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SLB9670XQ20FW763XUMA2

Infineon Technologies

SLB9670XQ20FW763XUMA2 by Infineon Technologies

SLB9670XQ20FW763XUMA2 by Infineon: 32-terminal chip carrier IC with cryptographic authenticator technology. Operates b/w -40 to 85 °C, with supply voltage range of 1.65V to 1.95V. Ideal for secure authentication applications due to its compact square package and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Inventory MP

USA . 4,633 parts In-Stock

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Bristol Electronics

USA . 4,133 parts In-Stock

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Digiode

USA . 790 parts In-Stock

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Vyrian

USA . 488 parts In-Stock

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488

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Nova Conductors

Japan . 150 parts In-Stock

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ComSIT Distribution GmbH

Germany . 79 parts In-Stock

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AZTECH Wire

Italy . 302 parts In-Stock

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$10.512

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Corohmni

South Africa . 69 parts In-Stock

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$16.922

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Semicontronic

India . 1,542 parts In-Stock

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$20.000

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$19.500

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$19.400

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Ampacity Inc.

Singapore . 1,052 parts In-Stock

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$25.000

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$25.000

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Modulus Dynamics

Lithuania . 3,833 parts In-Stock

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$66.405

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$63.749

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$61.093

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Aztec Data Supply Inc.

USA . 3,813 parts In-Stock

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$74.310

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Perfect Parts

USA . 11,200 parts In-Stock

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Continental Prestige Electronics

USA . 6,539 parts In-Stock

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Argo Parts USA

USA . 4,870 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Corphita

USA . 176 parts In-Stock

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Overview

Elevate your security system with the SLB9670XQ20FW763XUMA2 by Infineon Technologies. This cutting-edge cryptographic authenticator offers top-notch quality and reliability, backed by the reputable manufacturer Infineon Technologies. With a wide range of applications in various industries, this product guarantees enhanced protection and efficiency for your devices. Say goodbye to worries about security breaches and welcome a seamless user experience with the SLB9670XQ20FW763XUMA2. Choose value, choose quality, choose peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation and integration into circuit boards.

Maximum Supply Voltage: 1.95 V

Ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Optimizes space utilization and fits well in compact electronic devices.

No. of Terminals: 32

Offers a sufficient number of connection points for various input and output functions.

Package Style (Meter): CHIP CARRIER

Enhances thermal performance and electrical conductivity.

Minimum Supply Voltage: 1.65 V

Allows for operation in low-power environments and extends battery life.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature conditions.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold environments and still operate effectively.

Terminal Position: QUAD

Facilitates easy connections and ensures secure contact with external devices.

Maximum Seated Height: 0.9 mm

Low profile design allows for compact device assembly.

Width: 5 mm

Compact width enables easy integration into different electronic systems.

Length: 5 mm

Optimal length for fitting into various electronic setups.

Peripheral IC Type: CRYPTOGRAPHIC AUTHENTICATOR

Provides advanced security features for data protection and secure communication.

Technology: CMOS

Offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

Eliminates the risk of solder joint fatigue and ensures long-term reliability.

Nominal Supply Voltage: 1.8 V

Ideal voltage level for stable and efficient performance.

Terminal Pitch: 0.5 mm

Provides fine pitch spacing for compact design and high-density integration.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SLB9670XQ20FW763XUMA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

SLB9670XQ20FW763XUMA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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