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XC7Z030-1FBG484I

Xilinx

XC7Z030-1FBG484I by Xilinx

The Xilinx XC7Z030-1FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 484 terminals, it's ideal for applications requiring high-performance processing in compact spaces.

Median Price

$326.300

Lifecycle Status

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9

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DigiKey

USA . 18 parts In-Stock

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Digiode

USA . 293 parts In-Stock

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$309.956

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IBS Electronics

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VNN

France . 439 parts In-Stock

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$326.270

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Nova Conductors

Japan . 550 parts In-Stock

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Vyrian

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Chip Stock

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Touchstone Systems

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Resion

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Semicontronic

India . 414 parts In-Stock

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$2.000

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$1.950

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$1.940

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AZTECH Wire

Italy . 873 parts In-Stock

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$7.036

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One Stop Electronics

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Ampacity Inc.

Singapore . 446 parts In-Stock

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Advanced Electronics

New Zealand . 54 parts In-Stock

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Corohmni

South Africa . 589 parts In-Stock

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Modulus Dynamics

Lithuania . 1,885 parts In-Stock

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Aztec Data Supply Inc.

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Texas Native Microelectronics

USA . 940 parts In-Stock

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$137.736

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$130.331

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Kenton Components

USA . 514 parts In-Stock

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$177.724

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$170.615

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$165.283

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$156.397

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Vigor

Singapore . 445 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 6,059 parts In-Stock

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Microchip USA

USA . 1,870 parts In-Stock

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$332.830

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Qasali Group International

UK . 45 parts In-Stock

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Lixinc

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Argo Parts USA

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Authorized Procurement Solutions

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Supply Digital

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Overview

Revolutionize your electronics projects with the XC7Z030-1FBG484I by Xilinx. Known for their superior quality and cutting-edge technology, Xilinx delivers top-of-the-line products in the category of Other Function uPs, uCs & Peripheral ICs. This versatile system on chip offers unmatched value, benefits, and advantages to customers seeking high-performance solutions for their applications. Whether you're a seasoned professional or a DIY enthusiast, the XC7Z030-1FBG484I is sure to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the integrated circuit, making it resistant to external environmental factors.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing manufacturing costs and improving reliability.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage tolerance allows for flexibility in power supply design, accommodating various voltage levels.

Package Shape: SQUARE

Square package shape helps in optimal space utilization on the PCB, especially in compact electronic devices.

No. of Terminals: 484

Having a high number of terminals provides connectivity to a wide range of external components, enhancing the functionality of the product.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and electrical characteristics compared to traditional packages, ensuring reliable operation.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage requirement allows for efficient power consumption and extends the battery life of portable devices.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments or under heavy load conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function optimally in extreme cold conditions without any performance degradation.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering during assembly, ensuring a strong electrical connection.

Maximum Seated Height: 2.54 mm

Low seated height allows for compact device designs and efficient use of PCB space, especially in applications with height constraints.

Width: 23 mm

Optimal width dimension provides a good balance between space savings and ease of handling during PCB layout and integration.

Length: 23 mm

Ideal length dimension offers flexibility in PCB design and component placement, ensuring proper alignment and minimal interference.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple peripheral functions in a single chip simplifies system design, reduces component count, and enhances overall performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits, making it suitable for modern electronic devices.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections, enhanced thermal performance, and ease of rework during assembly or repairs.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation of the integrated circuit, preventing voltage fluctuations and performance issues.

Terminal Pitch: 1 mm

Fine terminal pitch allows for dense footprint integration on the PCB, supporting high pin count devices and compact electronic designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-1FBG484I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B484

Length:

23 mm

No. of Terminals:

484

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-1FBG484I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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