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AM5718AABCX

Texas Instruments

AM5718AABCX by Texas Instruments

AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.

Median Price

$63.298

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 999 parts In-Stock

1+ parts

$45.986

100+ parts

$40.876

1k+ parts

$30.056

10k+ parts

-

999

$45.986

$40.876

$30.056

-

DigiKey

USA . 60 parts In-Stock

1+ parts

$80.610

100+ parts

$61.139

1k+ parts

$59.542

10k+ parts

-

60

$80.610

$61.139

$59.542

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$39.204

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$39.204

-

-

-

Digiode

USA . 1,965 parts In-Stock

1+ parts

$43.687

100+ parts

-

1k+ parts

-

10k+ parts

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1,965

$43.687

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-

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Vyrian

USA . 7,366 parts In-Stock

1+ parts

-

100+ parts

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7,366

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VNN

France . 5,282 parts In-Stock

1+ parts

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5,282

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,134 parts In-Stock

1+ parts

$33.731

100+ parts

-

1k+ parts

$132.286

10k+ parts

-

1,134

$33.731

-

$132.286

-

DigiPath Technology Company

USA . 2,164 parts In-Stock

1+ parts

$37.142

100+ parts

-

1k+ parts

-

10k+ parts

-

2,164

$37.142

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-

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ChromeModa Solutions

Germany . 2,062 parts In-Stock

1+ parts

$37.900

100+ parts

$31.078

1k+ parts

-

10k+ parts

-

2,062

$37.900

$31.078

-

-

IDEA Electronic Components Group

UK . 1,970 parts In-Stock

1+ parts

$37.900

100+ parts

$36.005

1k+ parts

$34.110

10k+ parts

-

1,970

$37.900

$36.005

$34.110

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Semicontronic

India . 283 parts In-Stock

1+ parts

$39.090

100+ parts

$38.113

1k+ parts

$37.917

10k+ parts

-

283

$39.090

$38.113

$37.917

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Ampacity Inc.

Singapore . 216 parts In-Stock

1+ parts

$39.090

100+ parts

-

1k+ parts

-

10k+ parts

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216

$39.090

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-

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Continental Prestige Electronics

USA . 4,656 parts In-Stock

1+ parts

$39.204

100+ parts

-

1k+ parts

-

10k+ parts

$38.420

4,656

$39.204

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-

$38.420

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$39.204

100+ parts

$38.420

1k+ parts

-

10k+ parts

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2,000

$39.204

$38.420

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Corphita

USA . 2,314 parts In-Stock

1+ parts

$41.387

100+ parts

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2,314

$41.387

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Lixinc

USA . 16,427 parts In-Stock

1+ parts

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100+ parts

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16,427

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,000

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Argo Parts USA

USA . 430 parts In-Stock

1+ parts

-

100+ parts

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430

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Overview

Experience unmatched quality and reliability with the AM5718AABCX by Texas Instruments, a leading manufacturer in the industry. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering a wide range of applications. With its cutting-edge technology and innovative features, this system on chip is designed to exceed your expectations. Trust in Texas Instruments to deliver top-notch performance and value, making your projects stand out among the rest. Elevate your designs with the AM5718AABCX and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology provides a compact and efficient design, saving space on the PCB.

Maximum Supply Voltage: 1.2 V

Low maximum supply voltage helps in reducing power consumption and heat generation.

Package Shape: SQUARE

Square packages are easier to handle and can be mounted more securely on the PCB.

No. of Terminals: 760

High number of terminals allow for greater connectivity options and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array style provides high density packaging for advanced applications.

Minimum Supply Voltage: 1.11 V

Low minimum supply voltage ensures stable operation even in low power conditions.

Maximum Operating Temperature: 90 °C

High maximum operating temperature allows for reliable performance in harsh environments.

Minimum Operating Temperature: 0 °C

Wide operating temperature range enables the product to function in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides good electrical conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to solder and mount the product on the PCB.

Maximum Seated Height: 2.96 mm

Low seated height allows for a slimmer profile and compact design of the product.

Width: 23 mm

Moderate width facilitates easy integration of the product into different electronic designs.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the risk of thermal damage to the product during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures proper soldering of the components for reliable connections.

Length: 23 mm

Compact length allows for efficient use of space on the PCB.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip simplifies the design and reduces overall system complexity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form enables reliable connections and easy soldering during manufacturing.

Nominal Supply Voltage: 1.15 V

Stable nominal supply voltage ensures consistent performance of the product under varying load conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high density mounting and improved signal integrity.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling.

Speed: 1500 rpm

High operating speed ensures efficient processing of data and instructions for smooth performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5718AABCX attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5718AABCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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