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MCIMX536AVV8C

NXP Semiconductors

MCIMX536AVV8C by NXP Semiconductors

MCIMX536AVV8C by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.05-1.8/3.3 V and is AEC-Q100 compliant for automotive applications. The package style is GRID ARRAY, FINE PITCH in PLASTIC/EPOXY material, suitable for surface mount assembly.

Median Price

$30.118

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$30.118

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72

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Digiode

USA . 4,649 parts In-Stock

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4,649

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Vyrian

USA . 726 parts In-Stock

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726

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Anansix

USA . 608 parts In-Stock

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608

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Semi Source

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 836 parts In-Stock

1+ parts

$7.178

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836

$7.178

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One Stop Electronics

USA . 2,623 parts In-Stock

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$20.000

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2,623

$20.000

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Semicontronic

India . 1,528 parts In-Stock

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$26.000

100+ parts

$25.350

1k+ parts

$25.220

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1,528

$26.000

$25.350

$25.220

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Ampacity Inc.

Singapore . 310 parts In-Stock

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$30.000

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310

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Continental Prestige Electronics

USA . 4,075 parts In-Stock

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$30.118

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$29.516

4,075

$30.118

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$29.516

Bastille Electronics

Australia . 900 parts In-Stock

1+ parts

$30.120

100+ parts

$28.614

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$26.807

900

$30.120

$28.614

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$26.807

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$30.721

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$30.721

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$30.721

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2,000

$30.721

$30.721

$30.721

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Aztec Data Supply Inc.

USA . 170 parts In-Stock

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$71.620

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170

$71.620

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Corohmni

South Africa . 49 parts In-Stock

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$79.677

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49

$79.677

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Microchip USA

USA . 2,434 parts In-Stock

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$235.238

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2,434

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A-Z Elektronik GmbH

Germany . 5,891 parts In-Stock

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UNI Independent Distributors

Spain . 5,767 parts In-Stock

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Corphita

USA . 3,186 parts In-Stock

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Argo Parts USA

USA . 469 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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Kepictronics

USA . 68 parts In-Stock

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Overview

Discover the cutting-edge technology of the MCIMX536AVV8C by NXP Semiconductors, a high-quality System on Chip designed for automotive applications. With a wide range of power supplies and impressive operating temperatures, this product offers unmatched reliability and performance. Whether you're looking to enhance your vehicle's functionality or streamline your automotive systems, the MCIMX536AVV8C provides the value, benefits, and advantages you need to stay ahead in today's fast-paced market. Unlock the potential of your projects with this innovative solution from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.15 V

Ensures safe operation without risking damage to the product due to overvoltage.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Package Shape: SQUARE

Provides a compact form factor for efficient use of space in the design of electronic systems.

Power Supplies (V): 1.1,1.3,1.8/3.3

Offers a range of power supply options to support various voltage requirements in different applications.

No. of Terminals: 529

Provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high density packaging and precise alignment during assembly, improving overall product performance.

Minimum Supply Voltage: 1.05 V

Ensures reliable operation even at low voltage levels, enhancing the product's versatility.

Maximum Operating Temperature: 125 °C

Supports operation in high temperature environments, essential for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Allows the product to function effectively in extreme cold conditions, expanding its usability.

Terminal Finish: TIN SILVER

Improves conductivity and corrosion resistance, enhancing the reliability and performance of the product.

Terminal Position: BOTTOM

Facilitates easy connection with other components on the circuit board, improving overall system integration.

Maximum Seated Height: 1.85 mm

Provides a low profile design for space-constrained applications while maintaining structural integrity.

Width: 19 mm

Offers a compact footprint for efficient use of space in electronic systems and devices.

Maximum Time At Peak Reflow Temperature (s): 40

Improves the manufacturing process by ensuring proper soldering and connection reliability during assembly.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes for secure and reliable connections.

Length: 19 mm

Contributes to the product's compact size and space-saving design for integration into various applications.

Temperature Grade: AUTOMOTIVE

Designed and tested to meet automotive industry standards for reliability and performance, suitable for automotive use.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip simplifies the design and reduces system complexity.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation, extending battery life in portable devices.

Terminal Form: BALL

Provides reliable and secure connections for interfacing with other components in the system.

Nominal Supply Voltage: 1.1 V

Standard operating voltage that ensures compatibility with a wide range of applications.

Terminal Pitch: 0.8 mm

Fine pitch spacing for precise connections and high-density integration in electronic systems.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes and standard handling requirements, ensuring product performance and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX536AVV8C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e2

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.3,1.8/3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.85 mm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX536AVV8C Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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