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XC7Z007S-1CLG400C

Xilinx

XC7Z007S-1CLG400C by Xilinx

The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.

Median Price

$71.690

Lifecycle Status

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Farnell

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DigiKey

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Element14

Singapore . 147 parts In-Stock

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Digiode

USA . 313 parts In-Stock

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Bristol Electronics

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VNN

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Nova Conductors

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J2 Sourcing AB

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Cyclops Electronics Ltd

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Next Level Components, LLC

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AZTECH Wire

Italy . 888 parts In-Stock

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$8.447

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Corohmni

South Africa . 262 parts In-Stock

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Modulus Dynamics

Lithuania . 90 parts In-Stock

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Aztec Data Supply Inc.

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Ampacity Inc.

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Semicontronic

India . 4 parts In-Stock

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Corphita

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iBuyXS LLC

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Vigor

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Continental Prestige Electronics

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Texas Native Microelectronics

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Benley Electronics

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Qasali Group International

UK . 678 parts In-Stock

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Supply Digital

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Lucentia Tech

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Netroflash

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Kenton Components

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Overview

Revolutionize your projects with the XC7Z007S-1CLG400C by Xilinx, a cutting-edge System on Chip that offers unparalleled performance and reliability. Manufactured by Xilinx, a trusted leader in semiconductor technology, this innovative product is perfect for a wide range of applications in the Other Function uPs, uCs & Peripheral ICs category. With a sleek square package style and a low profile design, this chip delivers maximum supply voltage of 1.05V and a minimum operating temperature of 0°C, ensuring optimal functionality and durability. Elevate your designs with the XC7Z007S-1CLG400C and experience the superior value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, ensuring a long lifespan.

Surface Mount: YES

Surface mount capability makes installation and integration of this product easier and more efficient.

Maximum Supply Voltage: 1.05 V

High maximum supply voltage allows for flexibility in power input, accommodating various system requirements.

Package Shape: SQUARE

Square shape of the package allows for efficient use of space, making it suitable for compact designs.

No. of Terminals: 400

Large number of terminals provides ample connectivity options, enabling complex functionality and versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design enhances signal integrity and reduces electromagnetic interference.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage helps in conserving power and increasing energy efficiency of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures product reliability and performance in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows the product to operate effectively in both low and high-temperature environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, simplifying the manufacturing process.

Maximum Seated Height: 1.6 mm

Low maximum seated height contributes to a compact overall product size and allows for integration in space-constrained applications.

Width: 17 mm

Compact width dimension enables the product to be used in small form factor designs while maximizing available space.

Length: 17 mm

Square shape and moderate length make the product suitable for applications requiring a balanced form factor.

Peripheral IC Type: SYSTEM ON CHIP

System on chip design integrates multiple functions into a single IC, reducing system complexity and enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form allows for reliable connections and facilitates easier soldering during manufacturing.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation of the product under varying load conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch provides high-density connectivity options, enabling more functionalities in a limited space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z007S-1CLG400C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

Length:

17 mm

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z007S-1CLG400C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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