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AM5716AABCDA

Texas Instruments

AM5716AABCDA by Texas Instruments

The Texas Instruments AM5716AABCDA is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and reliability.

Median Price

$41.491

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,810 parts In-Stock

1+ parts

$42.223

100+ parts

$37.532

1k+ parts

$27.597

10k+ parts

-

1,810

$42.223

$37.532

$27.597

-

Avnet

USA . 1,260 parts In-Stock

1+ parts

-

100+ parts

$40.759

1k+ parts

$36.604

10k+ parts

-

1,260

-

$40.759

$36.604

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,574 parts In-Stock

1+ parts

$40.112

100+ parts

-

1k+ parts

-

10k+ parts

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3,574

$40.112

-

-

-

Vyrian

USA . 8,092 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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8,092

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 9 parts In-Stock

1+ parts

$10.810

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$10.810

-

-

-

Northwest PG Solutions

USA . 208 parts In-Stock

1+ parts

$11.891

100+ parts

$10.702

1k+ parts

-

10k+ parts

-

208

$11.891

$10.702

-

-

Parana Technologies

USA . 1,576 parts In-Stock

1+ parts

$36.122

100+ parts

-

1k+ parts

-

10k+ parts

-

1,576

$36.122

-

-

-

Corohmni

South Africa . 262 parts In-Stock

1+ parts

$36.771

100+ parts

-

1k+ parts

-

10k+ parts

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262

$36.771

-

-

-

Corphita

USA . 506 parts In-Stock

1+ parts

$38.001

100+ parts

-

1k+ parts

-

10k+ parts

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506

$38.001

-

-

-

DigiPath Technology Company

USA . 887 parts In-Stock

1+ parts

$39.774

100+ parts

$36.592

1k+ parts

-

10k+ parts

-

887

$39.774

$36.592

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-

ChromeModa Solutions

Germany . 2,455 parts In-Stock

1+ parts

$40.586

100+ parts

$33.281

1k+ parts

-

10k+ parts

-

2,455

$40.586

$33.281

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-

IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$40.586

100+ parts

$38.557

1k+ parts

$36.527

10k+ parts

-

2,322

$40.586

$38.557

$36.527

-

Advanced Electronics

New Zealand . 93 parts In-Stock

1+ parts

$62.855

100+ parts

$57.198

1k+ parts

$51.541

10k+ parts

-

93

$62.855

$57.198

$51.541

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QUARKTWIN TECHNOLOGY LTD

USA . 15,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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15,856

-

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GreenTree Electronics

Israel . 2,274 parts In-Stock

1+ parts

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2,274

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A-Z Elektronik GmbH

Germany . 240 parts In-Stock

1+ parts

-

100+ parts

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240

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Overview

Unleash the power of cutting-edge technology with the AM5716AABCDA by Texas Instruments. This high-quality product offers unparalleled performance and reliability, thanks to its innovative design and state-of-the-art manufacturing process. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this versatile chip delivers exceptional value and benefits to customers seeking advanced solutions for their projects. Experience the advantages of Texas Instruments' expertise and take your designs to the next level with the AM5716AABCDA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.2 V

Can operate at a relatively low supply voltage, making it energy efficient and suitable for low power applications.

Package Shape: SQUARE

Helps in optimizing space on the PCB and allows for efficient routing of traces and connections.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high density mounting on the PCB, making it suitable for compact designs and space-constrained applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, making it suitable for use in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable performance over time.

Width: 23 mm

Compact width size allows for efficient placement on the PCB and saves space in the overall design.

Maximum Time At Peak Reflow Temperature (s): 30

Indicates quick reflow process during manufacturing, reducing overall production time and cost.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various functions into a single chip simplifies the design, reduces component count, and improves overall system performance.

Technology: CMOS

Complementary metal-oxide semiconductor technology offers low power consumption and high noise immunity, suitable for various digital applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5716AABCDA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5716AABCDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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