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XC7Z020-2CLG400E

Xilinx

XC7Z020-2CLG400E by Xilinx

The Xilinx XC7Z020-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact designs.

Median Price

$172.910

Lifecycle Status

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Digiode

USA . 255 parts In-Stock

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$164.264

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VNN

France . 879 parts In-Stock

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$172.910

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Nova Conductors

Japan . 57 parts In-Stock

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$174.610

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Chip Stock

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Vyrian

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Cyclops Electronics Ltd

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Bristol Electronics

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AZTECH Wire

Italy . 712 parts In-Stock

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$14.309

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$14.309

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Aztec Data Supply Inc.

USA . 3,983 parts In-Stock

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$21.260

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Corohmni

South Africa . 236 parts In-Stock

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$30.806

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Modulus Dynamics

Lithuania . 1,181 parts In-Stock

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$51.462

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$51.462

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Advanced Electronics

New Zealand . 898 parts In-Stock

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$121.852

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$115.759

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Vigor

Singapore . 374 parts In-Stock

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$133.900

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One Stop Electronics

USA . 70 parts In-Stock

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$146.970

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Ampacity Inc.

Singapore . 70 parts In-Stock

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$146.970

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Semicontronic

India . 70 parts In-Stock

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$146.970

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$143.296

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$142.561

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Texas Native Microelectronics

USA . 428 parts In-Stock

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$153.000

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$134.640

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Corphita

USA . 156 parts In-Stock

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$155.619

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Continental Prestige Electronics

USA . 5,354 parts In-Stock

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$167.035

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$163.694

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Microchip USA

USA . 4,106 parts In-Stock

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$181.550

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$181.550

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$181.550

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$181.550

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Kenton Components

USA . 40 parts In-Stock

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$183.600

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$176.256

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$170.748

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$161.568

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$161.568

Qasali Group International

UK . 2,992 parts In-Stock

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$413.100

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A-Z Elektronik GmbH

Germany . 5,246 parts In-Stock

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Lixinc

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Argo Parts USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Supply Digital

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S.R.D Solutions

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Netroflash

USA . 1,000 parts In-Stock

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$165.880

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Kepictronics

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MARBEL Systems

Belgium . 200 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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Lucentia Tech

USA . 30 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 25 parts In-Stock

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Overview

Discover the power of the XC7Z020-2CLG400E by Xilinx, a top-quality peripheral IC that offers unmatched performance and reliability. With Xilinx's reputation for excellence in technology innovation, this system on chip is perfect for a wide range of applications. Experience the seamless integration, efficiency, and versatility that this product brings, providing customers with value and benefits that exceed expectations. Upgrade your projects with the XC7Z020-2CLG400E and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers durability and resistance to external elements, ensuring the product's longevity and reliability.

Surface Mount: YES

Being surface mountable, this product facilitates easy and efficient PCB assembly, making it suitable for automated manufacturing processes.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power input, making the product versatile and capable of handling various power requirements.

Package Shape: SQUARE

The square package shape maximizes space utilization on the PCB, providing efficient use of board real estate and enabling compact designs.

No. of Terminals: 400

With a high number of terminals, this product offers extensive connectivity options, enabling the integration of multiple functionalities and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures high-density mounting, improved signal integrity, and enhanced thermal performance, making it suitable for advanced applications.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement allows for efficient power consumption while maintaining stable operation, ideal for energy-efficient applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance ensures reliable performance even in demanding environmental conditions, enhancing the product's durability and lifespan.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures enables the product to be used in a wide range of environments, enhancing its versatility and applicability.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of tin/silver/copper as terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring robust connections and long-term reliability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and improves thermal management, promoting efficient heat dissipation and enhancing overall performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables the product to be used in slim designs and compact electronic devices, offering flexibility in form factor and design.

Width: 17 mm

The compact width of the product enables space-efficient integration on the PCB, facilitating streamlined circuit layouts and enabling compact system designs.

Length: 17 mm

The compact length of the product contributes to space-saving on the PCB, allowing for efficient use of board space and enabling miniaturized electronic products.

Peripheral IC Type: SYSTEM ON CHIP

Being a system-on-chip peripheral IC type, this product integrates multiple functions and components into a single chip, simplifying system design, reducing component count, and improving overall system performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient, reliable, and suitable for a wide range of applications.

Terminal Form: BALL

The use of ball terminal form allows for reliable solder connections and efficient heat dissipation, ensuring stable operation and longevity of the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides a standard operating range for compatibility with various power sources, making the product versatile and widely applicable.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8 mm, this product enables high-density mounting, precise connections, and efficient signal routing, enhancing system performance and reliability.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this product requires additional handling precautions during assembly and storage to prevent moisture-related issues, ensuring product integrity and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z020-2CLG400E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z020-2CLG400E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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