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XCZU4EV-2FBVB900E

Xilinx

XCZU4EV-2FBVB900E by Xilinx

XCZU4EV-2FBVB900E by Xilinx is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing in compact form factors.

Median Price

$2,306.250

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Nova Conductors

Japan . 500 parts In-Stock

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Vyrian

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One Stop Electronics

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Ampacity Inc.

Singapore . 3 parts In-Stock

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AZTECH Wire

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Semicontronic

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Aztec Data Supply Inc.

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MARBEL Systems

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Texas Native Microelectronics

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Corohmni

South Africa . 3,215 parts In-Stock

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Kenton Components

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Modulus Dynamics

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Continental Prestige Electronics

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Argo Parts USA

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Advanced Electronics

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Qasali Group International

UK . 3,664 parts In-Stock

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Supply Digital

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Overview

Looking for top-notch performance and reliability in your microprocessor circuit applications? Look no further than the XCZU4EV-2FBVB900E by Xilinx. With a reputation for quality and innovation, Xilinx delivers cutting-edge technology that exceeds expectations. Whether you're working on IoT devices, robotic systems, or industrial automation, this product offers unmatched value, benefits, and advantages to help you stay ahead of the competition. Upgrade to the XCZU4EV-2FBVB900E today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 0.876 V

High maximum supply voltage ensures stable operation and compatibility with various power sources.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB and easy alignment during assembly.

No. of Terminals: 900

Large number of terminals provide ample connectivity options for interfacing with other components in the system.

Minimum Operating Temperature: 0 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Maximum Seated Height: 2.88 mm

Low seated height allows for compact design and easy integration into tight spaces.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides advanced processing capabilities for complex functions and tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EV-2FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.88 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

31 mm

Peripheral IC Type:

Trade Compliance

XCZU4EV-2FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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