Loading...

AM4372BZDN80

Texas Instruments

AM4372BZDN80 by Texas Instruments

AM4372BZDN80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-90°C, with supply voltage range of 1.21-1.326 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

Median Price

$15.312

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 455 parts In-Stock

1+ parts

$10.445

100+ parts

$9.123

1k+ parts

$6.292

10k+ parts

-

455

$10.445

$9.123

$6.292

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$20.180

100+ parts

$12.380

1k+ parts

$12.300

10k+ parts

-

5

$20.180

$12.380

$12.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,080 parts In-Stock

1+ parts

$9.923

100+ parts

-

1k+ parts

-

10k+ parts

-

1,080

$9.923

-

-

-

Vyrian

USA . 4,552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,552

-

-

-

-

Chip Stock

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,962 parts In-Stock

1+ parts

$9.400

100+ parts

-

1k+ parts

-

10k+ parts

-

4,962

$9.400

-

-

-

Parana Technologies

USA . 607 parts In-Stock

1+ parts

$32.194

100+ parts

-

1k+ parts

$100.718

10k+ parts

-

607

$32.194

-

$100.718

-

DigiPath Technology Company

USA . 1,894 parts In-Stock

1+ parts

$35.450

100+ parts

-

1k+ parts

-

10k+ parts

-

1,894

$35.450

-

-

-

ChromeModa Solutions

Germany . 3,355 parts In-Stock

1+ parts

$36.173

100+ parts

$29.662

1k+ parts

-

10k+ parts

-

3,355

$36.173

$29.662

-

-

IDEA Electronic Components Group

UK . 1,391 parts In-Stock

1+ parts

$36.173

100+ parts

$34.364

1k+ parts

$32.556

10k+ parts

-

1,391

$36.173

$34.364

$32.556

-

Native Components

USA . 379 parts In-Stock

1+ parts

$240.242

100+ parts

$235.437

1k+ parts

$233.034

10k+ parts

$230.632

379

$240.242

$235.437

$233.034

$230.632

Northwest PG Solutions

USA . 428 parts In-Stock

1+ parts

$264.266

100+ parts

-

1k+ parts

-

10k+ parts

-

428

$264.266

-

-

-

A-Z Elektronik GmbH

Germany . 6,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,093

-

-

-

-

Alle Elektronik GmbH

Germany . 4,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,062

-

-

-

-

Kepictronics

USA . 3,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,528

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Unlock the full potential of your electronic devices with the AM4372BZDN80 by Texas Instruments. This cutting-edge product from a trusted manufacturer boasts unparalleled quality and reliability, making it a top choice for a wide range of applications. With its advanced features and high-performance capabilities, this system on chip offers unmatched value and benefits to customers seeking top-of-the-line technology. Upgrade your projects with confidence and precision using the AM4372BZDN80.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external elements, making this product suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage capability provides flexibility in power supply options, allowing for compatibility with various voltage sources.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and space utilization, contributing to compact and efficient designs.

No. of Terminals: 491

With a high number of terminals, this product offers extensive connectivity options, enabling versatile integration with other system components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for high-density mounting and precise connections, enhancing overall performance and reliability.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with low voltage power sources, improving energy efficiency.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature tolerance makes this product suitable for demanding industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature support ensures reliable performance even in cold conditions, making this product suitable for a wide range of operating environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity, corrosion resistance, and solderability, ensuring robust electrical connections.

Terminal Position: BOTTOM

The bottom terminal position aids in efficient heat dissipation and soldering during assembly, enhancing overall reliability and performance.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for slim and compact designs, facilitating space-saving integration in various electronic devices.

Width: 17 mm

The compact width dimension allows for flexibility in PCB layout and space optimization, enabling versatile installation options in different system configurations.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and reflow processes during assembly, maintaining the integrity of connections and reliability of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures robust soldering and thermal performance, contributing to the overall reliability and longevity of the product.

Length: 17 mm

The compact length dimension aids in space-saving integration and efficient PCB layout, allowing for versatile installation options in various electronic applications.

Peripheral IC Type: SYSTEM ON CHIP

The integration of multiple functions into a single System on Chip (SoC) design enhances performance, reduces component count, and saves space, making this product a cost-effective and efficient choice.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and compatibility with a wide range of applications, making this product energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, ensuring stable electrical connections and enabling high-speed data transmission.

Nominal Supply Voltage: 1.26 V

The specified nominal supply voltage ensures proper and stable operation of the product within the recommended voltage range, contributing to overall reliability and performance.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm allows for high-density mounting and precise connections, enhancing overall reliability and performance of the product.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage practices to prevent damage and ensure the long-term reliability of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4372BZDN80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4372BZDN80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19