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MCIMX6U5DVM10AC

NXP Semiconductors

MCIMX6U5DVM10AC by NXP Semiconductors

MCIMX6U5DVM10AC by NXP Semiconductors is a System on Chip with 624 terminals, operating at 0-95°C. It features a low profile grid array package style, 0.8mm terminal pitch, and 1.35-1.5V supply voltage range. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$42.645

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,185 parts In-Stock

1+ parts

$39.490

100+ parts

$30.360

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2,185

$39.490

$30.360

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Verical

USA . 2,185 parts In-Stock

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$39.490

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$30.360

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2,185

$39.490

$30.360

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Chip1Stop

Japan . 60 parts In-Stock

1+ parts

$45.800

100+ parts

$31.500

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$28.000

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60

$45.800

$31.500

$28.000

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DigiKey

USA . 2,715 parts In-Stock

1+ parts

$58.360

100+ parts

$43.580

1k+ parts

$42.367

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2,715

$58.360

$43.580

$42.367

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Mouser Electronics

USA . 314 parts In-Stock

1+ parts

$62.590

100+ parts

$45.090

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314

$62.590

$45.090

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Flip Electronics (Authorized)

USA . 843 parts In-Stock

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EBV Elektronik

Germany . 720 parts In-Stock

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Avnet

USA . 480 parts In-Stock

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480

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Rochester

USA . 200 parts In-Stock

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$35.850

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$32.080

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$30.190

200

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$35.850

$32.080

$30.190

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,107 parts In-Stock

1+ parts

$28.272

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$28.272

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Nova Conductors

Japan . 100 parts In-Stock

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$39.670

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$39.670

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Chip Stock

USA . 5,100 parts In-Stock

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Anansix

USA . 2,758 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,722 parts In-Stock

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Component Sense

UK . 2,009 parts In-Stock

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Flip Electronics

USA . 723 parts In-Stock

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ComSIT Distribution GmbH

Germany . 450 parts In-Stock

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450

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Vyrian

USA . 333 parts In-Stock

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333

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ACDS - Activité Composants Distribution Service

France . 232 parts In-Stock

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Atlantic Semiconductor

USA . 102 parts In-Stock

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Bristol Electronics

USA . 88 parts In-Stock

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TME

Poland . 60 parts In-Stock

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$46.441

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60

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$46.441

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Dan-Mar Components

USA . 51 parts In-Stock

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51

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Semi Source

USA . 1 parts In-Stock

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1

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Prism Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 203 parts In-Stock

1+ parts

$23.870

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203

$23.870

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Semicontronic

India . 586 parts In-Stock

1+ parts

$25.300

100+ parts

$24.668

1k+ parts

$24.541

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586

$25.300

$24.668

$24.541

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Corphita

USA . 2,787 parts In-Stock

1+ parts

$26.784

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$26.784

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Aztec Data Supply Inc.

USA . 4,038 parts In-Stock

1+ parts

$37.180

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4,038

$37.180

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$38.877

100+ parts

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$37.322

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50

$38.877

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$37.322

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Continental Prestige Electronics

USA . 1,852 parts In-Stock

1+ parts

$39.670

100+ parts

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$38.877

1,852

$39.670

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$38.877

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$43.801

100+ parts

$41.611

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$41.611

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$43.801

$41.611

$41.611

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Corohmni

South Africa . 284 parts In-Stock

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$60.209

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$60.209

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Microchip USA

USA . 2,960 parts In-Stock

1+ parts

$118.800

100+ parts

$116.730

1k+ parts

$115.700

10k+ parts

$114.660

2,960

$118.800

$116.730

$115.700

$114.660

S.R.D Solutions

India . 15,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,083 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,768 parts In-Stock

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GreenTree Electronics

Israel . 5,100 parts In-Stock

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Perfect Parts

USA . 4,110 parts In-Stock

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Lixinc

USA . 3,619 parts In-Stock

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Kepictronics

USA . 1,600 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 673 parts In-Stock

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Futuretech Components

Singapore . 359 parts In-Stock

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359

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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350

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iodParts Technologies Inc.

India . 99 parts In-Stock

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ChipstoGo Electronic ltd

UK . 42 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 9 parts In-Stock

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Overview

Experience cutting-edge technology with the MCIMX6U5DVM10AC by NXP Semiconductors, a leader in semiconductor innovation. This high-quality System on Chip offers unparalleled performance and reliability, making it ideal for a wide range of applications. Whether you're looking to enhance your IoT devices or streamline your industrial processes, this product delivers value, efficiency, and peace of mind. Trust NXP Semiconductors to power your next project with the MCIMX6U5DVM10AC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the product.

Surface Mount: YES

Allows for easy and quick installation on circuit boards.

Maximum Supply Voltage: 1.5 V

Suitable for low power applications and helps in reducing energy consumption.

Package Shape: SQUARE

A compact shape that helps in efficient use of space on the circuit board.

No. of Terminals: 624

Provides a high level of connectivity for various functions and features.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Allows for dense packaging and high performance in a small form factor.

Minimum Supply Voltage: 1.35 V

Allows for operation at low voltages, saving energy and reducing heat dissipation.

Maximum Operating Temperature: 95 °C

Can operate reliably in high temperature environments.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for the terminals.

Terminal Position: BOTTOM

Facilitates easy connections to other components on the circuit board.

Maximum Seated Height: 1.6 mm

Low profile design for efficient use of space in compact electronic devices.

Width: 21 mm

Compact size for integration into various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Can withstand high temperature reflow processes during assembly.

Length: 21 mm

Compact size for integration into various electronic devices.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various functions onto a single chip for improved performance and efficiency.

Technology: CMOS

Low power technology suitable for battery-operated devices.

Terminal Form: BALL

Easy to handle and solder for efficient assembly.

Terminal Pitch: 0.8 mm

Fine pitch for high density packaging on circuit boards.

Moisture Sensitivity Level (MSL): 3

Can withstand exposure to moisture during assembly and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6U5DVM10AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6U5DVM10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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