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MCIMX6Y2CVM05ABR

NXP Semiconductors

MCIMX6Y2CVM05ABR by NXP Semiconductors

MCIMX6Y2CVM05ABR by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating at -40 to 105°C, it supports a voltage range of 1.275-1.5V and features tin silver copper terminal finish. Ideal for industrial applications requiring high-performance computing in compact spaces.

Median Price

$16.700

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 458 parts In-Stock

1+ parts

$16.700

100+ parts

$10.740

1k+ parts

$9.530

10k+ parts

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458

$16.700

$10.740

$9.530

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$11.133

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50

$11.133

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Digiode

USA . 432 parts In-Stock

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$15.067

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432

$15.067

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Vyrian

USA . 8,765 parts In-Stock

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Chip Stock

USA . 5,700 parts In-Stock

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5,700

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Anansix

USA . 2,543 parts In-Stock

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Flip Electronics

USA . 643 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1,017 parts In-Stock

1+ parts

$10.884

100+ parts

-

1k+ parts

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10k+ parts

$10.666

1,017

$10.884

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$10.666

Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$11.356

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$11.356

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$11.356

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59

$11.356

$11.356

$11.356

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AZTECH Wire

Italy . 248 parts In-Stock

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$11.571

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248

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Semicontronic

India . 669 parts In-Stock

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$13.480

100+ parts

$13.143

1k+ parts

$13.076

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669

$13.480

$13.143

$13.076

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Ampacity Inc.

Singapore . 586 parts In-Stock

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$13.480

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586

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Corphita

USA . 4,809 parts In-Stock

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$14.274

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Microchip USA

USA . 2,327 parts In-Stock

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$29.255

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2,327

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Aztec Data Supply Inc.

USA . 78 parts In-Stock

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$61.670

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78

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Corohmni

South Africa . 36 parts In-Stock

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$80.781

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36

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UNI Independent Distributors

Spain . 8,217 parts In-Stock

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Argo Parts USA

USA . 1,801 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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100+ parts

$10.910

1k+ parts

$10.576

10k+ parts

$10.354

100

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$10.910

$10.576

$10.354

Overview

Discover the cutting-edge MCIMX6Y2CVM05ABR by NXP Semiconductors, a top-tier manufacturer in the realm of Other Function uPs,uCs & Peripheral ICs. This innovative product boasts unparalleled quality, reliability, and performance, making it a game-changer in various industrial applications. With its advanced technology and robust design, this device ensures optimal functionality and seamless integration, providing customers with exceptional value, efficiency, and productivity. Upgrade your systems with the MCIMX6Y2CVM05ABR and experience a new level of innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product, making it easier to handle and transport.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto a printed circuit board, saving space and allowing for more compact designs.

Maximum Supply Voltage: 1.5 V

The high maximum supply voltage allows for versatile usage in various applications without the risk of damaging the product.

Package Shape: SQUARE

The square package shape helps in efficient placement on the PCB, maximizing space utilization and allowing for better thermal dissipation.

Minimum Supply Voltage: 1.275 V

The low minimum supply voltage ensures efficient power consumption, making it suitable for battery-operated devices and energy-efficient applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in industrial settings.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this product suitable for battery-powered devices and applications requiring reliable performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y2CVM05ABR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Y2CVM05ABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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