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MCIMX6Q6AVT10AD

NXP Semiconductors

MCIMX6Q6AVT10AD by NXP Semiconductors

MCIMX6Q6AVT10AD by NXP is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35-1.5 V. Ideal for automotive applications due to its fine pitch grid array package style and 624 terminals in a square shape design.

Median Price

$96.029

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

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Chip1Stop

Japan . 50 parts In-Stock

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$99.710

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Mouser Electronics

USA . 11 parts In-Stock

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$150.310

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$119.490

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Verical

USA . 120 parts In-Stock

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$92.348

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$89.764

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Rochester

USA . 6 parts In-Stock

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$91.770

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$82.110

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$77.280

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Distributors (In-Stock)

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Digiode

USA . 1,187 parts In-Stock

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$80.722

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Nova Conductors

Japan . 600 parts In-Stock

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K-1 Technologies

USA . 30,000 parts In-Stock

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South Electronics

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Cyclops Electronics Ltd

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Chip Stock

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Anansix

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Flip Electronics

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Sensible Micro Corp

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Vyrian

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Bristol Electronics

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ComSIT Distribution GmbH

Germany . 53 parts In-Stock

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Prism Electronics

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NexGen Digital

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

France . 4 parts In-Stock

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Goldney Electronics S.L.

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,628 parts In-Stock

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$23.080

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Semicontronic

India . 355 parts In-Stock

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$72.220

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$70.414

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$70.053

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$72.220

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Ampacity Inc.

Singapore . 128 parts In-Stock

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$72.220

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Corphita

USA . 4,351 parts In-Stock

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Corohmni

South Africa . 2,353 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$78.488

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Component Stockers USA

USA . 1,427 parts In-Stock

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$97.370

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$89.210

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Continental Prestige Electronics

USA . 1,031 parts In-Stock

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$108.780

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Microchip USA

USA . 300 parts In-Stock

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$112.420

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$110.470

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$110.470

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$110.470

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$110.470

Modulus Dynamics

Lithuania . 750 parts In-Stock

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$128.027

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$126.747

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S.R.D Solutions

India . 64,640 parts In-Stock

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Lixinc

USA . 8,081 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 5,192 parts In-Stock

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Kepictronics

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 2,751 parts In-Stock

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$36.694

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$35.945

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$35.945

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$35.945

Lucentia Tech

USA . 2,751 parts In-Stock

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$36.694

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$35.945

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$35.945

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Netroflash

USA . 2,000 parts In-Stock

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$113.033

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$109.573

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$107.266

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Epart123

USA . 1,200 parts In-Stock

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GreenTree Electronics

Israel . 1,200 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

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Formix International (Excess)

India . 34 parts In-Stock

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Overview

Discover the MCIMX6Q6AVT10AD by NXP Semiconductors, a top-quality System on Chip designed for automotive applications. With its cutting-edge CMOS technology and 624 terminals in a compact grid array package, this versatile chip offers unparalleled performance and reliability. From enhancing vehicle infotainment systems to powering advanced driver assistance features, this product provides endless possibilities for innovation in the automotive industry. Trust NXP Semiconductors to deliver exceptional value and benefits with the MCIMX6Q6AVT10AD, setting new standards in functionality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC components inside.

Surface Mount: YES

Allows for easy and reliable installation on PCBs.

Maximum Supply Voltage: 1.5 V

Suitable for low power applications and ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Optimal shape for efficient use of space on the PCB.

No. of Terminals: 624

Offers a high degree of connectivity for various functions and peripherals.

Package Style: GRID ARRAY, FINE PITCH

Enables high density packaging and efficient signal routing.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold environments.

Temperature Grade: AUTOMOTIVE

Designed to meet the stringent requirements for automotive applications.

Peripheral IC Type: SYSTEM ON CHIP

Combines multiple functions into a single integrated circuit, reducing the need for additional components.

Technology: CMOS

Provides low power consumption and high noise immunity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Q6AVT10AD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6Q6AVT10AD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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