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XC7Z020-L1CLG400I

Xilinx

XC7Z020-L1CLG400I by Xilinx

The Xilinx XC7Z020-L1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

Median Price

$180.680

Lifecycle Status

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6

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Digiode

USA . 214 parts In-Stock

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France . 580 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 483 parts In-Stock

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Modulus Dynamics

Lithuania . 1,063 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,697 parts In-Stock

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Corohmni

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Vigor

Singapore . 492 parts In-Stock

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Texas Native Microelectronics

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One Stop Electronics

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Semicontronic

India . 53 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Aranea Global

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Kenton Components

USA . 300 parts In-Stock

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Microchip USA

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Ampacity Inc.

Singapore . 53 parts In-Stock

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Lixinc

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Lucentia Tech

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MARBEL Systems

Belgium . 2,952 parts In-Stock

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Argo Parts USA

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Overview

Unlock limitless possibilities with the XC7Z020-L1CLG400I by Xilinx, a leading manufacturer in the field of Other Function uPs,uCs & Peripheral ICs. This cutting-edge product offers unparalleled quality and reliability, making it ideal for a wide range of applications. Experience seamless integration and superior performance with this innovative system on chip technology. Elevate your projects to new heights with the XC7Z020-L1CLG400I, where value meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the IC, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space in electronic devices.

Maximum Supply Voltage: 1.05 V

Higher maximum supply voltage allows for flexibility in power input, accommodating a wider range of power sources for the IC.

Package Shape: SQUARE

Square shape of the package helps in optimizing space utilization on the circuit board, enabling compact and efficient design.

No. of Terminals: 400

Large number of terminals provide a wide range of input and output options, enhancing the functionality and versatility of the IC.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design allows for high-density mounting and efficient heat dissipation, contributing to improved performance.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage enables efficient power consumption and operation at lower power levels, leading to energy savings and extended battery life in portable devices.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions, making the IC suitable for various applications in different industries.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows the IC to function effectively in extreme cold environments, ensuring consistent performance in all conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections to the circuit board, enhancing reliability and stability of the overall system.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables a compact and slim design of the IC, reducing the overall size of the electronic device and enhancing portability.

Width: 17 mm

Standard width dimension of 17mm allows for easy integration into various electronic devices, offering compatibility and adaptability for a wide range of applications.

Length: 17 mm

Standard length dimension of 17mm provides a balanced form factor for the IC, ensuring compatibility with industry-standard sizes and layouts on circuit boards.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip (SoC) architecture integrates multiple functions into a single IC, reducing the need for external components and simplifying the overall design of electronic systems.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high speed, and noise immunity, making the IC energy-efficient and reliable for long-term operation.

Terminal Form: BALL

Ball terminal form provides reliable connections with the circuit board, ensuring secure and stable electrical connections for optimal performance of the IC.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage of 1V ensures consistent and reliable operation of the IC, preventing fluctuations in power input that can impact performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting and precise connections on the circuit board, enhancing the overall efficiency and performance of the electronic device.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z020-L1CLG400I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B400

Length:

17 mm

No. of Terminals:

400

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XC7Z020-L1CLG400I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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