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SLB9665TT20FW563XUMA3

Infineon Technologies

SLB9665TT20FW563XUMA3 by Infineon Technologies

Infineon's SLB9665TT20FW563XUMA3 is a cryptographic authenticator IC with 28 terminals, operating at -20 to 85 °C. It has a supply voltage range of 3-3.6 V and compact dimensions of 4.4mm x 9.7mm, suitable for secure applications requiring high data protection in small form factors.

Median Price

$4.440

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,810 parts In-Stock

1+ parts

$4.440

100+ parts

$2.820

1k+ parts

$2.330

10k+ parts

$1.980

4,810

$4.440

$2.820

$2.330

$1.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.397

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$2.397

-

-

-

Digiode

USA . 659 parts In-Stock

1+ parts

$3.980

100+ parts

-

1k+ parts

-

10k+ parts

-

659

$3.980

-

-

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Vyrian

USA . 12,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,746

-

-

-

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Chip Stock

USA . 6,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,270

-

-

-

-

Tesla II Electronics Inc.

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,000

-

-

-

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Sensible Micro Corp

USA . 636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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636

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Bristol Electronics

USA . 143 parts In-Stock

1+ parts

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143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,216 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

-

11,216

$1.430

-

-

-

Semicontronic

India . 11,221 parts In-Stock

1+ parts

$2.280

100+ parts

$2.223

1k+ parts

$2.212

10k+ parts

-

11,221

$2.280

$2.223

$2.212

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Argo Parts USA

USA . 1,045 parts In-Stock

1+ parts

$2.397

100+ parts

-

1k+ parts

-

10k+ parts

-

1,045

$2.397

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$2.397

100+ parts

-

1k+ parts

$2.277

10k+ parts

$2.229

500

$2.397

-

$2.277

$2.229

Corphita

USA . 193 parts In-Stock

1+ parts

$3.771

100+ parts

-

1k+ parts

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10k+ parts

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193

$3.771

-

-

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Aztec Data Supply Inc.

USA . 728 parts In-Stock

1+ parts

$16.640

100+ parts

-

1k+ parts

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10k+ parts

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728

$16.640

-

-

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Corohmni

South Africa . 757 parts In-Stock

1+ parts

$40.922

100+ parts

-

1k+ parts

-

10k+ parts

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757

$40.922

-

-

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Advanced Electronics

New Zealand . 61 parts In-Stock

1+ parts

$70.227

100+ parts

$66.716

1k+ parts

$66.716

10k+ parts

-

61

$70.227

$66.716

$66.716

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Modulus Dynamics

Lithuania . 3,121 parts In-Stock

1+ parts

$84.321

100+ parts

$80.948

1k+ parts

$77.575

10k+ parts

-

3,121

$84.321

$80.948

$77.575

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Continental Prestige Electronics

USA . 20,856 parts In-Stock

1+ parts

-

100+ parts

$2.120

1k+ parts

$1.520

10k+ parts

-

20,856

-

$2.120

$1.520

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

-

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Robosynatics

Brazil . 1,958 parts In-Stock

1+ parts

-

100+ parts

$80.790

1k+ parts

$79.141

10k+ parts

$79.141

1,958

-

$80.790

$79.141

$79.141

Lucentia Tech

USA . 1,958 parts In-Stock

1+ parts

-

100+ parts

$80.790

1k+ parts

$79.141

10k+ parts

$79.141

1,958

-

$80.790

$79.141

$79.141

Overview

Unleash the power of cutting-edge technology with the SLB9665TT20FW563XUMA3 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality and reliability. This cryptographic authenticator offers unparalleled security and performance, making it the perfect solution for a wide range of applications. Experience peace of mind knowing your data is protected with this advanced peripheral IC. Upgrade your systems today and stay ahead of the curve with the SLB9665TT20FW563XUMA3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the IC, ensuring reliable performance over time.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance of 3.6V offers flexibility in power sourcing and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular package shape facilitates efficient layout and placement on the circuit board, optimizing space utilization.

No. of Terminals: 28

A higher number of terminals allow for more connectivity options and enhanced functionality in the circuit design.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enables compact and space-saving designs, making it suitable for applications where size is a constraint.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage requirement of 3V, this IC is efficient in power consumption and can operate effectively in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance even in demanding thermal conditions.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and versatility in signal processing applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a standardized power input for consistent performance and compatibility with common power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9665TT20FW563XUMA3 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

SLB9665TT20FW563XUMA3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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