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AM6421BSEGHAALV

Texas Instruments

AM6421BSEGHAALV by Texas Instruments

AM6421BSEGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It features 441 terminals in a GRID ARRAY, FINE PITCH package style. Operating b/w -40 to 105 °C, it has a supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-performance microcontrollers in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,580 parts In-Stock

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5,580

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Digiode

USA . 540 parts In-Stock

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540

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 477 parts In-Stock

1+ parts

$0.770

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477

$0.770

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Northwest PG Solutions

USA . 1,100 parts In-Stock

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$0.847

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1,100

$0.847

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Semicontronic

India . 266 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

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$6.790

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266

$7.000

$6.825

$6.790

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AZTECH Wire

Italy . 576 parts In-Stock

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$14.586

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576

$14.586

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One Stop Electronics

USA . 1,145 parts In-Stock

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$17.000

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1,145

$17.000

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Corphita

USA . 2,717 parts In-Stock

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Corohmni

South Africa . 153 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the AM6421BSEGHAALV by Texas Instruments. Crafted with precision and excellence, this innovative product in the category of Other Function uPs, uCs & Peripheral ICs offers unmatched performance and reliability. From its durable package body material to its advanced CMOS technology, this solution is designed to exceed expectations in a wide range of applications. Elevate your projects with the value, benefits, and advantages that only Texas Instruments can deliver. Experience the difference with the AM6421BSEGHAALV today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package durable and resistant to damage, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and cost in manufacturing.

Maximum Supply Voltage: 0.79 V

A high maximum supply voltage of 0.79V allows for flexibility in power supply options, accommodating a wide range of systems.

Package Shape: SQUARE

Square shape facilitates efficient use of space on the PCB, optimizing layout and allowing for compact designs.

No. of Terminals: 441

The high number of terminals provides ample connectivity options, enabling versatile integration with various peripherals and components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design offers high-density packaging, enabling more functionalities to be packed in a smaller footprint.

Minimum Supply Voltage: 0.715 V

Low minimum supply voltage of 0.715V ensures efficient power consumption and compatibility with low-power applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality in extreme cold environments, increasing the product's versatility.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to the PCB, enhancing stability and reliability of the product.

Maximum Seated Height: 2.652 mm

Low maximum seated height of 2.652mm enables slim and compact designs, saving space and allowing for versatile installation options.

Width: 17.2 mm

Compact width of 17.2mm contributes to space-efficient PCB layouts and overall smaller product dimensions.

Length: 17.2 mm

Uniform length of 17.2mm complements the square package shape, allowing for symmetrical and balanced designs.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip design integrates multiple functionalities in a single IC, reducing component count and simplifying system design.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of applications, ensuring efficient performance.

Terminal Form: BALL

Ball terminal form enables reliable connections and efficient heat dissipation, ensuring stable operation and longevity of the product.

Nominal Supply Voltage: 0.75 V

Stable nominal supply voltage of 0.75V ensures consistent and reliable operation across various load conditions and power sources.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting on the PCB, maximizing connectivity options and system integration.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6421BSEGHAALV attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

No. of Terminals:

441

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.652 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Trade Compliance

AM6421BSEGHAALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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