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AM5718AABCXEQ1

Texas Instruments

AM5718AABCXEQ1 by Texas Instruments

The Texas Instruments AM5718AABCXEQ1 is a SYSTEM ON CHIP with CMOS technology, operating at -40 to 125 °C. It features 760 terminals in a GRID ARRAY package style, suitable for automotive applications due to AEC-Q100 screening and low supply voltage of 1.11 V.

Median Price

$85.333

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 422 parts In-Stock

1+ parts

$67.516

100+ parts

$60.014

1k+ parts

$44.128

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422

$67.516

$60.014

$44.128

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Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$103.150

100+ parts

$78.710

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-

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1

$103.150

$78.710

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Distributors (In-Stock)

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$57.558

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870

$57.558

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Digiode

USA . 4,026 parts In-Stock

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$64.140

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4,026

$64.140

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Vyrian

USA . 4,978 parts In-Stock

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VNN

France . 2,348 parts In-Stock

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2,348

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Distributors (Availability)

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AZTECH Wire

Italy . 692 parts In-Stock

1+ parts

$14.813

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692

$14.813

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Semicontronic

India . 212 parts In-Stock

1+ parts

$57.390

100+ parts

$55.955

1k+ parts

$55.668

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212

$57.390

$55.955

$55.668

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Ampacity Inc.

Singapore . 154 parts In-Stock

1+ parts

$57.390

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154

$57.390

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Netroflash

USA . 2,000 parts In-Stock

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$57.558

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$56.407

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2,000

$57.558

$56.407

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Continental Prestige Electronics

USA . 1,781 parts In-Stock

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$57.558

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$56.407

1,781

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Corphita

USA . 1,310 parts In-Stock

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$60.764

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$60.764

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Parana Technologies

USA . 2,069 parts In-Stock

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$73.866

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2,069

$73.866

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DigiPath Technology Company

USA . 2,296 parts In-Stock

1+ parts

$81.335

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2,296

$81.335

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ChromeModa Solutions

Germany . 3,904 parts In-Stock

1+ parts

$82.995

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$68.056

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3,904

$82.995

$68.056

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IDEA Electronic Components Group

UK . 584 parts In-Stock

1+ parts

$82.995

100+ parts

$78.845

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$74.696

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584

$82.995

$78.845

$74.696

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Microchip USA

USA . 2,566 parts In-Stock

1+ parts

$139.000

100+ parts

$136.580

1k+ parts

$135.380

10k+ parts

$134.170

2,566

$139.000

$136.580

$135.380

$134.170

Argo Parts USA

USA . 2,580 parts In-Stock

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2,580

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Overview

Experience the innovation and reliability of Texas Instruments with the AM5718AABCXEQ1. This cutting-edge System on Chip is perfect for automotive applications, providing top-notch performance and efficiency. With a wide range of operating temperatures and exceptional quality, this product offers unmatched value to customers looking for high-quality uPs and uCs. Trust Texas Instruments to deliver the best in technology for all your automotive needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Allows for easier and more efficient installation on printed circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1.2 V

Operates efficiently with a low maximum supply voltage, ideal for power-saving applications.

Package Shape: SQUARE

Square packages are typically easier to handle and store, making the product more user-friendly.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold temperatures, making it suitable for a wide range of environments.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making it a preferred choice for many applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5718AABCXEQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5718AABCXEQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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