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AM5716AABCD

Texas Instruments

AM5716AABCD by Texas Instruments

AM5716AABCD by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, has a supply voltage range of 1.11-1.2V, and features a fine pitch grid array package style. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$41.806

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,658 parts In-Stock

1+ parts

$41.806

100+ parts

$37.161

1k+ parts

$27.324

10k+ parts

-

1,658

$41.806

$37.161

$27.324

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,964 parts In-Stock

1+ parts

$39.716

100+ parts

-

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2,964

$39.716

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Vyrian

USA . 2,813 parts In-Stock

1+ parts

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2,813

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Distributors (Availability)

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AZTECH Wire

Italy . 1,161 parts In-Stock

1+ parts

$8.020

100+ parts

-

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1,161

$8.020

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Corphita

USA . 1,645 parts In-Stock

1+ parts

$37.625

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1,645

$37.625

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Parana Technologies

USA . 1,691 parts In-Stock

1+ parts

$76.032

100+ parts

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1,691

$76.032

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DigiPath Technology Company

USA . 386 parts In-Stock

1+ parts

$83.720

100+ parts

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386

$83.720

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ChromeModa Solutions

Germany . 5,301 parts In-Stock

1+ parts

$85.429

100+ parts

$70.052

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5,301

$85.429

$70.052

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IDEA Electronic Components Group

UK . 999 parts In-Stock

1+ parts

$85.429

100+ parts

$81.158

1k+ parts

$76.886

10k+ parts

-

999

$85.429

$81.158

$76.886

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Component Stockers USA

USA . 1,473 parts In-Stock

1+ parts

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1,473

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Northwest PG Solutions

USA . 1,465 parts In-Stock

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1,465

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Native Components

USA . 430 parts In-Stock

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430

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Overview

Experience the unparalleled quality and innovation of Texas Instruments with the AM5716AABCD, a cutting-edge System on Chip peripheral IC. Offering a wide range of applications in the realm of Other Function uPs,uCs & Peripheral ICs, this product boasts a package style of GRID ARRAY, FINE PITCH with 760 terminals for seamless integration. With a nominal supply voltage of 1.15V and a maximum operating temperature of 90°C, the AM5716AABCD is designed to deliver top-notch performance and reliability. Trust Texas Instruments to provide you with the best solutions for your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and secure mounting on PCBs, saving space and improving efficiency in electronic designs.

Maximum Supply Voltage: 1.2 V

Operates at a maximum supply voltage of 1.2V, ensuring compatibility with low power applications.

Package Shape: SQUARE

Square package shape facilitates easy placement and alignment on the PCB, reducing assembly complexity.

No. of Terminals: 760

With 760 terminals, this IC offers a high degree of connectivity for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enables high density mounting, optimizing board space usage in compact electronic devices.

Minimum Supply Voltage: 1.11 V

Can operate at a low minimum supply voltage of 1.11V, making it energy efficient for battery-powered applications.

Maximum Operating Temperature: 90 °C

High maximum operating temperature tolerance of 90°C ensures reliability and stability under varying environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of operating at a minimum temperature of 0°C, making it suitable for a wide range of operating environments.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides excellent conductivity and corrosion resistance for reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and mounting on the PCB, enhancing ease of assembly.

Maximum Seated Height: 2.96 mm

Low maximum seated height of 2.96mm enables slim and compact device designs, ideal for space-constrained applications.

Width: 23 mm

Narrow width of 23mm facilitates efficient PCB layout, contributing to overall design optimization and space savings.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a maximum reflow time of 30 seconds at peak temperature, ensuring proper soldering and component integrity during assembly.

Peak Reflow Temperature °C: 250

Can withstand peak reflow temperature of 250°C, meeting industry standards for soldering and assembly processes.

Length: 23 mm

Compact length of 23mm contributes to a more streamlined and space-efficient PCB design.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip design integrates multiple functions into a single IC, reducing component count and simplifying system design.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital devices.

Terminal Form: BALL

Ball terminal form ensures reliable and secure electrical connections, suitable for applications requiring high-speed data transfer.

Nominal Supply Voltage: 1.15 V

Operating at a nominal supply voltage of 1.15V provides a balance between performance and power efficiency.

Terminal Pitch: 0.8 mm

Compact terminal pitch of 0.8mm allows for high-density mounting and miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling and storage practices to prevent damage during assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5716AABCD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5716AABCD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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