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AM6412BSCGHAALV

Texas Instruments

AM6412BSCGHAALV by Texas Instruments

AM6412BSCGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 0.715V to 0.79V. With 441 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance in compact spaces.

Median Price

$19.222

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,108 parts In-Stock

1+ parts

$14.605

100+ parts

$12.757

1k+ parts

$8.798

10k+ parts

-

9,108

$14.605

$12.757

$8.798

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DigiKey

USA . 61 parts In-Stock

1+ parts

$23.840

100+ parts

$16.802

1k+ parts

$15.674

10k+ parts

-

61

$23.840

$16.802

$15.674

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,321 parts In-Stock

1+ parts

$13.875

100+ parts

-

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-

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3,321

$13.875

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-

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$16.254

100+ parts

-

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700

$16.254

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-

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Chip Stock

USA . 14,300 parts In-Stock

1+ parts

-

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14,300

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Vyrian

USA . 5,680 parts In-Stock

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5,680

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Sensible Micro Corp

USA . 871 parts In-Stock

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871

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VNN

France . 800 parts In-Stock

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800

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Distributors (Availability)

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Semicontronic

India . 3,266 parts In-Stock

1+ parts

$12.410

100+ parts

$12.100

1k+ parts

$12.038

10k+ parts

-

3,266

$12.410

$12.100

$12.038

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Ampacity Inc.

Singapore . 3,133 parts In-Stock

1+ parts

$12.410

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-

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3,133

$12.410

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Corphita

USA . 1,275 parts In-Stock

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$13.144

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1,275

$13.144

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Continental Prestige Electronics

USA . 4,928 parts In-Stock

1+ parts

$16.254

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$15.929

4,928

$16.254

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-

$15.929

Microchip USA

USA . 2,009 parts In-Stock

1+ parts

$52.250

100+ parts

$51.500

1k+ parts

$51.130

10k+ parts

$50.760

2,009

$52.250

$51.500

$51.130

$50.760

Corohmni

South Africa . 172 parts In-Stock

1+ parts

$62.735

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172

$62.735

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Parana Technologies

USA . 1,882 parts In-Stock

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$70.520

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1,882

$70.520

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DigiPath Technology Company

USA . 108 parts In-Stock

1+ parts

$77.651

100+ parts

$71.439

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108

$77.651

$71.439

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ChromeModa Solutions

Germany . 4,291 parts In-Stock

1+ parts

$79.236

100+ parts

$64.974

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4,291

$79.236

$64.974

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IDEA Electronic Components Group

UK . 1,194 parts In-Stock

1+ parts

$79.236

100+ parts

$75.274

1k+ parts

$71.312

10k+ parts

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1,194

$79.236

$75.274

$71.312

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Argo Parts USA

USA . 4,633 parts In-Stock

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4,633

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

1+ parts

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$7.978

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$7.978

10k+ parts

$7.978

950

-

$7.978

$7.978

$7.978

Overview

Discover unparalleled performance and reliability with the AM6412BSCGHAALV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. The AM6412BSCGHAALV falls under the category of Other Function uPs,uCs & Peripheral ICs, offering versatile applications across various industries. Experience the value of superior technology with this innovative product, providing customers with unmatched benefits and advantages. Upgrade your systems with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the IC, making it suitable for various applications and environments.

Surface Mount: YES

Surface mount package allows for easy and convenient installation on PCBs, saving space and enabling efficient assembly.

Maximum Supply Voltage: 0.79 V

The maximum supply voltage of 0.79 V ensures safe operation and helps prevent overloading of the IC.

Package Shape: SQUARE

Square package shape facilitates easy placement and alignment during PCB design and assembly.

No. of Terminals: 441

Having 441 terminals allows for a high level of connectivity and functionality in the IC, making it versatile for complex applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enhances signal integrity and reliability, crucial for high-performance applications.

Minimum Supply Voltage: 0.715 V

The minimum supply voltage of 0.715 V ensures efficient power consumption and supports low power operation of the IC.

Maximum Operating Temperature: 105 °C

Operating at a maximum temperature of 105°C ensures reliability and stability under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C enables the IC to function in extreme cold environments without performance degradation.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, promoting efficient signal flow and ease of connection.

Maximum Seated Height: 2.652 mm

The low seated height of 2.652 mm allows for compact design and integration in space-constrained applications.

Width: 17.2 mm

The width of 17.2 mm provides a balance between space efficiency and proper spacing for handling and assembly.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C ensures proper soldering and reliability during assembly processes.

Length: 17.2 mm

The length of 17.2 mm complements the square shape of the package, optimizing the overall footprint on the PCB.

Peripheral IC Type: SYSTEM ON CHIP

Being a System on Chip (SoC) design integrates multiple functions into a single IC, reducing component count and improving system efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the overall performance of the IC.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and enables easy rework or replacement if needed.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V is a common voltage level in many systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm allows for fine pitch connections, enhancing signal integrity and enabling high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC is sensitive to moisture but can be handled with standard precautions, ensuring proper storage and handling procedures are followed.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6412BSCGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6412BSCGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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