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MCIMX7D5EVM10SD

NXP Semiconductors

MCIMX7D5EVM10SD by NXP Semiconductors

MCIMX7D5EVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C and has a supply voltage range of 1.2V to 1.25V. With 541 terminals in a GRID ARRAY package, it's ideal for applications requiring low profile and fine pitch components.

Median Price

$36.075

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 84 parts In-Stock

1+ parts

$23.490

100+ parts

$22.370

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84

$23.490

$22.370

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Chip1Stop

Japan . 20 parts In-Stock

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$28.900

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20

$28.900

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Farnell

UK . 31 parts In-Stock

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$39.987

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$27.373

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$39.987

$27.373

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Element14

Singapore . 31 parts In-Stock

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$40.209

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$27.535

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$40.209

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DigiKey

USA . 1,370 parts In-Stock

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$42.960

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$31.140

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$29.870

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1,370

$42.960

$31.140

$29.870

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Mouser Electronics

USA . 1,332 parts In-Stock

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$42.960

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$30.290

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$29.860

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1,332

$42.960

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$29.860

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EBV Elektronik

Germany . 81,060 parts In-Stock

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Flip Electronics (Authorized)

USA . 8,232 parts In-Stock

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Avnet

USA . 1,596 parts In-Stock

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Verical

USA . 168 parts In-Stock

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$32.163

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$28.775

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$27.075

168

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$32.163

$28.775

$27.075

Rochester

USA . 168 parts In-Stock

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$25.730

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$23.020

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$21.660

168

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$25.730

$23.020

$21.660

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 870 parts In-Stock

1+ parts

$24.250

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$23.000

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870

$24.250

$23.000

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Digiode

USA . 2,761 parts In-Stock

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$27.455

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2,761

$27.455

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Nova Conductors

Japan . 500 parts In-Stock

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$30.050

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500

$30.050

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Vyrian

USA . 8,556 parts In-Stock

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8,556

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Flip Electronics

USA . 8,232 parts In-Stock

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Resion

USA . 2,000 parts In-Stock

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2,000

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Chip Stock

USA . 713 parts In-Stock

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713

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Anansix

USA . 647 parts In-Stock

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647

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Bristol Electronics

USA . 336 parts In-Stock

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336

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ComSIT Distribution GmbH

Germany . 212 parts In-Stock

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Sensible Micro Corp

USA . 67 parts In-Stock

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Cyclops Electronics Ltd

UK . 67 parts In-Stock

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Martec Srl

Italy . 6 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,215 parts In-Stock

1+ parts

$19.550

100+ parts

$19.061

1k+ parts

$18.964

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$19.550

$19.061

$18.964

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Ampacity Inc.

Singapore . 1,126 parts In-Stock

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$19.550

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Component Stockers USA

USA . 1,248 parts In-Stock

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$23.340

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$22.140

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$23.340

$22.140

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Corphita

USA . 4,490 parts In-Stock

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$26.010

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4,490

$26.010

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Bastille Electronics

Australia . 650 parts In-Stock

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$30.050

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$28.548

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$26.744

650

$30.050

$28.548

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$26.744

Aztec Data Supply Inc.

USA . 164 parts In-Stock

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$31.740

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$31.740

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Continental Prestige Electronics

USA . 84 parts In-Stock

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$32.360

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$32.360

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Modulus Dynamics

Lithuania . 693 parts In-Stock

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$34.290

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$34.290

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$34.290

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693

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Corohmni

South Africa . 83 parts In-Stock

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$34.290

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$51.361

100+ parts

$46.739

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$42.116

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$51.361

$46.739

$42.116

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Microchip USA

USA . 150 parts In-Stock

1+ parts

$576.000

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$576.000

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$576.000

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$576.000

150

$576.000

$576.000

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$576.000

Futuretech Components

Singapore . 20,000 parts In-Stock

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Lixinc

USA . 16,703 parts In-Stock

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S.R.D Solutions

India . 13,000 parts In-Stock

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Argo Parts USA

USA . 3,023 parts In-Stock

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Robosynatics

Brazil . 2,568 parts In-Stock

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2,568

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Lucentia Tech

USA . 2,568 parts In-Stock

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$33.604

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$32.918

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$32.918

2,568

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$32.918

$32.918

UNI Independent Distributors

Spain . 2,550 parts In-Stock

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Perfect Parts

USA . 2,446 parts In-Stock

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A-Z Elektronik GmbH

Germany . 230 parts In-Stock

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Overview

Unleash the power of innovation with the MCIMX7D5EVM10SD by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality products that push boundaries and exceed expectations. This versatile System on Chip is perfect for a wide range of applications, offering unparalleled value and performance. With cutting-edge technology and a user-friendly design, this product provides customers with the tools they need to take their projects to the next level. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage ensures safe operation of the product without the risk of damage from overvoltage.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, maximizing component density.

No. of Terminals: 541

A high number of terminals allows for more connectivity options and functionality within the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design, making it suitable for applications where space is limited.

Minimum Supply Voltage: 1.2 V

The low minimum supply voltage ensures energy efficiency and can help extend battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows for reliable operation even in cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier soldering and PCB mounting, enhancing the ease of assembly.

Maximum Seated Height: 1.42 mm

The low profile of the product ensures compatibility with space-constrained applications.

Width: 19 mm

The compact width makes the product suitable for applications where board space is limited.

Maximum Time At Peak Reflow Temperature (s): 40

The short reflow time minimizes the risk of thermal damage during the assembly process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable solder joints and ensures proper bonding during the assembly process.

Length: 19 mm

The compact length of the product makes it suitable for space-constrained applications.

Peripheral IC Type: SYSTEM ON CHIP

The integration of multiple functions into a single chip simplifies the design and reduces the overall footprint of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and inspection during the manufacturing process.

Nominal Supply Voltage: 1.225 V

The nominal supply voltage ensures stable and consistent performance of the product under varying operating conditions.

Terminal Pitch: 0.75 mm

The fine terminal pitch allows for high-density mounting and enables compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has a moderate level of moisture sensitivity, suitable for standard reflow soldering processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX7D5EVM10SD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B541

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

541

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA541,25X25,29

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.42 mm

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.225 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX7D5EVM10SD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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