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AM5716AABCXQ1

Texas Instruments

AM5716AABCXQ1 by Texas Instruments

AM5716AABCXQ1 by Texas Instruments is a 760-terminal SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.11V to 1.2V, it features a fine pitch grid array package style for surface mount assembly.

Median Price

$64.381

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 267 parts In-Stock

1+ parts

$64.381

100+ parts

$57.227

1k+ parts

$42.079

10k+ parts

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267

$64.381

$57.227

$42.079

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 997 parts In-Stock

1+ parts

$61.162

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997

$61.162

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$65.862

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300

$65.862

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Vyrian

USA . 8,429 parts In-Stock

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8,429

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VNN

France . 1,280 parts In-Stock

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1,280

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Distributors (Availability)

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AZTECH Wire

Italy . 328 parts In-Stock

1+ parts

$14.289

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328

$14.289

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Parana Technologies

USA . 1,337 parts In-Stock

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$42.616

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1,337

$42.616

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DigiPath Technology Company

USA . 1,884 parts In-Stock

1+ parts

$46.925

100+ parts

$43.171

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1,884

$46.925

$43.171

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ChromeModa Solutions

Germany . 6,347 parts In-Stock

1+ parts

$47.883

100+ parts

$39.264

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6,347

$47.883

$39.264

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IDEA Electronic Components Group

UK . 71 parts In-Stock

1+ parts

$47.883

100+ parts

$45.489

1k+ parts

$43.095

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71

$47.883

$45.489

$43.095

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Ampacity Inc.

Singapore . 156 parts In-Stock

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$54.720

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156

$54.720

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Semicontronic

India . 100 parts In-Stock

1+ parts

$54.720

100+ parts

$53.352

1k+ parts

$53.078

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100

$54.720

$53.352

$53.078

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Corphita

USA . 4,870 parts In-Stock

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$57.943

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4,870

$57.943

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Continental Prestige Electronics

USA . 655 parts In-Stock

1+ parts

$65.862

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10k+ parts

$64.545

655

$65.862

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$64.545

Netroflash

USA . 500 parts In-Stock

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$65.862

100+ parts

$64.545

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500

$65.862

$64.545

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Corohmni

South Africa . 311 parts In-Stock

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$65.862

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311

$65.862

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Microchip USA

USA . 1,142 parts In-Stock

1+ parts

$132.550

100+ parts

$130.240

1k+ parts

$129.090

10k+ parts

$127.940

1,142

$132.550

$130.240

$129.090

$127.940

Argo Parts USA

USA . 3,978 parts In-Stock

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3,978

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Overview

Experience the cutting-edge technology of the Texas Instruments AM5716AABCXQ1, a top-of-the-line System on Chip designed for automotive applications. With a wide temperature range and high-quality construction, this product delivers unmatched performance and reliability. From advanced driver-assistance systems to in-vehicle infotainment, the possibilities are endless with this versatile device. Trust Texas Instruments to provide you with the best solutions for all your automotive electronics needs. Elevate your projects with the AM5716AABCXQ1 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for automotive applications where weight and durability are important factors.

Surface Mount: YES

The surface mount feature enables easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.2 V

The high maximum supply voltage allows for reliable operation even under peak load conditions, ensuring stability and performance.

Screening Level: AEC-Q100

This screening level indicates that the product has undergone stringent automotive qualification tests, ensuring high reliability and durability in automotive environments.

Package Shape: SQUARE

The square shape of the package offers efficient use of space on the circuit board, optimizing layout and potentially reducing overall system size.

No. of Terminals: 760

The high number of terminals allows for a greater number of connections, enabling complex functionalities and integration of multiple components in the system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style enables high density mounting, conserving space on the circuit board and enhancing reliability through close interconnection of components.

Minimum Supply Voltage: 1.11 V

The low minimum supply voltage supports energy efficiency and extends battery life in automotive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in harsh operating conditions, making the product suitable for automotive applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments, increasing its versatility and applicability in different conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier and more organized PCB layout, simplifying assembly and maintenance processes.

Maximum Seated Height: 2.96 mm

The low maximum seated height contributes to a compact overall system design, reducing space requirements and potentially lowering manufacturing costs.

Width: 23 mm

The moderate width of the product allows for efficient utilization of space on the PCB while still providing ample room for connections and components.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature minimizes the risk of heat-related damage to the product during assembly, ensuring high reliability and quality.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance indicates the product's robustness and ability to withstand high-temperature soldering processes without performance degradation.

Length: 23 mm

The moderate length of the product allows for a balanced footprint on the circuit board, enabling efficient use of space and maintaining good connectivity.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade signifies that the product is designed to meet the rigorous temperature requirements of automotive applications, ensuring reliability and performance in demanding environments.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions onto a single chip, reducing system complexity, improving efficiency, and potentially lowering overall system costs.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it suitable for diverse applications.

Terminal Form: BALL

The ball terminal form provides reliable contact points for stable connections, ensuring good signal transmission and overall system performance.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage specification ensures compatibility with standard voltage levels, making the product easy to integrate into existing systems or designs.

Terminal Pitch: 0.8 mm

The narrow terminal pitch enables high-density mounting, enhancing space efficiency and enabling compact system designs.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level indicates that the product can withstand moderate exposure to moisture during storage or handling, providing added reliability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5716AABCXQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5716AABCXQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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