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XCZU4EV-2FBVB900I

Xilinx

XCZU4EV-2FBVB900I by Xilinx

XCZU4EV-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package. Suitable for industrial use, it requires a supply voltage of 0.825V to 0.876V and can withstand peak reflow temperature of 245C.

Median Price

$2,635.890

Lifecycle Status

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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One Stop Electronics

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AZTECH Wire

Italy . 295 parts In-Stock

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Ampacity Inc.

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Semicontronic

India . 612 parts In-Stock

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Aztec Data Supply Inc.

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Modulus Dynamics

Lithuania . 73 parts In-Stock

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Corohmni

South Africa . 623 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

UK . 500 parts In-Stock

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Microchip USA

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Argo Parts USA

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$2,635.590

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$2,609.234

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$2,582.878

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Continental Prestige Electronics

USA . 3,730 parts In-Stock

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Netroflash

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QUARKTWIN TECHNOLOGY LTD

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Overview

Elevate your projects to the next level with the XCZU4EV-2FBVB900I by Xilinx. With a reputation for top-quality products, Xilinx delivers cutting-edge solutions for a variety of applications in the Other Function uPs,uCs & Peripheral ICs category. This innovative microprocessor circuit boasts advanced technology and industrial-grade features, ensuring peak performance in extreme conditions. Experience the value and benefits of Xilinx's XCZU4EV-2FBVB900I as it empowers you to achieve your goals with ease and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of electronic circuits.

Maximum Supply Voltage: 0.876 V

Provides a high supply voltage capacity for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement in electronic designs.

No. of Terminals: 900

The extensive number of terminals enables connectivity with a wide range of components.

Package Style (Meter): GRID ARRAY

The grid array style provides a compact and organized layout for efficient PCB design.

Minimum Supply Voltage: 0.825 V

Even with a high maximum supply voltage, the product can operate at a low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Ability to function in extreme cold conditions expands the product's usability range.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The finish provides a reliable and durable terminal connection for enhanced performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier soldering and better stability in circuit assembly.

Maximum Time At Peak Reflow Temperature (s): 30

With a short maximum time at peak reflow temperature, the product ensures efficient soldering process.

Peak Reflow Temperature °C: 245

Capable of withstanding high reflow temperatures during assembly processes.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Features a microprocessor circuit design for advanced computing and control functions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: BALL

The ball terminal form enables reliable connections and facilitates efficient soldering processes.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage for consistent performance in various applications.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product can withstand exposure to moderate levels of moisture without damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EV-2FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4EV-2FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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