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AM4378BZDNA100

Texas Instruments

AM4378BZDNA100 by Texas Instruments

AM4378BZDNA100 by Texas Instruments is a System on Chip with 491 terminals, operating at -40 to 105°C. It features a low profile grid array package with 0.65mm terminal pitch. Ideal for industrial applications requiring CMOS technology and a supply voltage range of 1.272-1.378V.

Median Price

$24.270

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 1,368 parts In-Stock

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$15.323

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$13.620

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$10.015

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DigiKey

USA . 315 parts In-Stock

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$24.270

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$17.027

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$15.898

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Mouser Electronics

USA . 16 parts In-Stock

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$24.270

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$16.520

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$16.260

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$24.270

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Distributors (In-Stock)

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Digiode

USA . 469 parts In-Stock

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$14.557

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469

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Nova Conductors

Japan . 98 parts In-Stock

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$17.422

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Vyrian

USA . 9,296 parts In-Stock

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Chip Stock

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VNN

France . 945 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 524 parts In-Stock

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$13.020

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$13.020

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Semicontronic

India . 153 parts In-Stock

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$13.020

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$12.694

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$12.629

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$13.020

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$12.629

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Corphita

USA . 1,157 parts In-Stock

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$13.791

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Aranea Global

USA . 1,000 parts In-Stock

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$17.074

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$16.391

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Corohmni

South Africa . 240 parts In-Stock

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Continental Prestige Electronics

USA . 3,549 parts In-Stock

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Parana Technologies

USA . 2,058 parts In-Stock

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$30.482

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$69.121

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DigiPath Technology Company

USA . 403 parts In-Stock

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$33.565

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$30.880

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ChromeModa Solutions

Germany . 6,884 parts In-Stock

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IDEA Electronic Components Group

UK . 990 parts In-Stock

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Argo Parts USA

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Kepictronics

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Lixinc

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Futuretech Components

Singapore . 450 parts In-Stock

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A-Z Elektronik GmbH

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S.R.D Solutions

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Overview

Unlock the power of advanced technology with the AM4378BZDNA100 by Texas Instruments. This cutting-edge product offers unmatched quality and reliability, backed by the reputable manufacturer's commitment to excellence. Ideal for a wide range of applications in the category of Other Function uPs,uCs & Peripheral ICs, this product boasts a host of benefits that provide exceptional value to customers. Experience top-notch performance, efficiency, and versatility with the AM4378BZDNA100 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, providing protection for the components inside the package.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.378 V

This high maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

The square shape helps with efficient use of space on the circuit board.

No. of Terminals: 491

Having a high number of terminals allows for connectivity with a wide range of other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This style of package allows for high density mounting, making it suitable for compact designs.

Minimum Supply Voltage: 1.272 V

The low minimum supply voltage helps with energy efficiency and can extend battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures makes this product suitable for a variety of applications.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance for reliable performance.

Terminal Position: BOTTOM

The bottom terminal position allows for easier soldering and connection to the circuit board.

Maximum Seated Height: 1.3 mm

The low seated height helps with overall compactness of the product and can be beneficial for slim designs.

Width: 17 mm

Having a standard width makes it compatible with common circuit board dimensions.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time helps to prevent damage to the components during the soldering process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering of the terminals for a secure connection.

Length: 17 mm

Having a standard length makes it compatible with common circuit board dimensions.

Temperature Grade: INDUSTRIAL

This indicates that the product can operate in industrial environments with potentially harsh conditions.

Peripheral IC Type: SYSTEM ON CHIP

A system on chip design integrates multiple functions into a single package, reducing the need for additional components.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: BALL

Ball terminals provide a reliable connection and are commonly used in surface mount technology.

Nominal Supply Voltage: 1.325 V

The nominal supply voltage is within a stable range for consistent performance.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high density mounting on the circuit board.

Moisture Sensitivity Level (MSL): 3

This level of moisture sensitivity indicates that proper precautions should be taken during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4378BZDNA100 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4378BZDNA100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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