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AM5716AABCX

Texas Instruments

AM5716AABCX by Texas Instruments

AM5716AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 90°C, with supply voltage ranging from 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

Median Price

$55.894

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 344 parts In-Stock

1+ parts

$43.478

100+ parts

$38.647

1k+ parts

$28.417

10k+ parts

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344

$43.478

$38.647

$28.417

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DigiKey

USA . 57 parts In-Stock

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$68.310

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57

$68.310

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Distributors (In-Stock)

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Digiode

USA . 2,308 parts In-Stock

1+ parts

$41.304

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2,308

$41.304

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Nova Conductors

Japan . 50 parts In-Stock

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$41.513

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50

$41.513

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Vyrian

USA . 5,134 parts In-Stock

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VNN

France . 3,420 parts In-Stock

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TME

Poland . 83 parts In-Stock

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$47.960

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Distributors (Availability)

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AZTECH Wire

Italy . 691 parts In-Stock

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$10.438

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691

$10.438

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Corohmni

South Africa . 139 parts In-Stock

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$29.347

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139

$29.347

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Semicontronic

India . 180 parts In-Stock

1+ parts

$36.960

100+ parts

$36.036

1k+ parts

$35.851

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180

$36.960

$36.036

$35.851

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Ampacity Inc.

Singapore . 99 parts In-Stock

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$36.960

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Corphita

USA . 2,895 parts In-Stock

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$39.130

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Continental Prestige Electronics

USA . 4,080 parts In-Stock

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$41.513

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$40.683

4,080

$41.513

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$40.683

Parana Technologies

USA . 1,124 parts In-Stock

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$50.844

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$50.844

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DigiPath Technology Company

USA . 1,347 parts In-Stock

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$55.985

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$51.507

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1,347

$55.985

$51.507

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ChromeModa Solutions

Germany . 5,062 parts In-Stock

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$57.128

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$46.845

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5,062

$57.128

$46.845

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IDEA Electronic Components Group

UK . 139 parts In-Stock

1+ parts

$57.128

100+ parts

$54.272

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$51.415

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139

$57.128

$54.272

$51.415

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Lixinc

USA . 17,906 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Argo Parts USA

USA . 619 parts In-Stock

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Infinite Electronics LLP (Excess)

. 375 parts In-Stock

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A-Z Elektronik GmbH

Germany . 240 parts In-Stock

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GreenTree Electronics

Israel . 101 parts In-Stock

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Perfect Parts

USA . 67 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the AM5716AABCX. This innovative System on Chip offers unrivaled performance in a compact package, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile IC delivers exceptional value with its advanced technology and precision engineering. Trust Texas Instruments for cutting-edge solutions that exceed expectations and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product rugged and easy to handle.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.2 V

Operating at a maximum supply voltage of 1.2V ensures energy efficiency and reduces the risk of damage from overvoltage.

Package Shape: SQUARE

Square package shape helps in optimizing space utilization on the circuit board, making it compact and efficient.

No. of Terminals: 760

Having a high number of terminals allows for more connections and functionalities, making the product versatile and capable of handling complex operations.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures that the product can function effectively in cold environments or extreme conditions.

Maximum Seated Height: 2.96 mm

Having a low seated height of 2.96mm enables the product to be compact and suitable for applications where space is limited.

Technology: CMOS

CMOS technology is known for low power consumption, high speed, and reliability, making it a suitable choice for efficient operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5716AABCX attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5716AABCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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