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MCIMX6Q7CVT08AC

NXP Semiconductors

MCIMX6Q7CVT08AC by NXP Semiconductors

MCIMX6Q7CVT08AC by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.

Median Price

$100.240

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Arrow

USA . 60 parts In-Stock

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$82.510

100+ parts

$70.390

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60

$82.510

$70.390

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DigiKey

USA . 358 parts In-Stock

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$117.970

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$89.222

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358

$117.970

$89.222

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Mouser Electronics

USA . 253 parts In-Stock

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$125.250

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$99.560

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253

$125.250

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Flip Electronics (Authorized)

USA . 2,685 parts In-Stock

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Verical

USA . 300 parts In-Stock

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$66.338

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EBV Elektronik

Germany . 60 parts In-Stock

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Digiode

USA . 1,418 parts In-Stock

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$77.748

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$77.748

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Nova Conductors

Japan . 870 parts In-Stock

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$81.570

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$81.570

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Flip Electronics

USA . 820 parts In-Stock

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Anansix

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Vyrian

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338

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Chip Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,528 parts In-Stock

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$43.890

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2,528

$43.890

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$45.806

100+ parts

$43.516

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$43.516

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$45.806

$43.516

$43.516

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Semicontronic

India . 325 parts In-Stock

1+ parts

$69.730

100+ parts

$67.987

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$67.638

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325

$69.730

$67.987

$67.638

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Ampacity Inc.

Singapore . 59 parts In-Stock

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$69.730

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Corohmni

South Africa . 105 parts In-Stock

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$71.115

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Corphita

USA . 1,391 parts In-Stock

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$73.656

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Continental Prestige Electronics

USA . 4,761 parts In-Stock

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$81.570

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$79.939

4,761

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$79.939

Modulus Dynamics

Lithuania . 700 parts In-Stock

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$87.142

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$86.271

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$83.656

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700

$87.142

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$83.656

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Microchip USA

USA . 1,998 parts In-Stock

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$219.443

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Lixinc

USA . 14,609 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,329 parts In-Stock

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UNI Independent Distributors

Spain . 5,628 parts In-Stock

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Argo Parts USA

USA . 2,921 parts In-Stock

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Perfect Parts

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Netroflash

USA . 500 parts In-Stock

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$79.939

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$77.491

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$75.860

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$77.491

$75.860

Kepictronics

USA . 87 parts In-Stock

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Glotronic Ltd.

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Computer Components Inc. - USA

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Overview

Discover the innovative MCIMX6Q7CVT08AC by NXP Semiconductors, a cutting-edge product in the category of Other Function uPs,uCs & Peripheral ICs. Designed with precision and expertise, this high-quality component offers unparalleled value and benefits to customers. With a wide range of applications in industrial settings, this SoC technology delivers optimal performance and reliability, making it the perfect choice for your next project. Experience the advantage of NXP Semiconductors' superior products and elevate your designs to new heights with the MCIMX6Q7CVT08AC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.5 V

Operates efficiently within a safe voltage range, preventing damage to the IC and ensuring stability.

Package Shape: SQUARE

Square shape facilitates uniform and compact placement on circuit boards, optimizing space utilization.

No. of Terminals: 624

High number of terminals provide numerous connection points for interfacing with other components, enabling versatile functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design allows for high-density mounting of the IC on a PCB, enhancing overall performance and efficiency.

Minimum Supply Voltage: 1.275 V

Low minimum supply voltage requirement ensures flexibility in power source selection, contributing to energy efficiency.

Maximum Operating Temperature: 105 °C

Wide operating temperature range enables reliable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, ensuring consistent operation in diverse environmental settings.

Terminal Finish: TIN SILVER COPPER

Triple-layer terminal finish enhances conductivity and corrosion resistance, extending the lifespan of the IC.

Terminal Position: BOTTOM

Bottom terminal position simplifies soldering and PCB layout, enhancing the ease of assembly and maintenance.

Maximum Seated Height: 2.16 mm

Low-seated height contributes to a compact form factor, enabling integration into space-constrained applications.

Width: 21 mm

Optimal width dimension allows for efficient placement and alignment within PCB layout, ensuring compatibility with standard design practices.

Maximum Time at Peak Reflow Temperature (s): 40

Ability to withstand peak reflow temperatures for a specified duration without degradation ensures robust soldering capability during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables reliable and secure soldering connections, promoting long-term durability.

Length: 21 mm

Optimal length dimension complements the width and shape of the IC, facilitating seamless integration into PCB designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures operational reliability in harsh industrial environments, meeting stringent performance requirements.

Peripheral IC Type: SoC

System-on-Chip integration consolidates multiple functions into a single IC, reducing complexity and power consumption while improving overall system efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operation, and compatibility with a wide range of digital systems, enhancing overall performance.

Terminal Form: BALL

Ball terminal form simplifies soldering processes and enhances electrical connections, ensuring secure and reliable interfacing with external components.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage ensures consistent and efficient operation, supporting reliable performance in a variety of applications.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and precise alignment on the PCB, optimizing signal integrity and electrical connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates a moderate level of moisture sensitivity, requiring standard handling precautions during manufacturing and storage processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Q7CVT08AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Q7CVT08AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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