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MIMXRT1064CVL5B

NXP Semiconductors

MIMXRT1064CVL5B by NXP Semiconductors

NXP Semiconductors' MIMXRT1064CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating from -40 to 105 °C, it supports a supply voltage range of 1.15-1.26 V for industrial applications requiring high performance and reliability.

Median Price

$15.965

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 222 parts In-Stock

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$11.100

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$9.720

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$9.690

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$11.100

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$9.690

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Verical

USA . 2,098 parts In-Stock

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$15.715

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DigiKey

USA . 3,869 parts In-Stock

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$15.890

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$11.737

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$10.009

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3,869

$15.890

$11.737

$10.009

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Mouser Electronics

USA . 2,275 parts In-Stock

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$15.890

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$10.410

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$10.000

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$15.890

$10.410

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Newark

USA . 92 parts In-Stock

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$16.040

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$10.510

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$10.090

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$16.040

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Arrow

USA . 743 parts In-Stock

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$16.617

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$10.888

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$10.369

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Farnell

UK . 200 parts In-Stock

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$20.954

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$13.858

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Element14

Singapore . 200 parts In-Stock

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$21.929

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$14.513

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Distributors (In-Stock)

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Digiode

USA . 1,415 parts In-Stock

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$9.139

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Nova Conductors

Japan . 87 parts In-Stock

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$15.116

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Bristol Electronics

USA . 50,000 parts In-Stock

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Chip Stock

USA . 9,000 parts In-Stock

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Vyrian

USA . 4,036 parts In-Stock

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Anansix

USA . 598 parts In-Stock

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Micros

Poland . 10 parts In-Stock

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$10.134

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Distributors (Availability)

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Corphita

USA . 3,181 parts In-Stock

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$8.658

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$8.658

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Semicontronic

India . 320 parts In-Stock

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$9.180

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$8.950

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$8.905

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320

$9.180

$8.950

$8.905

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Ampacity Inc.

Singapore . 940 parts In-Stock

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$9.200

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$9.200

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Continental Prestige Electronics

USA . 53 parts In-Stock

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$17.780

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$11.930

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$17.780

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Corohmni

South Africa . 121 parts In-Stock

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$18.202

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Aztec Data Supply Inc.

USA . 4,010 parts In-Stock

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$26.100

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Microchip USA

USA . 1,473 parts In-Stock

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$49.470

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$48.610

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$48.180

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$47.750

1,473

$49.470

$48.610

$48.180

$47.750

Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$86.421

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$82.100

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$82.100

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Glotronic Ltd.

UK . 12,332 parts In-Stock

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Lixinc

USA . 10,494 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 8,058 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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UNI Independent Distributors

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Infinite Electronics LLP (Excess)

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Epart123

USA . 2,400 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,920 parts In-Stock

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Argo Parts USA

USA . 1,717 parts In-Stock

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iodParts Technologies Inc.

India . 644 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Robosynatics

Brazil . 388 parts In-Stock

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Lucentia Tech

USA . 388 parts In-Stock

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$32.560

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$31.896

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$31.896

388

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$31.896

$31.896

Netroflash

USA . 100 parts In-Stock

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$14.813

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$14.360

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$14.058

100

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$14.813

$14.360

$14.058

Overview

Unleash the power of innovation with the MIMXRT1064CVL5B by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers unparalleled quality and reliability in the category of Other Function uPs,uCs & Peripheral ICs. This product is a game-changer, offering cutting-edge features and superior performance for a wide range of applications. Experience seamless integration, enhanced functionality, and unmatched efficiency with the MIMXRT1064CVL5B. Elevate your projects to new heights with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the product, making it suitable for a variety of industrial applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient mounting onto circuit boards, saving space and making the product more compact.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage specification ensures safe operation and protects the product from potential damage due to overvoltage.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board and facilitates easy alignment during assembly.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature makes the product suitable for use in various environments, including extreme cold conditions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during assembly, leading to a robust and long-lasting product.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single IC, reducing the need for external components and improving overall system efficiency.

Technology: CMOS

The use of CMOS technology allows for low power consumption, high speed operation, and compatibility with a wide range of devices, making the product versatile and energy-efficient.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMXRT1064CVL5B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B196

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.43 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMXRT1064CVL5B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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