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MCIMX6Y2CVM08AB

NXP Semiconductors

MCIMX6Y2CVM08AB by NXP Semiconductors

MCIMX6Y2CVM08AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.325V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$12.800

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,118 parts In-Stock

1+ parts

$10.282

100+ parts

$8.644

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2,118

$10.282

$8.644

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Farnell

UK . 664 parts In-Stock

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$11.450

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$7.960

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664

$11.450

$7.960

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Chip1Stop

Japan . 668 parts In-Stock

1+ parts

$12.800

100+ parts

$8.040

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668

$12.800

$8.040

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DigiKey

USA . 2,190 parts In-Stock

1+ parts

$16.470

100+ parts

$12.187

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$10.459

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2,190

$16.470

$12.187

$10.459

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Mouser Electronics

USA . 1,507 parts In-Stock

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$16.470

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$11.030

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$10.450

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1,507

$16.470

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$10.450

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Newark

USA . 492 parts In-Stock

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$16.620

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$11.520

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$10.820

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492

$16.620

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$10.820

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Element14

Singapore . 436 parts In-Stock

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$18.347

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$12.385

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EBV Elektronik

Germany . 71,136 parts In-Stock

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Avnet

USA . 33,440 parts In-Stock

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Verical

USA . 29,640 parts In-Stock

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$10.421

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Rochester

USA . 20 parts In-Stock

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$9.050

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$8.100

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$7.620

20

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$7.620

Distributors (In-Stock)

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Digiode

USA . 1,323 parts In-Stock

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$9.472

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TME

Poland . 738 parts In-Stock

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$12.150

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$12.150

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Nova Conductors

Japan . 59 parts In-Stock

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$12.890

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$12.890

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Bristol Electronics

USA . 87,000 parts In-Stock

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Chip Stock

USA . 33,500 parts In-Stock

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33,500

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IBS Electronics

USA . 12,464 parts In-Stock

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$12.637

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$12.693

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$12.637

$12.693

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Rebound Electronics

UK . 7,342 parts In-Stock

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North Shore Components

USA . 5,500 parts In-Stock

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5,500

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Cyclops Electronics Ltd

UK . 4,281 parts In-Stock

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Anansix

USA . 2,230 parts In-Stock

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NAC Semi

USA . 1,824 parts In-Stock

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$15.880

10k+ parts

$14.660

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$14.660

Vyrian

USA . 1,061 parts In-Stock

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Sensible Micro Corp

USA . 760 parts In-Stock

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Cogito LLC

Ukraine . 760 parts In-Stock

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Flip Electronics

USA . 523 parts In-Stock

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Component Sense

UK . 308 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,475 parts In-Stock

1+ parts

$7.700

100+ parts

$7.508

1k+ parts

$7.469

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1,475

$7.700

$7.508

$7.469

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Ampacity Inc.

Singapore . 1,233 parts In-Stock

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$7.700

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$7.700

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Corphita

USA . 3,573 parts In-Stock

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$8.973

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$8.973

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$12.632

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$12.127

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$12.632

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$12.127

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Corohmni

South Africa . 2,076 parts In-Stock

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$13.092

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2,076

$13.092

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Modulus Dynamics

Lithuania . 823 parts In-Stock

1+ parts

$13.092

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$13.092

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$13.092

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823

$13.092

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Continental Prestige Electronics

USA . 6 parts In-Stock

1+ parts

$14.980

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$9.980

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$14.980

$9.980

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Aztec Data Supply Inc.

USA . 844 parts In-Stock

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$25.600

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844

$25.600

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$25.766

100+ parts

$23.447

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$21.128

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500

$25.766

$23.447

$21.128

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Microchip USA

USA . 1,688 parts In-Stock

1+ parts

$51.380

100+ parts

$50.650

1k+ parts

$50.280

10k+ parts

$49.910

1,688

$51.380

$50.650

$50.280

$49.910

XScomponents

USA . 47,000 parts In-Stock

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$5.500

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$5.500

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Infinite Electronics LLP (Excess)

. 30,716 parts In-Stock

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GreenTree Electronics

Israel . 25,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 15,905 parts In-Stock

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Lixinc

USA . 11,532 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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S.R.D Solutions

India . 7,700 parts In-Stock

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Perfect Parts

USA . 5,046 parts In-Stock

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Argo Parts USA

USA . 4,469 parts In-Stock

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4,469

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Epart123

USA . 2,280 parts In-Stock

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$7.800

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$7.800

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Robosynatics

Brazil . 2,233 parts In-Stock

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Lucentia Tech

USA . 2,233 parts In-Stock

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$12.830

1k+ parts

$12.568

10k+ parts

$12.568

2,233

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$12.830

$12.568

$12.568

UNI Independent Distributors

Spain . 624 parts In-Stock

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624

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Overview

Unlock the power of innovation with the MCIMX6Y2CVM08AB by NXP Semiconductors. This cutting-edge product in the category of Other Function uPs,uCs & Peripheral ICs offers unmatched quality and reliability, thanks to its manufacturer's reputation for excellence. Ideal for a wide range of applications, this product provides customers with unrivaled value and benefits. Experience seamless performance and efficiency with the MCIMX6Y2CVM08AB, a game-changer in the world of semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards.

Maximum Supply Voltage: 1.5 V

Provides a safe operating range for the product's power supply.

Package Shape: SQUARE

Helps optimize space utilization on the circuit board.

No. of Terminals: 289

Provides ample connectivity options for various external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Facilitates a compact design and efficient signal transmission.

Minimum Supply Voltage: 1.325 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Suitable for a wide range of operating environments.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Simplifies the PCB layout and assembly process.

Maximum Seated Height: 1.32 mm

Contributes to the overall compactness of the product.

Width: 14 mm

Optimal width for efficient integration into circuit designs.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering during assembly process.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes.

Length: 14 mm

Designed for a balanced and compact form factor.

Peripheral IC Type: SoC

Integration of multiple functions on a single chip for efficiency.

Technology: CMOS

Offers low power consumption and high noise immunity.

Terminal Form: BALL

Facilitates easy and reliable connection to the PCB.

Terminal Pitch: 0.8 mm

Optimal pitch for efficient signal transmission.

Moisture Sensitivity Level (MSL): 3

Suitable for usage in environments with moderate moisture exposure.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y2CVM08AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Y2CVM08AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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