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AM4376BZDNA80

Texas Instruments

AM4376BZDNA80 by Texas Instruments

AM4376BZDNA80 by Texas Instruments is a System on Chip with CMOS technology. It operates b/w -40 to 105°C, has 491 terminals in a low profile grid array package. Ideal for industrial applications requiring high performance and reliability.

Median Price

$14.082

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,010 parts In-Stock

1+ parts

$14.082

100+ parts

$12.300

1k+ parts

$8.483

10k+ parts

-

1,010

$14.082

$12.300

$8.483

-

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$23.620

100+ parts

$15.100

1k+ parts

$14.320

10k+ parts

-

3

$23.620

$15.100

$14.320

-

Chip1Stop

Japan . 9,360 parts In-Stock

1+ parts

-

100+ parts

$13.451

1k+ parts

$11.752

10k+ parts

-

9,360

-

$13.451

$11.752

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,093 parts In-Stock

1+ parts

$13.378

100+ parts

-

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-

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1,093

$13.378

-

-

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$16.590

100+ parts

-

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650

$16.590

-

-

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Vyrian

USA . 4,567 parts In-Stock

1+ parts

-

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-

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4,567

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Chip Stock

USA . 395 parts In-Stock

1+ parts

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395

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VNN

France . 100 parts In-Stock

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100

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Rebound Electronics

UK . 90 parts In-Stock

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90

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Sensible Micro Corp

USA . 69 parts In-Stock

1+ parts

-

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69

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,286 parts In-Stock

1+ parts

$11.430

100+ parts

-

1k+ parts

-

10k+ parts

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3,286

$11.430

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-

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Corphita

USA . 4,546 parts In-Stock

1+ parts

$12.674

100+ parts

-

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4,546

$12.674

-

-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$16.590

100+ parts

$15.760

1k+ parts

-

10k+ parts

$14.765

450

$16.590

$15.760

-

$14.765

Continental Prestige Electronics

USA . 2,804 parts In-Stock

1+ parts

$16.590

100+ parts

-

1k+ parts

-

10k+ parts

$16.258

2,804

$16.590

-

-

$16.258

Parana Technologies

USA . 124 parts In-Stock

1+ parts

$59.281

100+ parts

-

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124

$59.281

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DigiPath Technology Company

USA . 2,154 parts In-Stock

1+ parts

$65.276

100+ parts

$60.054

1k+ parts

-

10k+ parts

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2,154

$65.276

$60.054

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ChromeModa Solutions

Germany . 1,393 parts In-Stock

1+ parts

$66.608

100+ parts

$54.619

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-

10k+ parts

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1,393

$66.608

$54.619

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IDEA Electronic Components Group

UK . 4 parts In-Stock

1+ parts

$66.608

100+ parts

$63.278

1k+ parts

$59.947

10k+ parts

-

4

$66.608

$63.278

$59.947

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Corohmni

South Africa . 236 parts In-Stock

1+ parts

$74.153

100+ parts

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236

$74.153

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Lixinc

USA . 10,752 parts In-Stock

1+ parts

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10,752

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 1,283 parts In-Stock

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1,283

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the AM4376BZDNA80, a cutting-edge System on Chip designed for a wide range of applications. With advanced technology and industrial-grade components, this product offers exceptional performance and durability. Whether you're looking to enhance your IoT devices, industrial automation systems, or consumer electronics, this versatile IC delivers superior value and functionality. Trust Texas Instruments for all your semiconductor needs and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for various applications.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into electronic circuit boards, saving space and enhancing design flexibility.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage allows for reliable performance and compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape offers uniformity and ease of handling during the assembly process.

No. of Terminals: 491

With a high number of terminals, this product can support complex functionalities and connections in electronic systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with low profile and fine pitch design ensures efficient heat dissipation and enhanced electrical performance.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage requirement helps in energy efficiency and stability under varying power conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function effectively in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy soldering and connection to PCBs, enhancing the overall ease of installation.

Maximum Seated Height: 1.3 mm

The low maximum seated height makes this product suitable for compact electronic devices and applications with space constraints.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM4376BZDNA80 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B491

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

491

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA491,25X25,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM4376BZDNA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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