Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.
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Plastic/Epoxy material provides durability and reliability for the product, ensuring a long lifespan.
Surface mount capability makes installation and integration of this product easier and more efficient.
High maximum supply voltage allows for flexibility in power input, accommodating various system requirements.
Square shape of the package allows for efficient use of space, making it suitable for compact designs.
Large number of terminals provides ample connectivity options, enabling complex functionality and versatility.
Grid array package style with low profile and fine pitch design enhances signal integrity and reduces electromagnetic interference.
Low minimum supply voltage helps in conserving power and increasing energy efficiency of the product.
High maximum operating temperature ensures product reliability and performance in demanding environmental conditions.
Wide operating temperature range allows the product to operate effectively in both low and high-temperature environments.
Bottom terminal position facilitates easy PCB layout and assembly, simplifying the manufacturing process.
Low maximum seated height contributes to a compact overall product size and allows for integration in space-constrained applications.
Compact width dimension enables the product to be used in small form factor designs while maximizing available space.
Square shape and moderate length make the product suitable for applications requiring a balanced form factor.
System on chip design integrates multiple functions into a single IC, reducing system complexity and enhancing overall performance.
CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.
Ball terminal form allows for reliable connections and facilitates easier soldering during manufacturing.
Stable nominal supply voltage ensures consistent and reliable operation of the product under varying load conditions.
Fine terminal pitch provides high-density connectivity options, enabling more functionalities in a limited space.
Other Function uPs,uCs & Peripheral ICs XC7Z007S-1CLG400C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XC7Z007S-1CLG400C Peripheral ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
NE555D
Texas Instruments
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
SN65HVD234DR
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
BAV99
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Solid State Devices
MICRODIODE ELECTRONICS SHENZHEN CO LTD
EFR32MG24A010F1536IM40-B
Silicon Labs
EFR32MG24A010F1536IM40-B by Silicon Labs is a SoC peripheral IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 125°C, with supply voltage ranging from 1.71V to 3.8V. Ideal for applications requiring low-profile and high-temperature performance like IoT devices and wearables.
MCP2221T-I/ST
MCP2221T-I/ST by Microchip: 3.3/5V supply, -40 to 85°C temp range, 14 terminals for industrial applications. CMOS technology with dual terminal position and matte tin finish. Ideal for microprocessor circuits in small outline package style.
CC1312R1F3RGZT
The Texas Instruments CC1312R1F3RGZT is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities. The package style is CHIP CARRIER with 48 terminals in a SQUARE shape, suitable for surface mount assembly in compact electronic devices.
SLB9665XQ20FW563XUMA2
Infineon Technologies
Infineon's SLB9665XQ20FW563XUMA2 is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for applications requiring secure authentication in compact spaces due to its very thin profile and square shape package design.
SCANSTA112VS
The Texas Instruments SCANSTA112VS is a 100-terminal microprocessor circuit IC with a supply voltage range of 3-3.6V, operating temperature from -40 to 85°C, and terminal pitch of 0.5mm. It is used in industrial applications requiring thin profile, fine pitch packages for surface mount assembly.
XCZU7EV-L1FFVC1156I
Xilinx
XCZU7EV-L1FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range of -40 to 100 °C and has a max supply voltage of 0.742 V. This GRID ARRAY package with 1156 terminals is ideal for applications requiring high-performance processing capabilities.
XC7Z012S-2CLG485E
The Xilinx XC7Z012S-2CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 485 terminals in a low profile grid array package, it's ideal for embedded applications requiring high processing power in compact form factors.
EFR32MG24B220F1536IM48-B
EFR32MG24B220F1536IM48-B by Silicon Labs is a SoC with CMOS technology. It operates b/w -40 to 125°C, with supply voltage range of 1.71V to 3.8V. With 48 terminals in a square package, it's ideal for IoT and wireless applications due to its low profile and high temperature tolerance.
