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SLB9645XQ12FW13333XUMA1

Infineon Technologies

SLB9645XQ12FW13333XUMA1 by Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

Median Price

$2.578

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,565 parts In-Stock

1+ parts

$2.782

100+ parts

$2.655

1k+ parts

$2.529

10k+ parts

$2.486

3,565

$2.782

$2.655

$2.529

$2.486

Chip1Stop

Japan . 3,565 parts In-Stock

1+ parts

$2.810

100+ parts

$2.655

1k+ parts

$2.529

10k+ parts

$2.486

3,565

$2.810

$2.655

$2.529

$2.486

Verical

USA . 3,446 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.375

10k+ parts

$2.225

3,446

-

-

$2.375

$2.225

Rochester

USA . 3,446 parts In-Stock

1+ parts

-

100+ parts

$2.120

1k+ parts

$1.900

10k+ parts

$1.780

3,446

-

$2.120

$1.900

$1.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 530 parts In-Stock

1+ parts

$2.643

100+ parts

-

1k+ parts

-

10k+ parts

-

530

$2.643

-

-

-

Vyrian

USA . 557 parts In-Stock

1+ parts

$2.655

100+ parts

-

1k+ parts

-

10k+ parts

-

557

$2.655

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 320 parts In-Stock

1+ parts

$2.504

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$2.504

-

-

-

Corohmni

South Africa . 1,851 parts In-Stock

1+ parts

$17.487

100+ parts

-

1k+ parts

-

10k+ parts

-

1,851

$17.487

-

-

-

Modulus Dynamics

Lithuania . 4,375 parts In-Stock

1+ parts

$56.865

100+ parts

$54.590

1k+ parts

$52.316

10k+ parts

-

4,375

$56.865

$54.590

$52.316

-

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9645XQ12FW13333XUMA1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

SLB9645XQ12FW13333XUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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