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MIMXRT117FCVM8A

NXP Semiconductors

MIMXRT117FCVM8A by NXP Semiconductors

The NXP Semiconductors MIMXRT117FCVM8A is a low-profile, fine-pitch SoC with CMOS technology. It operates b/w -40°C to 105°C and has a supply voltage range of 1.1V to 1.15V. With 289 terminals in a grid array package, it's ideal for applications requiring high-performance microcontrollers in compact designs.

Median Price

$14.735

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 270 parts In-Stock

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$13.530

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$10.440

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270

$13.530

$10.440

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Arrow

USA . 757 parts In-Stock

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$14.070

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757

$14.070

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Verical

USA . 757 parts In-Stock

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$14.070

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757

$14.070

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Chip1Stop

Japan . 757 parts In-Stock

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$15.400

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757

$15.400

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Element14

Singapore . 265 parts In-Stock

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$21.950

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265

$21.950

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Newark

USA . 265 parts In-Stock

1+ parts

$22.580

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$15.440

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$14.700

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265

$22.580

$15.440

$14.700

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Mouser Electronics

USA . 444 parts In-Stock

1+ parts

$23.800

100+ parts

$15.320

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$14.680

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444

$23.800

$15.320

$14.680

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DigiKey

USA . 752 parts In-Stock

1+ parts

$24.780

100+ parts

$17.311

1k+ parts

$16.670

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752

$24.780

$17.311

$16.670

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Future Electronics

Canada . 760 parts In-Stock

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$11.600

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760

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$11.600

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Rochester

USA . 760 parts In-Stock

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-

100+ parts

$11.590

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$10.370

10k+ parts

$9.760

760

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$11.590

$10.370

$9.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,808 parts In-Stock

1+ parts

$12.236

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$12.236

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Nova Conductors

Japan . 650 parts In-Stock

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$17.965

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650

$17.965

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Flip Electronics

USA . 1,756 parts In-Stock

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Anansix

USA . 1,202 parts In-Stock

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IBS Electronics

USA . 760 parts In-Stock

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$16.269

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760

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$16.269

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Vyrian

USA . 356 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 525 parts In-Stock

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$10.950

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525

$10.950

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Semicontronic

India . 506 parts In-Stock

1+ parts

$10.950

100+ parts

$10.676

1k+ parts

$10.622

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506

$10.950

$10.676

$10.622

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Corphita

USA . 388 parts In-Stock

1+ parts

$11.592

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388

$11.592

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Continental Prestige Electronics

USA . 272 parts In-Stock

1+ parts

$25.070

100+ parts

$17.170

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272

$25.070

$17.170

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Aztec Data Supply Inc.

USA . 3,462 parts In-Stock

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$41.450

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$41.450

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Modulus Dynamics

Lithuania . 3,742 parts In-Stock

1+ parts

$45.568

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$45.568

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$45.568

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3,742

$45.568

$45.568

$45.568

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$46.212

100+ parts

$43.901

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$43.901

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500

$46.212

$43.901

$43.901

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Microchip USA

USA . 2,149 parts In-Stock

1+ parts

$60.630

100+ parts

$59.570

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$59.050

10k+ parts

$58.520

2,149

$60.630

$59.570

$59.050

$58.520

Corohmni

South Africa . 1,069 parts In-Stock

1+ parts

$81.611

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QUARKTWIN TECHNOLOGY LTD

USA . 24,946 parts In-Stock

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UNI Independent Distributors

Spain . 6,217 parts In-Stock

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Argo Parts USA

USA . 2,492 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$17.606

1k+ parts

$17.067

10k+ parts

$16.707

2,000

-

$17.606

$17.067

$16.707

Robosynatics

Brazil . 1,606 parts In-Stock

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1,606

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Lucentia Tech

USA . 1,606 parts In-Stock

1+ parts

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100+ parts

$82.579

1k+ parts

$80.893

10k+ parts

$80.893

1,606

-

$82.579

$80.893

$80.893

Overview

Unleash the power of innovation with the MIMXRT117FCVM8A by NXP Semiconductors. This cutting-edge peripheral IC boasts top-quality manufacturing and a wide range of applications in the tech industry. Experience seamless performance and unmatched reliability with this product, designed to exceed your expectations. Elevate your projects with the superior value and benefits that only NXP Semiconductors can deliver. Join the wave of technological advancement and choose the MIMXRT117FCVM8A for your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount technology makes the product easier to assemble and allows for a higher component density on the PCB, saving space.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15V allows for reliable operation without the risk of overloading the components.

Package Shape: SQUARE

The square shape of the package allows for easier handling and placement on the PCB, simplifying the manufacturing process.

No. of Terminals: 289

With a high number of terminals, this product offers a wide range of connections and functionality, making it suitable for complex applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch design of the package style allow for a compact and efficient layout on the PCB, optimizing space usage.

Minimum Supply Voltage: 1.1 V

The minimum supply voltage of 1.1V ensures that the product can operate efficiently even at low power levels, making it energy-efficient.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand extreme conditions and operate reliably in harsh environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product suitable for use in a wide range of climates and conditions.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to connect the product to the PCB and ensures a secure and stable connection.

Maximum Seated Height: 1.52 mm

The low maximum seated height of 1.52mm allows for a slim profile and compact design, making it ideal for applications with limited space.

Width: 14 mm

The width of 14mm provides a balance between compactness and ease of handling, making the product versatile and suitable for various applications.

Length: 14 mm

The length of 14mm further enhances the compact size of the product, making it suitable for applications where space is limited.

Peripheral IC Type: SoC

The System on a Chip (SoC) design integrates multiple functions into a single chip, reducing the overall complexity and cost of the product while improving efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form allows for easy soldering and reliable connections, ensuring a stable electrical connection between the product and the PCB.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this product offers a high density of connections, making it suitable for applications that require a large number of input/output interfaces.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMXRT117FCVM8A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMXRT117FCVM8A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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