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AM6411BSCGHAALV

Texas Instruments

AM6411BSCGHAALV by Texas Instruments

AM6411BSCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring high-performance computing in compact spaces.

Median Price

$22.150

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,371 parts In-Stock

1+ parts

$13.268

100+ parts

$11.590

1k+ parts

$7.993

10k+ parts

-

9,371

$13.268

$11.590

$7.993

-

DigiKey

USA . 108 parts In-Stock

1+ parts

$22.150

100+ parts

$15.514

1k+ parts

$14.451

10k+ parts

-

108

$22.150

$15.514

$14.451

-

Mouser Electronics

USA . 194 parts In-Stock

1+ parts

$23.230

100+ parts

$15.520

1k+ parts

$14.310

10k+ parts

-

194

$23.230

$15.520

$14.310

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$10.371

100+ parts

-

1k+ parts

-

10k+ parts

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88

$10.371

-

-

-

Digiode

USA . 2,530 parts In-Stock

1+ parts

$11.324

100+ parts

-

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-

10k+ parts

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2,530

$11.324

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-

-

Vyrian

USA . 2,901 parts In-Stock

1+ parts

-

100+ parts

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2,901

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-

-

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VNN

France . 1,384 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,384

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,176 parts In-Stock

1+ parts

$10.130

100+ parts

-

1k+ parts

-

10k+ parts

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3,176

$10.130

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-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$10.163

100+ parts

-

1k+ parts

$9.757

10k+ parts

-

100

$10.163

-

$9.757

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Continental Prestige Electronics

USA . 2,548 parts In-Stock

1+ parts

$10.371

100+ parts

-

1k+ parts

-

10k+ parts

$10.163

2,548

$10.371

-

-

$10.163

Corphita

USA . 618 parts In-Stock

1+ parts

$10.728

100+ parts

-

1k+ parts

-

10k+ parts

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618

$10.728

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-

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Microchip USA

USA . 2,975 parts In-Stock

1+ parts

$47.460

100+ parts

$46.780

1k+ parts

$46.440

10k+ parts

$46.100

2,975

$47.460

$46.780

$46.440

$46.100

Argo Parts USA

USA . 1,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,970

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Overview

Elevate your projects with the AM6411BSCGHAALV by Texas Instruments, a top-of-the-line peripheral IC that promises unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this innovative product is designed to meet the highest standards of performance. From cutting-edge technology to a wide range of applications, this versatile IC offers incredible value and benefits for customers looking to take their projects to the next level. Whether you're working on IoT devices, automotive systems, or industrial equipment, the AM6411BSCGHAALV is the perfect choice for all your needs. Trust Texas Instruments to deliver excellence in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Easy to install and integrate with other electronic components.

Maximum Supply Voltage: 0.79 V

Allows for efficient power usage and protection against overvoltage.

Package Shape: SQUARE

Optimal design for space-saving and efficient PCB layout.

No. of Terminals: 441

Provides ample connection points for various functions and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high density mounting and improves signal integrity.

Minimum Supply Voltage: 0.715 V

Allows for low power operation and efficiency.

Maximum Operating Temperature: 105 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide range of operating conditions.

Terminal Position: BOTTOM

Facilitates easy connection and integration with other components.

Maximum Seated Height: 2.652 mm

Allows for compact design and space-saving installation.

Width: 17.2 mm

Compact size for versatile mounting options.

Peak Reflow Temperature °C: 250

Can withstand high-temperature soldering processes.

Length: 17.2 mm

Compact size for versatile mounting options.

Peripheral IC Type: SYSTEM ON CHIP

Integration of various functions onto a single chip for efficiency and performance.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Provides reliable electrical connections and stability.

Nominal Supply Voltage: 0.75 V

Optimal voltage for efficient operation and performance.

Terminal Pitch: 0.8 mm

Allows for precise and reliable connections to other components.

Moisture Sensitivity Level (MSL): 3

Suitable for a wide range of environmental conditions and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6411BSCGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6411BSCGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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