MSP430F6779AIPZR
MSP430F6779AIPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, BOR, DMA(3), RTC, TIMER(4), WDT peripherals for industrial applications. Operating at up to 0.032768 MHz clock frequency, it offers I2C(2), IRDA(4), SPI(6), UART(4) connectivity options.
MCIMX6Q7CVT08AE
MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.
ESP32-S3-WROOM-1U-N16R8
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1U-N16R8 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 65 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size and surface mount capability.
OMAPL138EZWT3
OMAPL138EZWT3 by Texas Instruments is a low-profile, fine-pitch microprocessor circuit with 361 terminals. It operates at a max clock frequency of 50 MHz and has a data bus width of 32. This versatile IC is compatible with I2C, SPI, UART, and USB buses, making it suitable for various applications requiring high-speed processing.
XC7Z014S-1CLG400C
The Xilinx XC7Z014S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 400 terminals in a low profile grid array package, it's ideal for various embedded applications.
MIMXRT1064CVL5B
NXP Semiconductors' MIMXRT1064CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating from -40 to 105 °C, it supports a supply voltage range of 1.15-1.26 V for industrial applications requiring high performance and reliability.
MIMXRT1061CVJ5B
The NXP Semiconductors MIMXRT1061CVJ5B is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.15-1.26V. Ideal for applications requiring high-performance uPs/uCs in compact form factors.
TDA8035HN/C1,118
NXP Semiconductors' TDA8035HN/C1,118 is a 32-terminal IC with a supply voltage range of 2.7V to 5.5V and operates b/w -25°C to 85°C. This MICROPROCESSOR CIRCUIT has a max supply current of 220mA and is ideal for applications requiring low power consumption in compact designs. The chip carrier package style with very thin profile makes it suitable for space-constrained environments.
SCANSTA112VSX/NOPB
National Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
CC1310F64RHBT
CC1310F64RHBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 28672 RAM Bytes, operating at -40 to 85 °C. It features a CORTEX-M3 CPU Family, 32 terminals in a SQUARE package style, and supports supply voltages from 1.8V to 3.8V. Ideal for industrial applications requiring low power consumption and high performance in compact designs.
EFR32BG22C112F352GM32-C
SoC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2;
MCIMX515DJM8CR2
Freescale Semiconductor
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.15 V;
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XC7Z020-1CLG400I
The Xilinx XC7Z020-1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z010-1CLG400C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
XC7Z020-2CLG484I
The Xilinx XC7Z020-2CLG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it is ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z020-1CLG484C
XC7Z020-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05 V. This low profile, fine pitch chip in a grid array package is ideal for various applications requiring high performance and integration.
XC7Z030-1SBG485C
XC7Z030-1SBG485C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 485 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.
XC7Z020-1CLG484I
XC7Z020-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This low profile chip in grid array package is ideal for various applications requiring high performance and compact design.
XC7Z020-2CLG400I
XC7Z020-2CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low-profile, fine-pitch grid arrays in plastic/epoxy packages.
XC7Z010-1CLG400I
The Xilinx XC7Z010-1CLG400I is a System on Chip with 400 terminals, operating b/w -40 to 100 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance in a compact form factor. With a supply voltage range of 0.95V to 1.05V, it is ideal for projects demanding efficient power consumption and advanced processing capabilities.
XC7Z020-1CLG400C
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
XC7Z030-2FFG676I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
XC7Z020-L1CLG484I
XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.
XC7Z010-1CLG225I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
XC7Z010-2CLG400E
The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.
XC7Z010-2CLG400I
XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z030-1SBG485I
XC7Z030-1SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. With 485 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z020-3CLG400E
The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.
XC7Z010-L1CLG400I
XC7Z010-L1CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. It operates b/w -40°C to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile, fine-pitch IC is ideal for applications requiring high-performance computing in compact spaces.
XC7Z015-2CLG485I
Xilinx XC7Z015-2CLG485I is a CMOS System on Chip with 485 terminals in a low profile grid array package. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.
XC7Z020-L1CLG400I
SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;
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