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MCIMX6Y2DVM09AA

NXP Semiconductors

MCIMX6Y2DVM09AA by NXP Semiconductors

MCIMX6Y2DVM09AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.375-1.5 V. This IC has 289 terminals in a GRID ARRAY package, suitable for various uP and uC applications.

Median Price

$9.723

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Nova Conductors

Japan . 42 parts In-Stock

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Vyrian

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Digiode

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Semicontronic

India . 20 parts In-Stock

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$0.975

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$0.970

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Continental Prestige Electronics

USA . 102 parts In-Stock

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$9.723

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$9.529

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AZTECH Wire

Italy . 410 parts In-Stock

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$15.783

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Ampacity Inc.

Singapore . 20 parts In-Stock

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Microchip USA

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Aztec Data Supply Inc.

USA . 2,209 parts In-Stock

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Corohmni

South Africa . 3,183 parts In-Stock

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Overview

Discover the cutting-edge technology of the MCIMX6Y2DVM09AA by NXP Semiconductors, a high-quality system-on-chip that offers unmatched performance and reliability. Designed with precision and expertise, this product is perfect for a wide range of applications in the world of Other Function uPs, uCs, and Peripheral ICs. With its innovative design and advanced features, customers can expect seamless integration, superior functionality, and exceptional value. Upgrade your projects with the MCIMX6Y2DVM09AA and experience the next level of efficiency and performance.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and reliability for long-term use.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage:

1.5 V - Supports a wide range of applications and power requirements.

Package Shape:

SQUARE - Offers a compact design for space-saving solutions.

No. of Terminals:

289 - Provides ample connectivity options for various components.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - Ensures a secure and stable connection within the system.

Minimum Supply Voltage:

1.375 V - Allows for operation in low-power environments.

Maximum Operating Temperature:

95 °C - Ensures reliable performance even in high-temperature conditions.

Minimum Operating Temperature:

0 °C - Can function efficiently in cool environments.

Terminal Position:

BOTTOM - Facilitates easy integration within existing setups.

Maximum Seated Height:

1.32 mm - Contributes to a slim and sleek overall design.

Width:

14 mm - Accommodates placement in various types of equipment.

Maximum Time At Peak Reflow Temperature (s):

40 - Ensures the product's durability during reflow processes.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during manufacturing.

Length:

14 mm - Provides a balanced form factor for optimal performance.

Peripheral IC Type:

SYSTEM ON CHIP - Offers integrated functionality for efficient operation.

Technology:

CMOS - Utilizes advanced technology for enhanced processing capabilities.

Terminal Form:

BALL - Allows for secure connection and increased stability.

Terminal Pitch:

0.8 mm - Enables precise placement and alignment on circuit boards.

Moisture Sensitivity Level (MSL):

3 - Provides protection against moisture-related issues.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y2DVM09AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.375 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX6Y2DVM09AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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