

-

100+ parts

-

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4,457

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-

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Chip Stock

USA . 3,300 parts In-Stock

1+ parts

-

100+ parts

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3,300

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-

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Anansix

USA . 1,186 parts In-Stock

1+ parts

-

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1,186

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Flip Electronics

USA . 707 parts In-Stock

1+ parts

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100+ parts

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707

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TME

Poland . 608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$19.122

10k+ parts

-

608

-

-

$19.122

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,154 parts In-Stock

1+ parts

$13.660

100+ parts

-

1k+ parts

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10k+ parts

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9,154

$13.660

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Semicontronic

India . 9,089 parts In-Stock

1+ parts

$13.660

100+ parts

$13.318

1k+ parts

$13.250

10k+ parts

-

9,089

$13.660

$13.318

$13.250

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Corphita

USA . 1,582 parts In-Stock

1+ parts

$14.463

100+ parts

-

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-

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1,582

$14.463

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Continental Prestige Electronics

USA . 3,013 parts In-Stock

1+ parts

$24.187

100+ parts

-

1k+ parts

-

10k+ parts

$23.703

3,013

$24.187

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-

$23.703

Advanced Electronics

New Zealand . 62 parts In-Stock

1+ parts

$46.991

100+ parts

$42.762

1k+ parts

$38.533

10k+ parts

-

62

$46.991

$42.762

$38.533

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Aztec Data Supply Inc.

USA . 2,061 parts In-Stock

1+ parts

$65.990

100+ parts

-

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2,061

$65.990

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Microchip USA

USA . 1,526 parts In-Stock

1+ parts

$75.739

100+ parts

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1,526

$75.739

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Corohmni

South Africa . 2,897 parts In-Stock

1+ parts

$76.707

100+ parts

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2,897

$76.707

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Futuretech Components

Singapore . 8,400 parts In-Stock

1+ parts

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8,400

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$23.838

1k+ parts

$23.108

10k+ parts

$22.621

2,000

-

$23.838

$23.108

$22.621

Argo Parts USA

USA . 1,260 parts In-Stock

1+ parts

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1,260

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UNI Independent Distributors

Spain . 1,245 parts In-Stock

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1,245

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Infinite Electronics LLP (Excess)

. 167 parts In-Stock

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167

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Overview

Unleash the power of innovation with the MIMX8MN5DVTJZAA by NXP Semiconductors. This cutting-edge product offers unmatched quality and reliability, backed by the trusted name of its manufacturer. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this device boasts superior performance and efficiency. Elevate your projects with the value, benefits, and advantages that only NXP Semiconductors can deliver. Experience the future of technology with the MIMX8MN5DVTJZAA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly during production, saving time and cost.

Maximum Supply Voltage: 1.05 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, offering flexibility in various applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space, maximizing component density for compact designs.

No. of Terminals: 486

The high number of terminals provides extensive connectivity options, making it suitable for complex system integration.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch design ensures excellent electrical performance and reliability.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement enables energy-efficient operation, reducing power consumption.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, enhancing its reliability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of environments, making it versatile for different applications.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides superior conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing signal integrity and reducing interference.

Maximum Seated Height: 1.25 mm

The low maximum seated height allows for a slim profile, ideal for space-constrained designs.

Width: 14 mm

The moderate width offers a balance between compact size and ease of handling during assembly.

Maximum Time At Peak Reflow Temperature: 40s

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and component reliability during manufacturing.

Peak Reflow Temperature: 260C

The high peak reflow temperature capability meets industry standards for lead-free soldering, ensuring quality assembly.

Length: 14 mm

The compact length allows for efficient use of PCB real estate, enabling high component density in small form factor devices.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single chip, simplifying system design and reducing component count.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and easy reworkability, ensuring hassle-free assembly and maintenance.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is ideal for compatibility with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

The tight terminal pitch allows for high-density mounting, enabling compact designs without compromising connectivity.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate moisture sensitivity, ensuring proper handling and storage requirements for reliable performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MN5DVTJZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B486

JESD-609 Code:

e2

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

486

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA486,27X27,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MN5DVTJZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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