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ATWINC1500-MR210PB1944

Microchip Technology

ATWINC1500-MR210PB1944 by Microchip Technology

ATWINC1500-MR210PB1944 by Microchip operates at 2.7-3.6V, with a temp range of -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.

Median Price

$7.160

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$7.160

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10

$7.160

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Vyrian

USA . 6,594 parts In-Stock

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VNN

France . 30 parts In-Stock

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Semicontronic

India . 1,134 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

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-

1,134

$3.000

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$2.910

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AZTECH Wire

Italy . 246 parts In-Stock

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$4.890

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Continental Prestige Electronics

USA . 2,618 parts In-Stock

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$7.160

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$7.017

2,618

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$7.017

Netroflash

USA . 500 parts In-Stock

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$7.160

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500

$7.160

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Corohmni

South Africa . 190 parts In-Stock

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$22.677

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190

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Ampacity Inc.

Singapore . 719 parts In-Stock

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$23.000

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719

$23.000

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$32.118

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$29.227

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$26.337

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$26.337

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Aztec Data Supply Inc.

USA . 4,149 parts In-Stock

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$64.978

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Argo Parts USA

USA . 4,825 parts In-Stock

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West Coast Incorporated

USA . 1,129 parts In-Stock

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Perfect Parts

USA . 417 parts In-Stock

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417

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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Overview

Elevate your projects with the cutting-edge ATWINC1500-MR210PB1944 by Microchip Technology. As a renowned manufacturer in the industry, Microchip guarantees top-notch quality and reliability. This product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for various applications. Experience seamless connectivity and enhanced performance with this surface mount device. Elevate your designs without compromising on efficiency. Unlock endless possibilities with the ATWINC1500-MR210PB1944 and stay ahead of the competition.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing versatility in different power supply scenarios.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and ensures compatibility with standard mounting configurations.

No. of Terminals: 28

A higher number of terminals allows for more connections and functionality in the circuit design.

Minimum Supply Voltage: 2.7 V

Can operate at lower supply voltages, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it reliable in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures, ensuring functionality in various climates.

Maximum Seated Height: 2.113 mm

Low profile design saves space and allows for compact system integration.

Width: 14.73 mm

Compact width dimension provides flexibility in placement on the circuit board.

Length: 21.72 mm

Optimal length for efficient circuit layout and space utilization.

Temperature Grade: INDUSTRIAL

Designed for industrial applications where temperature variations and rugged conditions are common.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced microprocessor circuitry for enhanced processing capabilities and functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: NO LEAD

No-lead terminals provide reliable electrical connections and simplify the assembly process.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance in various operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ATWINC1500-MR210PB1944 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XXMA-N28

Length:

21.72 mm

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.113 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14.73 mm

Peripheral IC Type:

Trade Compliance

ATWINC1500-MR210PB1944 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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